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82V2108PX

Description
Framer, CMOS, PQFP128, PLASTIC, QFP-128
CategoryTelecom circuit   
File Size1MB,292 Pages
ManufacturerIDT (Integrated Device Technology)
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82V2108PX Overview

Framer, CMOS, PQFP128, PLASTIC, QFP-128

82V2108PX Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Parts packaging codeQFP
package instructionPLASTIC, QFP-128
Contacts128
Reach Compliance Codenot_compliant
ECCN codeEAR99
Is SamacsysN
JESD-30 codeR-PQFP-G128
JESD-609 codee0
length20 mm
Humidity sensitivity level3
Number of functions1
Number of terminals128
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeFQFP
Encapsulate equivalent codeQFP128,.67X.93,20
Package shapeRECTANGULAR
Package formFLATPACK, FINE PITCH
Peak Reflow Temperature (Celsius)225
power supply3.3 V
Certification statusNot Qualified
Maximum seat height3.4 mm
Nominal supply voltage3.3 V
surface mountYES
technologyCMOS
Telecom integrated circuit typesFRAMER
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperature20
width14 mm
Base Number Matches1
T1 / E1 / J1 Octal Framer
IDT82V2108
Version 5
November 26, 2012
2975 Stender Way, Santa Clara, Califormia 95054
Telephone: (800) 345-7015 • TWX: 910-338-2070 • FAX: (408) 492-8674
Printed in U.S.A.
© 2011 Integrated Device Technology, Inc.

82V2108PX Related Products

82V2108PX 82V2108BBG
Description Framer, CMOS, PQFP128, PLASTIC, QFP-128 Framer, CMOS, PBGA144, PLASTIC, BGA-144
Is it lead-free? Contains lead Lead free
Is it Rohs certified? incompatible conform to
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code QFP BGA
package instruction PLASTIC, QFP-128 PLASTIC, BGA-144
Contacts 128 144
Reach Compliance Code not_compliant compliant
ECCN code EAR99 EAR99
Is Samacsys N N
JESD-30 code R-PQFP-G128 S-PBGA-B144
JESD-609 code e0 e1
length 20 mm 13 mm
Humidity sensitivity level 3 3
Number of functions 1 1
Number of terminals 128 144
Maximum operating temperature 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code FQFP BGA
Encapsulate equivalent code QFP128,.67X.93,20 BGA144,12X12,40
Package shape RECTANGULAR SQUARE
Package form FLATPACK, FINE PITCH GRID ARRAY
Peak Reflow Temperature (Celsius) 225 260
power supply 3.3 V 3.3 V
Certification status Not Qualified Not Qualified
Maximum seat height 3.4 mm 1.97 mm
Nominal supply voltage 3.3 V 3.3 V
surface mount YES YES
technology CMOS CMOS
Telecom integrated circuit types FRAMER FRAMER
Temperature level INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) TIN SILVER COPPER
Terminal form GULL WING BALL
Terminal pitch 0.5 mm 1 mm
Terminal location QUAD BOTTOM
Maximum time at peak reflow temperature 20 30
width 14 mm 13 mm
Base Number Matches 1 1
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