MPC8540VTAQFB datasheet, PDF - EEWORLD Datasheet

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MPC8540VTAQFB: DescriptionMicroprocessors - MPU PQ 3 8540-DRACOM; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，104 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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Microprocessors - MPU PQ 3 8540-DRACOM

MPC8540VTAQFB Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	NXP
Parts packaging code	BGA
package instruction	BGA, BGA783,28X28,40
Contacts	783
Reach Compliance Code	not_compliant
ECCN code	5A991
Address bus width	64
bit size	32
boundary scan	YES
maximum clock frequency	166 MHz
External data bus width	64
Format	FIXED POINT
Integrated cache	YES
JESD-30 code	S-PBGA-B783
JESD-609 code	e2
length	29 mm
low power mode	YES
Humidity sensitivity level	3
Number of terminals	783
Maximum operating temperature	105 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA783,28X28,40
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	260
power supply	1.2,2.5/3.3 V
Certification status	Not Qualified
Maximum seat height	3.85 mm
speed	667 MHz
Maximum supply voltage	1.26 V
Minimum supply voltage	1.14 V
Nominal supply voltage	1.2 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal surface	Tin/Silver (Sn/Ag)
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	40
width	29 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR

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Freescale Semiconductor

Technical Data

MPC8540EC

Rev. 4.1, 07/2007

MPC8540

Integrated Processor

Hardware Specifications

The MPC8540 integrates a PowerPC™ processor core built

on Power Architecture™ technology with system logic

required for networking, telecommunications, and wireless

infrastructure applications. The MPC8540 is a member of

the PowerQUICC™ III family of devices that combine

system-level support for industry-standard interfaces with

processors that implement the embedded category of the

Power Architecture technology. For functional

characteristics of the processor, refer to the

MPC8540

PowerQUICC III Integrated Host Processor Reference

Manual.

To locate any published errata or updates for this document,

contact your Freescale sales office.

Contents

Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . 7

Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 12

Clock Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

RESET Initialization . . . . . . . . . . . . . . . . . . . . . . . . . 15

DDR SDRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

DUART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Ethernet: Three-Speed,10/100, MII Management . . 22

Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

I2C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

PCI/PCI-X . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

RapidIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

Package and Pin Listings . . . . . . . . . . . . . . . . . . . . . 66

Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76

Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78

System Design Information . . . . . . . . . . . . . . . . . . . 88

Document Revision History . . . . . . . . . . . . . . . . . . . 95

Device Nomenclature . . . . . . . . . . . . . . . . . . . . . . . 100

10.

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Description	Microprocessors - MPU PQ 3 8540-DRACOM	Microprocessors - MPU PQ 3 DRACO-DRACOM	Microprocessors - MPU PQ 3 8540-DRACOM	Microprocessors - MPU PQ 3 8540-DRACOM	Microprocessors - MPU PQ 3 8540-DRACOM	Microprocessors - MPU PQ 3 8540-DRACOM	Microprocessors - MPU PQ 3 8540-DRACOM	Microprocessors - MPU PQ 3 8540-DRACOM	Microprocessors - MPU PQ 3 8540-DRACOM
Is it Rohs certified?	conform to	incompatible	incompatible	incompatible	incompatible	conform to	conform to	conform to	conform to
Maker	NXP	NXP	NXP	NXP	NXP	NXP	NXP	NXP	NXP
Parts packaging code	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
package instruction	BGA, BGA783,28X28,40	BGA, BGA783,28X28,40	BGA, BGA783,28X28,40	BGA, BGA783,28X28,40	BGA, BGA783,28X28,40	BGA, BGA783,28X28,40	BGA, BGA783,28X28,40	BGA, BGA783,28X28,40	BGA, BGA783,28X28,40
Contacts	783	783	783	783	783	783	783	783	783
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
ECCN code	5A991	3A991.A.2	5A991	3A991.A.2	5A991	3A991.A.2	3A991.A.2	3A991.A.2	5A991
Address bus width	64	64	64	64	64	64	64	64	64
bit size	32	32	32	32	32	32	32	32	32
boundary scan	YES	YES	YES	YES	YES	YES	YES	YES	YES
maximum clock frequency	166 MHz	166 MHz	166 MHz	166 MHz	166 MHz	166 MHz	166 MHz	166 MHz	166 MHz
External data bus width	64	64	64	64	64	64	64	64	64
Format	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT
Integrated cache	YES	YES	YES	YES	YES	YES	YES	YES	YES
JESD-30 code	S-PBGA-B783	S-PBGA-B783	S-PBGA-B783	S-PBGA-B783	S-PBGA-B783	S-PBGA-B783	S-PBGA-B783	S-PBGA-B783	S-PBGA-B783
JESD-609 code	e2	e0	e0	e0	e0	e2	e2	e2	e2
length	29 mm	29 mm	29 mm	29 mm	29 mm	29 mm	29 mm	29 mm	29 mm
low power mode	YES	YES	YES	YES	YES	YES	YES	YES	YES
Humidity sensitivity level	3	3	3	3	3	3	3	3	3
Number of terminals	783	783	783	783	783	783	783	783	783
Maximum operating temperature	105 °C	105 °C	105 °C	105 °C	105 °C	105 °C	105 °C	105 °C	105 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
Encapsulate equivalent code	BGA783,28X28,40	BGA783,28X28,40	BGA783,28X28,40	BGA783,28X28,40	BGA783,28X28,40	BGA783,28X28,40	BGA783,28X28,40	BGA783,28X28,40	BGA783,28X28,40
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Celsius)	260	260	260	260	260	260	260	260	260
power supply	1.2,2.5/3.3 V	1.3,2.5/3.3 V	1.2,2.5/3.3 V	1.2,2.5/3.3 V	1.2,2.5/3.3 V	1.3,2.5/3.3 V	1.2,2.5/3.3 V	1.2,2.5/3.3 V	1.2,2.5/3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	3.85 mm	3.85 mm	3.85 mm	3.85 mm	3.85 mm	3.85 mm	3.85 mm	3.85 mm	3.85 mm
speed	667 MHz	667 MHz	667 MHz	667 MHz	667 MHz	667 MHz	667 MHz	667 MHz	667 MHz
Maximum supply voltage	1.26 V	1.26 V	1.26 V	1.26 V	1.26 V	1.26 V	1.26 V	1.26 V	1.26 V
Minimum supply voltage	1.14 V	1.14 V	1.14 V	1.14 V	1.14 V	1.14 V	1.14 V	1.14 V	1.14 V
Nominal supply voltage	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	INDUSTRIAL	OTHER	OTHER
Terminal surface	Tin/Silver (Sn/Ag)	Tin/Lead/Silver (Sn/Pb/Ag)	Tin/Lead/Silver (Sn/Pb/Ag)	Tin/Lead/Silver (Sn/Pb/Ag)	Tin/Lead/Silver (Sn/Pb/Ag)	TIN COPPER/TIN SILVER	TIN COPPER/TIN SILVER	TIN COPPER/TIN SILVER	TIN SILVER
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	40	40	40	40	40	40	40	40	40
width	29 mm	29 mm	29 mm	29 mm	29 mm	29 mm	29 mm	29 mm	29 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR
Is it lead-free?	-	Contains lead	-	Contains lead	-	Contains lead	Contains lead	Contains lead	-

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