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BZD27C30P-HE3-18

Description
Zener Diodes ZENER DIODE SMF DO219-HE3
CategoryDiscrete semiconductor    diode   
File Size122KB,8 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Environmental Compliance
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BZD27C30P-HE3-18 Overview

Zener Diodes ZENER DIODE SMF DO219-HE3

BZD27C30P-HE3-18 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerVishay
Parts packaging codeDO-219AB
package instructionR-PDSO-F2
Contacts2
Reach Compliance Codecompliant
ECCN codeEAR99
Factory Lead Time10 weeks
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
JEDEC-95 codeDO-219AB
JESD-30 codeR-PDSO-F2
JESD-609 codee3
Humidity sensitivity level1
Number of components1
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
polarityUNIDIRECTIONAL
Maximum power dissipation0.8 W
GuidelineAEC-Q101
Nominal reference voltage30 V
surface mountYES
technologyZENER
Terminal surfaceMatte Tin (Sn)
Terminal formFLAT
Terminal locationDUAL
Maximum time at peak reflow temperature30
Maximum voltage tolerance6.67%
Working test current25 mA
BZD27C Series
www.vishay.com
Vishay Semiconductors
Zener Diodes with Surge Current Specification
FEATURES
• Sillicon planar Zener diodes
• Low profile surface-mount package
• Zener and surge current specification
• Low leakage current
• Excellent stability
17249
Available
• Meets MSL level 1, per J-STD-020, LF maximum peak
of 260 °C
• Meets JESD 201 class 2 whisker test
UNIT
V
mA
V
V
W
°C
VALUE
3.6 to 200
5 to 100
7 to 188
6.2 to 160
150
175
Pulse current
Single
Uni-directional
PRIMARY CHARACTERISTICS
PARAMETER
V
Z
range nom.
Test current I
ZT
V
BR
V
WM
P
PPM
T
J
max.
V
Z
specification
Circuit configuration
Polarity
• ESD capability according to AEC-Q101:
human body model: > 8 kV
machine model: > 800 V
• Wave and reflow solderable
• AEC-Q101 qualified available
• Base P/N-E3 - RoHS-compliant, and commercial grade
• Base P/N-HE3 - RoHS-compliant, and AEC-Q101 qualified
• Material categorization: for definitions of compliance
please see
www.vishay.com/doc?99912
ORDERING INFORMATION
DEVICE NAME
ORDERING CODE
BZD27C3V6P-E3-08 to BZD27C200P-E3-08
BZD27C Series
BZD27C3V6P-HE3-08 to BZD27C200P-HE3-08
BZD27C3V6P-E3-18 to BZD27C200P-E3-18
BZD27C3V6P-HE3-18 to BZD27C200P-HE3-18
TAPED UNITS PER REEL
3000 per 7" reel (8 mm tape)
10 000 per 13" reel (8 mm tape)
MINIMUM ORDER QUANTITY
30 000/box
50 000/box
PACKAGE
PACKAGE NAME
SMF (DO-219AB)
WEIGHT
15 mg
MOLDING COMPOUND
FLAMMABILITY RATING
UL 94 V-0
MOISTURE SENSITIVITY WHISKER TEST
LEVEL
ACC. JESD 201
MSL level 1
(according J-STD-020)
class 2
SOLDERING CONDITIONS
Peak temperature max. 260 °C
ABSOLUTE MAXIMUM RATINGS
(T
amb
= 25 °C, unless otherwise specified)
PARAMETER
Power dissipation
Non repetitive peak surge power dissipation
(2)
Junction to lead
Junction to ambient air
Junction temperature
Storage temperature range
Operating temperature range
Notes
(1)
Mounted on epoxy-glass PCB with 3 mm x 3 mm Cu pads ( 40 μm thick)
(2)
T = 25 °C prior to surge
J
Rev. 1.5, 10-Oct-17
Document Number: 85153
1
For technical questions within your region:
DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
Mounted on epoxy-glass PCB with
3 mm x 3 mm Cu pads
( 40 μm thick)
TEST CONDITION
T
L
= 105 °C
T
A
= 30 °C
(1)
SYMBOL
P
tot
P
tot
P
ZSM
P
RSM
R
thJL
R
thJA
T
j
T
stg
T
op
VALUE
2300
800
300
150
30
180
175
-65 to +175
-65 to +175
UNIT
mW
mW
W
W
K/W
K/W
°C
°C
°C
100 μs square pulse
10/1000 μs waveform
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