Sensor Signal Conditioner for
Piezoresistive Bridge Sensors
ZSSC3135
Datasheet
Brief Description
The ZSSC3135 is a member of the ZSSC313x
family of CMOS integrated circuits designed for
automotive/industrial sensor applications. All family
members are well suited for highly accurate amp-
lification and sensor-specific correction of resistive
bridge sensor signals. An internal 16-bit RISC
microcontroller running a correction algorithm
compensates sensor offset, sensitivity, temperature
drift, and non-linearity of the connected sensor
element. The required calibration coefficients are
stored by the one-pass calibration procedure in an
on-chip EEPROM.
The ZSSC3135 is specially designed for piezo-
resistive bridge sensor elements. The amplification
stage with an analog gain of 105 in combination with
optional temperature compensation via an external
temperature sensor meets or exceeds the require-
ments of piezoresistive sensor applications.
Benefits
•
•
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•
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Family approach offers the best fitting IC selec-
tion to build cost-optimized applications
No external trimming components required
Low number of external components needed
PC-controlled configuration and one-pass/
TM
end-of-line calibration via I²C™* or ZACwire
interface: simple, cost-efficient, quick, and pre-
cise
High accuracy: 0.25% FSO** @ -25 to +85°C;
0.5% FSO @ -40 to +125°C
Optimized for automotive/industrial environments
due to robust protection circuitries, excellent
electromagnetic compatibility and AEC-Q100
qualification
Available Support
•
•
•
Features
•
Evaluation Kits
Application Notes
Mass Calibration System
•
•
•
•
•
•
•
•
•
•
•
•
Adjustable to nearly all resistive bridge sensor
types: analog gain of up to 105, maximum overall
gain of 420
Sample rate up to 200 Hz
ADC resolution 13/14 bit
Safety functionality sensor connection
External temperature sensor
Digital compensation of sensor offset, sensitivity,
temperature drift, and non-linearity
Output options: ratiometric analog voltage output
(5 - 95% maximum, 12.4 bit resolution) or
ZACwire™ (digital One-Wire Interface (OWI))
Sensor biasing by voltage
High voltage protection up to 33 V
Supply current: max. 5.5mA
Reverse polarity and short circuit protection
Wide operation temperature range:
-40 to +150°C
Traceability by user-defined EEPROM entries
* Note: I
2
C™ is a trademark of NXP.
** FSO = Full Scale Output.
Physical Characteristics
•
•
•
Supply voltage: 4.5 to 5.5 V
Operation temperature: -40°C to +125°C
(-40°C to +150°C extended temperature range
depending on product version)
Available in RoHS-compliant JEDEC-SSOP14
package or delivery as die
ZSSC3135 Minimum Application Requirements
VCC
Sensor
Module
ZSSC3135
OUT
GND
© 2016 Integrated Device Technology, Inc.
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January 27, 2016
Sensor Signal Conditioner for
Piezoresistive Bridge Sensors
ZSSC3135
Datasheet
ZSSC3135 Application Example
Out / OWI
GND
C2
100nF
8
VSSE
C3
47nF
VDDE
VDD
7
+4.5V to +5.5V
6
5
4
V
SUPP
Sensor Bridge
9
AOUT
10
VBN
11
VBR_B
12
VBP
R1
ZSSC3135
n.c.
SCL
SCL
Serial Interface
SDA
SDA
3
VSSA
2
VDDA
1
13
VBR_T
14
IRTEMP
C4
C5
C1
100nF
Temperature Sensor
Ordering Information
(See data sheet section 8 for complete delivery options.)
