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BD7185AGWL-E2

Description
Power Management Specialized - PMIC DDR2/DDR3 SPD EEPROM
Categorysemiconductor    Power management   
File Size2MB,78 Pages
ManufacturerROHM Semiconductor
Websitehttps://www.rohm.com/
Environmental Compliance
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BD7185AGWL-E2 Overview

Power Management Specialized - PMIC DDR2/DDR3 SPD EEPROM

BD7185AGWL-E2 Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
ManufacturerROHM Semiconductor
Product CategoryPower Management Specialized - PMIC
RoHSDetails
Minimum Operating Temperature- 35 C
Maximum Operating Temperature+ 85 C
Mounting StyleSMD/SMT
Package / CaseUCSP50L3C-80
TypeMobile Phone Power Management
PackagingCut Tape
PackagingMouseReel
PackagingReel
Operating Temperature Range- 35 C to + 85 C
ProductPower Management LSI
Factory Pack Quantity2500
Datasheet
Power Management LSI
for Mobile Phone
BD7185AGWL
General Description
The BD7185AGWL is an integrated Power Management
LSI available in a small 80-pins 0.4mm-pitch 3.8mm-by-
3.8mm Wafer-level CSP package, which is designed to
meet demands for space-constrained Smart phones.
The device provides 5-Buck Converters.
The device also includes 12 general-purpose LDOs
providing a wide range of voltage and current
capabilities.
All Buck Converters and LDOs are fully controllable by
the I2C interface. The BD7185AGWL is very easy to
use in any mobile platforms.
Features
5-channel high-efficiency Buck Converters
2
(16-step adjustable V
O
by I C)
12-channel CMOS-type LDO
(16-step adjustable V
O
by I
2
C)
LDO and Buck Converter power ON/OFF control by
I
2
C interface or external pin.
Power ON/OFF sequence.
32.768kHz OSC and output buffer.
4-to-1 analog switch.
TCXO buffer.
SIM card I/F
I
2
C compatible Interface.
2
I C device address changeable by ADRS pin.
(Device address is “1001011”,”1001100”)
Small and thin CSP package
(3.8mm X 3.8mm height 0.57mm max)
Applications
Smart Phones
Tablets
Mobile Router
Data Transmitter
Key Specifications
Input Voltage Range:
Output Voltage Range:
Switching Frequency:
OFF Current:
Operating Temperature Range:
Package
UCSP50L3C
2.6V to 5.5V
1.0V to 3.4V
2.0MHz(Typ)
0.3μA (Typ)
-35℃ to +85℃
W(Typ) x D(Typ) x H(Max)
3.80mm x 3.80mm x 0.57mm
○Product
structure:Silicon monolithic integrated circuit
.
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
○This
product is not designed protection against radioactive rays
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