|
MAX173C/D |
MAX173EWG |
MAX173CWG-T |
MAX173ENG+ |
MAX173ENG |
| Description |
Analog to Digital Converters - ADC CMOS 5us 10-Bit Complete ADC with Voltage Reference |
Analog to Digital Converters - ADC CMOS 5us 10-Bit Complete ADC with Voltage Reference |
Analog to Digital Converters - ADC CMOS 5us 10-Bit Complete ADC with Voltage Reference |
Analog to Digital Converters - ADC CMOS 5us 10-Bit Complete ADC with Voltage Reference |
Analog to Digital Converters - ADC CMOS 5us 10-Bit Complete ADC with Voltage Reference |
| Is it lead-free? |
- |
Contains lead |
Contains lead |
Lead free |
Contains lead |
| Is it Rohs certified? |
- |
incompatible |
incompatible |
conform to |
incompatible |
| Maker |
- |
Maxim |
Maxim |
Maxim |
Maxim |
| Parts packaging code |
- |
SOIC |
SOIC |
DIP |
DIP |
| package instruction |
- |
SOP-24 |
SOP-24 |
DIP, DIP24,.6 |
PLASTIC, DIP-24 |
| Contacts |
- |
24 |
24 |
24 |
24 |
| Reach Compliance Code |
- |
not_compliant |
not_compliant |
compliant |
not_compliant |
| ECCN code |
- |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
| Maximum analog input voltage |
- |
5 V |
5 V |
5 V |
5 V |
| Maximum conversion time |
- |
5.2 µs |
5.2 µs |
5.2 µs |
5.2 µs |
| Converter type |
- |
ADC, SUCCESSIVE APPROXIMATION |
ADC, SUCCESSIVE APPROXIMATION |
ADC, SUCCESSIVE APPROXIMATION |
ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 code |
- |
R-PDSO-G24 |
R-PDSO-G24 |
R-PDIP-T24 |
R-PDIP-T24 |
| JESD-609 code |
- |
e0 |
e0 |
e3 |
e0 |
| length |
- |
15.4 mm |
15.4 mm |
30.545 mm |
30.545 mm |
| Maximum linear error (EL) |
- |
0.05% |
0.05% |
0.05% |
0.05% |
| Humidity sensitivity level |
- |
1 |
1 |
1 |
1 |
| Nominal negative supply voltage |
- |
-12 V |
-12 V |
-12 V |
-12 V |
| Number of analog input channels |
- |
1 |
1 |
1 |
1 |
| Number of digits |
- |
10 |
10 |
10 |
10 |
| Number of functions |
- |
1 |
1 |
1 |
1 |
| Number of terminals |
- |
24 |
24 |
24 |
24 |
| Maximum operating temperature |
- |
85 °C |
70 °C |
85 °C |
85 °C |
| Minimum operating temperature |
- |
-40 °C |
- |
-40 °C |
-40 °C |
| Output bit code |
- |
BINARY |
BINARY |
BINARY |
BINARY |
| Output format |
- |
PARALLEL, WORD |
PARALLEL, WORD |
PARALLEL, WORD |
PARALLEL, WORD |
| Package body material |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
- |
SOP |
SOP |
DIP |
DIP |
| Encapsulate equivalent code |
- |
SOP24,.4 |
SOP24,.4 |
DIP24,.6 |
DIP24,.6 |
| Package shape |
- |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
| Package form |
- |
SMALL OUTLINE |
SMALL OUTLINE |
IN-LINE |
IN-LINE |
| Peak Reflow Temperature (Celsius) |
- |
240 |
240 |
260 |
240 |
| power supply |
- |
5,-12/-15 V |
5,-12/-15 V |
5,-12/-15 V |
5,-12/-15 V |
| Certification status |
- |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| Maximum seat height |
- |
2.65 mm |
2.65 mm |
4.572 mm |
4.572 mm |
| Nominal supply voltage |
- |
5 V |
5 V |
5 V |
5 V |
| surface mount |
- |
YES |
YES |
NO |
NO |
| technology |
- |
CMOS |
CMOS |
CMOS |
CMOS |
| Temperature level |
- |
INDUSTRIAL |
COMMERCIAL |
INDUSTRIAL |
INDUSTRIAL |
| Terminal surface |
- |
Tin/Lead (Sn85Pb15) |
Tin/Lead (Sn/Pb) |
Matte Tin (Sn) |
Tin/Lead (Sn85Pb15) |
| Terminal form |
- |
GULL WING |
GULL WING |
THROUGH-HOLE |
THROUGH-HOLE |
| Terminal pitch |
- |
1.27 mm |
1.27 mm |
2.54 mm |
2.54 mm |
| Terminal location |
- |
DUAL |
DUAL |
DUAL |
DUAL |
| Maximum time at peak reflow temperature |
- |
20 |
NOT SPECIFIED |
30 |
20 |
| width |
- |
7.5 mm |
7.5 mm |
7.62 mm |
7.62 mm |