Product Sales Code
ZSSC3135BE1
ZSSC3135BA1
ZSSC3135BE2
ZSSC3135BA2
ZSSC313xKITV1.1
Description
ZSSC3135 die – tested; temperature range -40 to +150°C
ZSSC3135 die – tested; temperature range -40 to +125°C
ZSSC3135 SSOP14 – temperature range -40 to +150°C
ZSSC3135 SSOP14 – temperature range -40 to +125°C
ZSSC313x Evaluation Kit, revision 1.1 including Evaluation
Board, ZSSC3135 IC samples, USB cable (software can be
downloaded from the product page
www.IDT.com/ZSSC3135)
Modular Mass Calibration System (MSC) for ZSSC313x
including MCS boards, cable, connectors (software can be
downloaded from the product page
www.IDT.com/ZSSC3135)
Package
Unsawn wafer: add “B” to sales code
Die on frame: add “C” to sales code
Unsawn wafer: add “B” to sales code
Die on frame: add “C” to sales code
Tube: add “T” to sales code
Tape & Reel: add “R”
Tube: add “T” to sales code
Tape & Reel: add “R”
Kit
ZSSC313x Mass
Calibration System V1.1
Kit
Corporate Headquarters
6024 Silver Creek Valley Road
San Jose, CA 95138
www.IDT.com
Sales
1-800-345-7015 or 408-284-8200
Fax: 408-284-2775
www.IDT.com/go/sales
Tech Support
www.IDT.com/go/support
DISCLAIMER Integrated Device Technology, Inc. (IDT) reserves the right to modify the products and/or specifications described herein at any time, without notice, at IDT's sole discretion. Performance
specifications and operating parameters of the described products are determined in an independent state and are not guaranteed to perform the same way when installed in customer products. The
information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability of IDT's products for any particular purpose, an
implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any license under intellectual property
rights of IDT or any third parties.
IDT's products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an IDT product can be
reasonably expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT.
Integrated Device Technology, IDT and the IDT logo are trademarks or registered trademarks of IDT and its subsidiaries in the United States and other countries. Other trademarks used herein are the
property of IDT or their respective third party owners. For datasheet type definitions and a glossary of common terms, visit
www.idt.com/go/glossary.
All contents of this document are copyright of Integrated
Device Technology, Inc. All rights reserved.
© 2016 Integrated Device Technology, Inc.
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January 27, 2016
ZSSC3135 Datasheet
Contents
1
Electrical Characteristics ............................................................................................................................... 5
1.1. Absolute Maximum Ratings .................................................................................................................... 5
1.2. Operating Conditions .............................................................................................................................. 5
1.3. Electrical Parameters ............................................................................................................................. 6
1.3.1. Supply Current and System Operation Conditions .......................................................................... 6
1.3.2. Analog Front-End (AFE) Characteristics ......................................................................................... 6
2)
1.3.3. Temperature Measurement ........................................................................................................... 6
1.3.4. A/D Conversion ................................................................................................................................ 7
1.3.5. Sensor Check................................................................................................................................... 7
1.3.6. DAC and Analog Output .................................................................................................................. 7
1.3.7. System Response ............................................................................................................................ 8
1.4. Interface Characteristics and EEPROM ................................................................................................. 9
TM
1)
1.4.1. I²C Interface ............................................................................................................................... 9
1)
1.4.2. ZACwire™ One-Wire Interface (OWI) .......................................................................................... 9
1.4.3. EEPROM .......................................................................................................................................... 9
Circuit Description ....................................................................................................................................... 10
2.1. Signal Flow ........................................................................................................................................... 10
2.2. Application Modes ................................................................................................................................ 11
2.3. Analog Front-End (AFE) ....................................................................................................................... 11
2.3.1. Programmable Gain Amplifier (PGA) ............................................................................................. 11
2.3.2. Offset Compensation ..................................................................................................................... 12
2.3.3. Measurement Cycle ....................................................................................................................... 12
2.3.4. Analog-to-Digital Converter ............................................................................................................ 13
2.4. Temperature Measurement .................................................................................................................. 14
2.5. System Control and Conditioning Calculation ...................................................................................... 14
2.5.1. General Working Modes ................................................................................................................ 14
2.5.2. Startup Phase ............................................................................................................................... 14
