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89HPES12NT3ZBBCI8

Description
PCI Interface IC 24LANE,3PORT NT SW
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size406KB,29 Pages
ManufacturerIDT (Integrated Device Technology)
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89HPES12NT3ZBBCI8 Overview

PCI Interface IC 24LANE,3PORT NT SW

89HPES12NT3ZBBCI8 Parametric

Parameter NameAttribute value
Brand NameIntegrated Device Technology
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Parts packaging codeCABGA
package instructionCABGA-324
Contacts324
Manufacturer packaging codeBC324
Reach Compliance Codenot_compliant
ECCN codeEAR99
Address bus width
Bus compatibilityPCI; SMBUS
maximum clock frequency125 MHz
Maximum data transfer rate6000 MBps
External data bus width
JESD-30 codeS-PBGA-B324
JESD-609 codee0
length19 mm
Humidity sensitivity level3
Number of terminals324
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Encapsulate equivalent codeBGA324,18X18,40
Package shapeSQUARE
Package formGRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Celsius)225
power supply1,3.3 V
Certification statusNot Qualified
Maximum seat height1.5 mm
Maximum supply voltage1.1 V
Minimum supply voltage0.9 V
Nominal supply voltage1 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn63Pb37)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width19 mm
uPs/uCs/peripheral integrated circuit typeBUS CONTROLLER, PCI
Base Number Matches1
12-lane 3-Port Non-Transparent
PCI Express® Switch
®
89HPES12NT3
Data Sheet
Device Overview
The 89HPES12NT3 is a member of the IDT PRECISE™ family of
PCI Express® switching solutions offering the next-generation I/O inter-
connect standard. The PES12NT3 is a 12-lane, 3-port peripheral chip
that performs PCI Express Base switching with a feature set optimized
for high performance applications such as servers, storage, and commu-
nications/networking. It provides high-performance I/O connectivity and
switching functions between a PCIe® upstream port, a transparent
downstream port, and a non-transparent downstream port.
With non-transparent bridging (NTB) functionality, the PES12NT3
can be used standalone or as a chipset with IDT PCIe System Intercon-
nect Switches in multi-host and intelligent I/O applications such as
communications, storage, and blade servers where inter-domain
communication is required.
Features
High Performance PCI Express Switch
Twelve PCI Express lanes (2.5Gbps), three switch ports
Delivers 48 Gbps (6 GBps) of aggregate switching capacity
Low latency cut-through switch architecture
Support for Max Payload size up to 2048 bytes
Supports one virtual channel and eight traffic classes
PCI Express Base specification Revision 1.0a compliant
Flexible Architecture with Numerous Configuration Options
Port arbitration schemes utilizing round robin
Supports automatic per port link width negotiation (x4, x2, or
x1)
Static lane reversal on all ports
Automatic polarity inversion on all lanes
Supports locked transactions, allowing use with legacy soft-
ware
Ability to load device configuration from serial EEPROM
Ability to control device via SMBus
Non-Transparent Port
Crosslink support on NTB port
Four mapping windows supported
Each may be configured as a 32-bit memory or I/O window
May be paired to form a 64-bit memory window
Interprocessor communication
Thirty-two inbound and outbound doorbells
Four inbound and outbound message registers
Two shared scratchpad registers
Allows up to sixteen masters to communicate through the non-
transparent port
No limit on the number of supported outstanding transactions
through the non-transparent bridge
Completely symmetric non-transparent bridge operation
allows similar/same configuration software to be run
Supports direct connection to a transparent or non-transparent
port of another switch
Block Diagram
3-Port Switch Core
Frame Buffer
Route Table
Port
Arbitration
Scheduler
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Non-
Transparent
Bridge
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
...
...
...
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
12 PCI Express Lanes
x4 Upstream Port and Two x4 Downstream Ports
Figure 1 Internal Block Diagram
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
Inc.
1 of 29
©
2009 Integrated Device Technology, Inc.
February 19, 2009
DSC 6929

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Description PCI Interface IC 24LANE,3PORT NT SW PCI Interface IC 24LANE,3PORT NT SW PCI Interface IC 24LANE,3PORT NT SW PCI Interface IC 24LANE,3PORT NT SW
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology
Is it lead-free? Contains lead Lead free Contains lead Lead free
Is it Rohs certified? incompatible conform to incompatible conform to
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code CABGA CABGA CABGA CABGA
package instruction CABGA-324 CABGA-324 CABGA-324 LBGA, BGA324,18X18,40
Contacts 324 324 324 324
Manufacturer packaging code BC324 BCG324 BC324 BCG324
Reach Compliance Code not_compliant compliant not_compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99
Bus compatibility PCI; SMBUS PCI PCI PCI; SMBUS
maximum clock frequency 125 MHz 125 MHz 125 MHz 125 MHz
JESD-30 code S-PBGA-B324 S-PBGA-B324 S-PBGA-B324 S-PBGA-B324
JESD-609 code e0 e1 e0 e1
length 19 mm 19 mm 19 mm 19 mm
Humidity sensitivity level 3 3 3 3
Number of terminals 324 324 324 324
Maximum operating temperature 85 °C 70 °C 70 °C 85 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LBGA LBGA LBGA LBGA
Encapsulate equivalent code BGA324,18X18,40 BGA324,18X18,40 BGA324,18X18,40 BGA324,18X18,40
Package shape SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Celsius) 225 260 225 260
power supply 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.5 mm 1.5 mm 1.5 mm 1.5 mm
Maximum supply voltage 1.1 V 1.1 V 1.1 V 1.1 V
Minimum supply voltage 0.9 V 0.9 V 0.9 V 0.9 V
Nominal supply voltage 1 V 1 V 1 V 1 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL COMMERCIAL COMMERCIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form BALL BALL BALL BALL
Terminal pitch 1 mm 1 mm 1 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED 30 NOT SPECIFIED NOT SPECIFIED
width 19 mm 19 mm 19 mm 19 mm
uPs/uCs/peripheral integrated circuit type BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI
Base Number Matches 1 1 1 1
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