Intel
®
Xeon
®
Processor E3-1200 v3
Product Family
Datasheet – Volume 1 of 2
July 2014
Order No.: 328907-002
By using this document, in addition to any agreements you have with Intel, you accept the terms set forth below.
You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel products described
herein. You agree to grant Intel a non-exclusive, royalty-free license to any patent claim thereafter drafted which includes subject matter disclosed
herein.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR
OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND
CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A
PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
A "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death.
SHOULD YOU PURCHASE OR USE INTEL'S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND
ITS SUBSIDIARIES, SUBCONTRACTORS AND AFFILIATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AGAINST ALL
CLAIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE ATTORNEYS' FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF
PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR NOT INTEL
OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS.
Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or
characteristics of any features or instructions marked "reserved" or "undefined". Intel reserves these for future definition and shall have no
responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without
notice. Do not finalize a design with this information.
The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published
specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling
1-800-548-4725, or go to:
http://www.intel.com/design/literature.htm
Any software source code reprinted in this document is furnished for informational purposes only and may only be used or copied and no license,
express or implied, by estoppel or otherwise, to any of the reprinted source code is granted by this document.
Any software source code reprinted in this document is furnished under a software license and may only be used or copied in accordance with the
terms of that license.
This document contains information on products in the design phase of development.
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different
processor families: Go to:
http://www.intel.com/products/processor_number
Code Names are only for use by Intel to identify products, platforms, programs, services, etc. ("products") in development by Intel that have not been
made commercially available to the public, i.e., announced, launched or shipped. They are never to be used as "commercial" names for products. Also,
they are not intended to function as trademarks.
Intel
®
Hyper-Threading Technology (Intel
®
HT Technology) is available on select Intel
®
Core
™
processors. It requires an Intel
®
HT Technology enabled
system. Consult your PC manufacturer. Performance will vary depending on the specific hardware and software used. Not available on Intel
®
Core
™
i5-750. For more information including details on which processors support Intel
®
HT Technology, visit
http://www.intel.com/info/hyperthreading.
Intel
®
64 architecture requires a system with a 64-bit enabled processor, chipset, BIOS and software. Performance will vary depending on the specific
hardware and software you use. Consult your PC manufacturer for more information. For more information, visit
http://www.intel.com/
content/www/us/en/architecture-and-technology/microarchitecture/intel-64-architecture-general.html.
No computer system can provide absolute security under all conditions. Intel
®
Trusted Execution Technology (Intel
®
TXT) requires a computer with
Intel
®
Virtualization Technology, an Intel TXT-enabled processor, chipset, BIOS, Authenticated Code Modules and an Intel TXT-compatible measured
launched environment (MLE). Intel TXT also requires the system to contain a TPM v1.s. For more information, visit
http://www.intel.com/technology/
security.
Intel
®
Virtualization Technology (Intel
®
VT) requires a computer system with an enabled Intel
®
processor, BIOS, and virtual machine monitor (VMM).
Functionality, performance or other benefits will vary depending on hardware and software configurations. Software applications may not be
compatible with all operating systems. Consult your PC manufacturer. For more information, visit
http://www.intel.com/go/virtualization.
Requires a system with Intel
®
Turbo Boost Technology. Intel Turbo Boost Technology and Intel Turbo Boost Technology 2.0 are only available on select
Intel
®
processors. Consult your PC manufacturer. Performance varies depending on hardware, software, and system configuration. For more
information, visit
http://www.intel.com/go/turbo.
Requires activation and a system with a corporate network connection, an Intel
®
AMT-enabled chipset, network hardware and software. For notebooks,
Intel AMT may be unavailable or limited over a host OS-based VPN, when connecting wirelessly, on battery power, sleeping, hibernating or powered
off. Results dependent upon hardware, setup and configuration.
Intel, Intel Xeon, and the Intel logo are trademarks of Intel Corporation in the U.S. and/or other countries.
*Other names and brands may be claimed as the property of others.
Copyright
©
2013–2014, Intel Corporation. All rights reserved.