2.5.3. Conditioning Calculation ................................................................................................................ 15
2.6. Analog or Digital Output ....................................................................................................................... 15
2.7. Serial Digital Interface .......................................................................................................................... 16
2.8. Failsafe Features .................................................................................................................................. 16
2.9. High Voltage, Reverse Polarity, and Short Circuit Protection .............................................................. 16
Application Circuit Examples ....................................................................................................................... 17
Pin Configuration and Package ................................................................................................................... 19
ESD Protection ............................................................................................................................................ 20
Quality and Reliability .................................................................................................................................. 20
Customization .............................................................................................................................................. 20
Ordering Information ................................................................................................................................... 20
Related Documents ..................................................................................................................................... 21
2
3
4
5
6
7
8
9
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ZSSC3135 Datasheet
10 Glossary ...................................................................................................................................................... 21
11 Document Revision History ......................................................................................................................... 23
List of Figures
Figure 2.1
Figure 2.2
Figure 3.1
Figure 3.2
Figure 3.3
Figure 4.1
Block Diagram of the ZSSC3135 ................................................................................................... 10
Measurement Cycle with 1 Bridge Sensor Signal Measurement per Special Measurement ........ 12
Application with On-Chip Diode Temperature Sensor ................................................................... 17
Application with External Diode Temperature Sensor ................................................................... 18
Application with External Thermistor ............................................................................................. 18
ZSSC3135 SSOP14 Pin Diagram ................................................................................................. 19
List of Tables
Table 1.1
Table 1.2
Table 1.3
Table 1.4
Table 2.1
Table 2.2
Table 3.1
Table 4.1
Absolute Maximum Ratings ............................................................................................................. 5
Operating Conditions ....................................................................................................................... 5
Electrical Parameters ....................................................................................................................... 6
Interface Characteristics and EEPROM .......................................................................................... 9
Adjustable Gains, Resulting Sensor Signal Spans and Common Mode Ranges ......................... 11
ADC Resolution versus Output Resolution and Sample Rate ....................................................... 14
External Components for Application Circuit Examples ................................................................ 17
Pin Configuration and Definition .................................................................................................... 19
© 2016 Integrated Device Technology, Inc.
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ZSSC3135 Datasheet
1
1.1.
Electrical Characteristics
Absolute Maximum Ratings
Note:
The absolute maximum ratings are stress ratings only. The device might not function or be operable above
the operating conditions given in section 1.2. Stresses exceeding the absolute maximum ratings might also
damage the device. In addition, extended exposure to stresses above the recommended operating conditions
might affect device reliability. IDT does not recommend designing to the “Absolute Maximum Ratings.”
Parameters apply in operation temperature range and without time limitations.
Table 1.1
No.
1.1.1
Absolute Maximum Ratings
Parameter
Supply voltage
1)
Symbol
VDDE
AMR
Conditions
To VSSE, refer to
section 3 for application
circuits
Referenced to VSSE
Referenced to VSSA,
VDDE - VDDA < 0.35V
Referenced to VSSA
Min
-33
Max
33
Unit
VDC
1.1.2
1.1.3
1.1.4
1.1.5
1)
Potential at AOUT pin
Analog supply voltage
1)
1)
V
OUT
VDDA
AMR
V
A_IO
V
D_IO
T
STG
-33
-0.3
-0.3
-55
33
6.5
VDDA + 0.3
150
VDC
VDC
VDC
°C
Voltage at all analog and
digital IO pins
Storage temperature
Refer to the
ZSSC313x High Voltage Protection Description
for specification and detailed conditions.
1.2.
Operating Conditions
Operating Conditions
Parameter
Ambient temperature
1) 2)
All voltages are referenced to VSSA.
Table 1.2
No.
1.2.1
Symbol
T
AMB_TQE
T
AMB_TQA
Conditions
Extended Temperature
Range (TQE)
Advanced-Performance
Temperature Range
(TQA)
Best-Performance
Temperature Range (TQI)
Min
-40
-40
Typ
Max
150
125
Unit
°C
°C
T
AMB_TQI
1.2.2
1.2.3
1)
2)
3)
4)
-25
4.5
2
5.0
85
5.5
25
°C
VDC
kΩ
Supply voltage
Bridge resistance
3) 4)
VDDE
R
BR
Maximum operation temperature range depends on product version (refer to section 8).
See the temperature profile description in the
ZSSC313x Technical Note—Die & Package Dimensions.
No measurement in mass production; parameter is guaranteed by design and/or quality observation.
Symmetric behavior and identical electrical properties (especially the low pass characteristic) of both sensor inputs of the ZSSC3135 are required.
Unsymmetrical conditions of the sensor and/or external components connected to the sensor input pins of the ZSSC3135 can generate a failure in
signal operation.
© 2016 Integrated Device Technology, Inc.
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January 27, 2016
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