MM74C922N datasheet, PDF - EEWORLD Datasheet

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MM74C922N: DescriptionCMOS SERIES, 8-BIT ENCODER, PDIP18, PLASTIC, DIP-18; Categorylogic; File Size463KB，12 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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MM74C922N Overview

CMOS SERIES, 8-BIT ENCODER, PDIP18, PLASTIC, DIP-18

MM74C922N Parametric

Parameter Name	Attribute value
Maker	Texas Instruments
Parts packaging code	DIP
package instruction	PLASTIC, DIP-18
Contacts	18
Reach Compliance Code	unknown
Is Samacsys	N
series	CMOS
JESD-30 code	R-PDIP-T18
length	21.78 mm
Logic integrated circuit type	ENCODER
Number of digits	8
Number of functions	1
Number of terminals	18
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
propagation delay (tpd)	150 ns
Maximum seat height	5.08 mm
Maximum supply voltage (Vsup)	15 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	7.62 mm
Base Number Matches	1

MM74C922N Related Products

	MM74C922N	MM74C922J	MM74C922M	MM74C923N	MM74C923M
Description	CMOS SERIES, 8-BIT ENCODER, PDIP18, PLASTIC, DIP-18	CMOS SERIES, 8-BIT ENCODER, CDIP18, CERAMIC, DIP-18	CMOS SERIES, 8-BIT ENCODER, PDSO20, PLASTIC, SOP-20	CMOS SERIES, 9-BIT ENCODER, PDIP20, PLASTIC, DIP-20	CMOS SERIES, 9-BIT ENCODER, PDSO20, PLASTIC, SOP-20
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Parts packaging code	DIP	DIP	SOIC	DIP	SOIC
package instruction	PLASTIC, DIP-18	CERAMIC, DIP-18	PLASTIC, SOP-20	PLASTIC, DIP-20	PLASTIC, SOP-20
Contacts	18	18	20	20	20
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown
Is Samacsys	N	N	N	N	N
series	CMOS	CMOS	CMOS	CMOS	CMOS
JESD-30 code	R-PDIP-T18	R-GDIP-T18	R-PDSO-G20	R-PDIP-T20	R-PDSO-G20
length	21.78 mm	23.24 mm	12.8 mm	26.075 mm	12.8 mm
Logic integrated circuit type	ENCODER	ENCODER	ENCODER	ENCODER	ENCODER
Number of digits	8	8	8	9	9
Number of functions	1	1	1	1	1
Number of terminals	18	18	20	20	20
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	SOP	DIP	SOP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	SMALL OUTLINE	IN-LINE	SMALL OUTLINE
propagation delay (tpd)	150 ns	150 ns	150 ns	150 ns	150 ns
Maximum seat height	5.08 mm	5.08 mm	2.65 mm	5.08 mm	2.65 mm
Maximum supply voltage (Vsup)	15 V	15 V	15 V	15 V	15 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	YES	NO	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	GULL WING	THROUGH-HOLE	GULL WING
Terminal pitch	2.54 mm	2.54 mm	1.27 mm	2.54 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL
width	7.62 mm	7.62 mm	7.5 mm	7.62 mm	7.5 mm
Base Number Matches	1	1	1	1	1

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