EEWORLDEEWORLDEEWORLD

Part Number

Search

74HCT30DB,118

Description
Logic Gates 8-INPUT NAND GATE
Categorylogic    logic   
File Size775KB,15 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
Download Datasheet Parametric Compare View All

74HCT30DB,118 Overview

Logic Gates 8-INPUT NAND GATE

74HCT30DB,118 Parametric

Parameter NameAttribute value
Brand NameNXP Semiconductor
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeSSOP1
Contacts14
Manufacturer packaging codeSOT337-1
Reach Compliance Codecompliant
seriesHCT
JESD-30 codeR-PDSO-G14
JESD-609 codee4
length6.2 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeNAND GATE
MaximumI(ol)0.004 A
Humidity sensitivity level1
Number of functions1
Number of entries8
Number of terminals14
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSSOP
Encapsulate equivalent codeSSOP14,.3
Package shapeRECTANGULAR
Package formSMALL OUTLINE, SHRINK PITCH
method of packingTAPE AND REEL
Peak Reflow Temperature (Celsius)260
power supply5 V
Prop。Delay @ Nom-Sup42 ns
propagation delay (tpd)42 ns
Certification statusNot Qualified
Schmitt triggerNO
Maximum seat height2 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceNICKEL PALLADIUM GOLD
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width5.3 mm
Base Number Matches1
74HC30; 74HCT30
8-input NAND gate
Rev. 7 — 2 December 2015
Product data sheet
1. General description
The 74HC30; 74HCT30 is an 8-input NAND gate. Inputs include clamp diodes. This
enables the use of current limiting resistors to interface inputs to voltages in excess of
V
CC
.
2. Features and benefits
Complies with JEDEC standard JESD7A
Input levels:
For 74HC30: CMOS level
For 74HCT30: TTL level
ESD protection:
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A exceeds 200 V
Multiple package options
Specified from
40 C
to +85
C
and from
40 C
to +125
C
3. Ordering information
Table 1.
Ordering information
Package
Temperature range Name
74HC30D
74HCT30D
74HC30DB
74HCT30DB
74HC30PW
74HCT30PW
40 C
to +125
C
TSSOP14
40 C
to +125
C
SSOP14
40 C
to +125
C
SO14
Description
plastic small outline package; 14 leads;
body width 3.9 mm
plastic shrink small outline package; 14 leads; body
width 5.3 mm
plastic thin shrink small outline package; 14 leads;
body width 4.4 mm
Version
SOT108-1
SOT337-1
SOT402-1
Type number

74HCT30DB,118 Related Products

74HCT30DB,118 74HC30DB,112 74HC30D,652 74HC30PW,112 74HC30DB,118 74HCT30D,652 74HCT30D,653
Description Logic Gates 8-INPUT NAND GATE Logic Gates 8-INPUT NAND GATE Logic Gates 8-INPUT NAND GATE Logic Gates 8-INPUT NAND GATE Logic Gates 8-INPUT NAND GATE Logic Gates 8-INPUT NAND GATE Logic Gates 8-INPUT NAND GATE
Brand Name NXP Semiconductor NXP Semiconductor NXP Semiconductor NXP Semiconductor NXP Semiconductor NXP Semiconductor NXP Semiconductor
Is it Rohs certified? conform to conform to conform to conform to conform to conform to conform to
Maker NXP NXP NXP NXP NXP NXP NXP
Parts packaging code SSOP1 SSOP1 SOIC TSSOP SSOP1 SOIC SOIC
Contacts 14 14 14 14 14 14 14
Manufacturer packaging code SOT337-1 SOT337-1 SOT108-1 SOT402-1 SOT337-1 SOT108-1 SOT108-1
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant
series HCT HC/UH HC/UH HC/UH HC/UH HCT HCT
JESD-30 code R-PDSO-G14 R-PDSO-G14 R-PDSO-G14 R-PDSO-G14 R-PDSO-G14 R-PDSO-G14 R-PDSO-G14
JESD-609 code e4 e4 e4 e4 e4 e4 e4
length 6.2 mm 6.2 mm 8.65 mm 5 mm 6.2 mm 8.65 mm 8.65 mm
Load capacitance (CL) 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF
Logic integrated circuit type NAND GATE NAND GATE NAND GATE NAND GATE NAND GATE NAND GATE NAND GATE
MaximumI(ol) 0.004 A 0.004 A 0.004 A 0.004 A 0.004 A 0.004 A 0.004 A
Humidity sensitivity level 1 1 1 1 1 1 1
Number of functions 1 1 1 1 1 1 1
Number of entries 8 8 8 8 8 8 8
Number of terminals 14 14 14 14 14 14 14
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SSOP SSOP SOP TSSOP SSOP SOP SOP
Encapsulate equivalent code SSOP14,.3 SSOP14,.3 SOP14,.25 TSSOP14,.25 SSOP14,.3 SOP14,.25 SOP14,.25
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Celsius) 260 260 260 260 260 260 260
power supply 5 V 2/6 V 2/6 V 2/6 V 2/6 V 5 V 5 V
Prop。Delay @ Nom-Sup 42 ns 39 ns 39 ns 39 ns 39 ns 42 ns 42 ns
propagation delay (tpd) 42 ns 39 ns 39 ns 39 ns 39 ns 42 ns 42 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Schmitt trigger NO NO NO NO NO NO NO
Maximum seat height 2 mm 2 mm 1.75 mm 1.1 mm 2 mm 1.75 mm 1.75 mm
Maximum supply voltage (Vsup) 5.5 V 6 V 6 V 6 V 6 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 2 V 2 V 2 V 2 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal surface NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.65 mm 0.65 mm 1.27 mm 0.65 mm 0.65 mm 1.27 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature 30 30 30 30 30 30 30
width 5.3 mm 5.3 mm 3.9 mm 4.4 mm 5.3 mm 3.9 mm 3.9 mm
Base Number Matches 1 1 1 1 1 1 1
method of packing TAPE AND REEL BULK PACK BULK PACK BULK PACK TAPE AND REEL BULK PACK -

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2371  1006  2303  350  377  48  21  47  8  5 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号