EEWORLDEEWORLDEEWORLD

Part Number

Search

MSDM50-12

Description
Discrete Semiconductor Modules Power Module - Diode
CategoryDiscrete semiconductor    diode   
File Size113KB,4 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Environmental Compliance
Download Datasheet Parametric View All

MSDM50-12 Online Shopping

Suppliers Part Number Price MOQ In stock  
MSDM50-12 - - View Buy Now

MSDM50-12 Overview

Discrete Semiconductor Modules Power Module - Diode

MSDM50-12 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerMicrosemi
package instructionR-XUFM-X5
Contacts5
Manufacturer packaging codeCASE M2-1
Reach Compliance Codecompliant
Minimum breakdown voltage1200 V
Shell connectionISOLATED
ConfigurationBRIDGE, 6 ELEMENTS
Diode component materialsSILICON
Diode typeBRIDGE RECTIFIER DIODE
JESD-30 codeR-XUFM-X5
Maximum non-repetitive peak forward current460 A
Number of components6
Phase3
Number of terminals5
Maximum operating temperature150 °C
Minimum operating temperature-40 °C
Maximum output current50 A
Package body materialUNSPECIFIED
Package shapeRECTANGULAR
Package formFLANGE MOUNT
Maximum repetitive peak reverse voltage1200 V
surface mountNO
Terminal formUNSPECIFIED
Terminal locationUPPER
MSDM50
Glass Passivated Three
Phase Rectifier Bridge
V
RRM
800 to 1800V
I
D
50 Amp
Applications
Three phase rectifiers for power supplies
Rectifiers for DC motor field supplies
Battery charger rectifiers
Input rectifiers for variable frequency drives
Circuit
+
~
~
~
Module Type
TYPE
MSDM50-08
MSDM50-12
MSDM50-16
MSDM50-18
Features
Three phase bridge rectifier
Blocking voltage:800 to 1800V
Heat transfer through aluminum oxide DBC
ceramic isolated metal baseplate
Glass passivated chip
Maximum Ratings
Symbol
I
D
Item
Output current (D.C)
Forward surge current, max.
Value for fusing
Isolation Breakdown Voltage(R.M.S)
Operating Junction Temperature
Storage Temperature
To terminals(M5)
To heatsink(M5)
Approximate Weight
I
FSM
i
2
t
Visol
Tvj
Tstg
Mounting
Torque
Weight
Thermal Characteristics
Symbol
Item
R
th(j-c)
Thermal Impedance, max.
Electrical Characteristics
Symbol
V
FM
Item
Forward Voltage Drop, max.
Repetitive Peak Reverse Current,
max.
I
RRM
MSDM50-Rev0
Oct, 2011
-
V
RRM
800V
1200V
1600V
1800V
V
RSM
900V
1300V
1700V
1900V
Conditions
Tc=110℃
t=10mS Tvj =45℃
a.c.50HZ;r.m.s.;1min
Values
50
460
1050
3000
-40 to +150
-40 to +150
3±15%
5±15%
Units
A
A
A
2
s
V
Nm
Nm
g
Module
145
Conditions
Per Module
Values
0.28
Units
℃/W
Conditions
T=25℃ I
F
=150A
T
vj
=25℃ V
RD
=V
RRM
T
vj
=150℃ V
RD
=V
RRM
1/3
Values
Min.
Typ.
1.45
Max.
1.80
0.3
5
Units
V
mA
mA
www.microsemi.com

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1122  317  995  327  2387  23  7  21  49  18 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号