Intel
®
Xeon
®
Processor E3-1200 v3 Product Family
Datasheet – Volume 1 of 2
2
July 2014
Order No.: 328907-002
Contents—Processor
Contents
Revision History..................................................................................................................9
1.0 Introduction................................................................................................................10
1.1
1.2
1.3
1.4
1.5
1.6
1.7
Supported Technologies.........................................................................................11
Interfaces............................................................................................................ 12
Power Management Support...................................................................................12
Thermal Management Support................................................................................13
Package Support...................................................................................................13
Terminology.........................................................................................................13
Related Documents............................................................................................... 16
2.0 Interfaces................................................................................................................... 18
2.1 System Memory Interface...................................................................................... 18
2.1.1 System Memory Technology Supported.......................................................19
2.1.2 System Memory Timing Support................................................................. 20
2.1.3 System Memory Organization Modes........................................................... 20
2.2 PCI Express* Interface.......................................................................................... 23
2.2.1 PCI Express* Support................................................................................ 23
2.2.2 PCI Express* Architecture.......................................................................... 24
2.2.3 PCI Express* Configuration Mechanism........................................................ 24
2.3 Direct Media Interface (DMI).................................................................................. 26
2.4 Processor Graphics................................................................................................28
2.5 Processor Graphics Controller (GT)..........................................................................28
2.5.1 3D and Video Engines for Graphics Processing.............................................. 29
2.5.2 Multi Graphics Controllers Multi-Monitor Support........................................... 31
2.6 Digital Display Interface (DDI)................................................................................31
2.7 Intel
®
Flexible Display Interface (Intel
®
FDI)............................................................ 37
2.8 Platform Environmental Control Interface (PECI)....................................................... 37
2.8.1 PECI Bus Architecture................................................................................37
3.0 Technologies............................................................................................................... 39
3.1 Intel
®
Virtualization Technology (Intel
®
VT)............................................................. 39
3.2 Intel
®
Trusted Execution Technology (Intel
®
TXT)..................................................... 43
3.3 Intel
®
Hyper-Threading Technology (Intel
®
HT Technology)....................................... 44
3.4 Intel
®
Turbo Boost Technology 2.0..........................................................................45
3.5 Intel
®
Advanced Vector Extensions 2.0 (Intel
®
AVX2)................................................45
3.6 Intel
®
Advanced Encryption Standard New Instructions (Intel
®
AES-NI).......................46
3.7 Intel
®
Transactional Synchronization Extensions - New Instructions (Intel
®
TSX-NI)..... 47
3.8 Intel
®
64 Architecture x2APIC................................................................................ 47
3.9 Power Aware Interrupt Routing (PAIR).................................................................... 48
3.10 Execute Disable Bit..............................................................................................48
3.11 Supervisor Mode Execution Protection (SMEP)........................................................49
4.0 Power Management.................................................................................................... 50
4.1 Advanced Configuration and Power Interface (ACPI) States Supported......................... 51
4.2 Processor Core Power Management......................................................................... 52
4.2.1 Enhanced Intel
®
SpeedStep
®
Technology Key Features..................................52
4.2.2 Low-Power Idle States............................................................................... 53
July 2014
Order No.: 328907-002
Intel
®
Xeon
®
Processor E3-1200 v3 Product Family
Datasheet – Volume 1 of 2
3
Processor—Contents
4.3
4.4
4.5
4.6
4.2.3 Requesting Low-Power Idle States...............................................................54
4.2.4 Core C-State Rules....................................................................................55
4.2.5 Package C-States......................................................................................56
4.2.6 Package C-States and Display Resolutions.................................................... 60
Integrated Memory Controller (IMC) Power Management............................................61
4.3.1 Disabling Unused System Memory Outputs................................................... 61
4.3.2 DRAM Power Management and Initialization..................................................62
4.3.3 DRAM Running Average Power Limitation (RAPL) .........................................64
4.3.4 DDR Electrical Power Gating (EPG).............................................................. 64
PCI Express* Power Management............................................................................64
Direct Media Interface (DMI) Power Management...................................................... 64
Graphics Power Management..................................................................................65
4.6.1 Intel
®
Rapid Memory Power Management (Intel
®
RMPM)................................65
4.6.2 Graphics Render C-State............................................................................65
4.6.3 Intel
®
Graphics Dynamic Frequency............................................................ 65
5.0 Thermal Management................................................................................................. 66
5.1
5.2
5.3
5.4
5.5
5.6
5.7
5.8
Thermal Metrology................................................................................................ 67
Fan Speed Control Scheme with Digital Thermal Sensor (DTS) 1.1.............................. 67
Fan Speed Control Scheme with Digital Thermal Sensor (DTS) 2.0.............................. 69
Thermal Specifications...........................................................................................70
Processor Temperature..........................................................................................72
Adaptive Thermal Monitor...................................................................................... 72
THERMTRIP# Signal.............................................................................................. 75
Digital Thermal Sensor.......................................................................................... 75
5.8.1 Digital Thermal Sensor Accuracy (Taccuracy)................................................76
5.9 Intel
®
Turbo Boost Technology Thermal Considerations..............................................76
5.9.1 Intel
®
Turbo Boost Technology Power Control and Reporting.......................... 76
5.9.2 Package Power Control.............................................................................. 77
5.9.3 Turbo Time Parameter............................................................................... 78
6.1 System Memory Interface Signals........................................................................... 80
6.2 Memory Reference Compensation Signals.................................................................82
6.3 Reset and Miscellaneous Signals............................................................................. 83
6.4 PCI Express* Interface Signals............................................................................... 84
6.5 Display Interface Signals....................................................................................... 84
6.6 Direct Media Interface (DMI).................................................................................. 84
6.7 Phase Locked Loop (PLL) Signals.............................................................................85
6.8 Testability Signals.................................................................................................85
6.9 Error and Thermal Protection Signals....................................................................... 86
6.10 Power Sequencing Signals.................................................................................... 86
6.11 Processor Power Signals.......................................................................................87
6.12 Sense Signals..................................................................................................... 87
6.13 Ground and Non-Critical to Function (NCTF) Signals.................................................87
6.14 Processor Internal Pull-Up / Pull-Down Terminations................................................ 87
7.0 Electrical Specifications.............................................................................................. 88
7.1
7.2
7.3
7.4
Integrated Voltage Regulator..................................................................................88
Power and Ground Lands ...................................................................................... 88
V
CC
Voltage Identification (VID).............................................................................. 88
Reserved or Unused Signals................................................................................... 93
6.0 Signal Description....................................................................................................... 80
Intel
®
Xeon
®
Processor E3-1200 v3 Product Family
Datasheet – Volume 1 of 2
4
July 2014
Order No.: 328907-002
Contents—Processor
7.5
7.6
7.7
7.8
Signal Groups.......................................................................................................93
Test Access Port (TAP) Connection.......................................................................... 95
DC Specifications................................................................................................. 95
Voltage and Current Specifications.......................................................................... 96
7.8.1 Platform Environment Control Interface (PECI) DC Characteristics................. 101
7.8.2 Input Device Hysteresis........................................................................... 102
Processor Component Keep-Out Zone.................................................................... 103
Package Loading Specifications............................................................................. 103
Package Handling Guidelines................................................................................ 104
Package Insertion Specifications............................................................................104
Processor Mass Specification.................................................................................104
Processor Materials............................................................................................. 104
Processor Markings............................................................................................. 105
Processor Land Coordinates.................................................................................. 105
Processor Storage Specifications........................................................................... 106
8.0 Package Mechanical Specifications........................................................................... 103
8.1
8.2
8.3
8.4
8.5
8.6
8.7
8.8
8.9
9.0 Processor Ball and Signal Information...................................................................... 108
July 2014
Order No.: 328907-002
Intel
®
Xeon
®
Processor E3-1200 v3 Product Family
Datasheet – Volume 1 of 2
5
京公网安备 11010802033920号
EEWORLD
