The MAX6477–MAX6484 are constructed using a unique set of packaging techniques that impose a limit on the thermal pro-
file the devices can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder
profiles recommended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and
Convection reflow. Pre-heating is required. Hand or wave soldering is not allowed.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V
IN
= (V
OUT
+ 0.5V) or +2.5V, whichever is greater, C
OUT
= 3.3µF, T
A
= -40°C to +85°C. Typical specifications are at T
A
= +25°C,
unless otherwise noted.) (Note 2)
PARAMETER
Input Voltage Range
Input Undervoltage Lockout
Supply Current (Ground Current)
Shutdown Supply Current
REGULATOR CIRCUIT
Output Current
Output Voltage Accuracy (Fixed
Output Voltage Operation,
Table 1) MAX6469–MAX6476
Output Voltage Accuracy (Fixed
Output Voltage Operation,
Table 1) MAX6477–MAX6484
Adjustable Output Voltage Range
SET Reference Voltage
SET Dual Mode
TM
Threshold
SET Input Leakage Current
1mA
≤
I
OUT
≤
150mA, T
A
= +25°C
1mA
≤
I
OUT
≤
150mA, T
A
= -40°C to +85°C
1mA
≤
I
OUT
≤
300mA, T
A
= -40°C to +85°C
2mA
≤
I
OUT
≤
100mA, T
A
= +25°C
2mA
≤
I
OUT
≤
100mA, T
A
= -40°C to +85°C
2mA
≤
I
OUT
≤
300mA, T
A
= -40°C to +85°C
(Note 3)
V
SET
I
SET
V
SET
= 0V, +1.2V (Note 3)
SYMBOL
V
IN
V
UVLO
I
Q
I
SHDN
V
IN
falling
I
OUT
= 0A
I
OUT
= 300mA
T
A
= +25°C
300
-1.3
-2.3
-2.7
-1.1
-2.0
-2.5
V
SET
1.200
CONDITIONS
MIN
2.5
2.25
82
96
0.1
TYP
MAX
5.5
2.47
136
1
UNITS
V
V
µA
µA
mA
+1.3
+2.3
+2.7
+1.1
+2.0
+2.5
5.0
1.258
±100
V
V
mV
nA
%
%
1.229
185
±20
Dual Mode is a trademark of Maxim Integrated Products, Inc.
[align=left][size=4][color=#000000] Today, with memory and pin counts increasing, we sometimes hear people ask why we continue to develop and release microcontrollers (MCUs) with as little as a few ki...
When simulating the open-loop frequency characteristics of LDO, it was found that many conjugate pole-zero pairs appeared, which seriously affected the loop stability. For example, the following one: ...
I have tested the board under low voltage before, but this time I will test it under high temperature. Since I have left school, the conditions are limited and I cannot reach the manual limit temperat...
With the booming electronics industry, vision systems have become a leader in the electronics automation sector. However, the delicate nature of electronic products often affects product yields due...[Details]
While
the solid-state battery
industry is still engaged in a long technological marathon for
the "ultimate solution" for
electric vehicles
, some companies have begun looking for mor...[Details]
Nios II is a configurable 16-/32-bit RISC processor. Combined with a rich set of peripheral-specific instructions and hardware acceleration units, it provides a highly flexible and powerful SOPC sy...[Details]
ISP devices, such as field programmable devices (FPGAs and CPLDs), do not require a programmer. Using programming kits provided by the device manufacturer, they employ a top-down modular design app...[Details]
On August 24th, media outlets reported, citing sources, that NavInfo, a listed company on the A-share market, is nearing completion in its acquisition of the intelligent driving c...[Details]
As the number of cars increases, environmental pressures are also increasing. At this time, some people are saying that new energy vehicles are energy-efficient and environmentally friendly, and ar...[Details]
The most significant feature of IPS panels is that both electrodes are located on the same surface, unlike other LCD panels, which have electrodes arranged on top and bottom surfaces in a three-dim...[Details]
In recent years, with the application of the IEC61850 standard and the development and deployment of optoelectronic transformers, the concept of digital substations has been put into practical use ...[Details]
Amidst the wave of intelligent automotive transformation, advanced driver assistance is gradually emerging from cutting-edge technology into the mainstream, becoming a new frontier of industry comp...[Details]
Zos Automotive Research Institute released the "2025
Smart Cockpit
Tier 1 Research Report (Domestic Edition)."
This report analyzes the operating conditions of more than a dozen ...[Details]
Charging is a familiar process for new energy vehicles, and as a source of battery energy, charging piles are crucial. New energy vehicle charging can be divided into fast charging and slow chargin...[Details]
Reflow soldering is one of the most commonly used methods in electronics manufacturing, allowing for the soldering of large numbers of components in a relatively short time. However, any experience...[Details]
Through AI connection technology supported by Qualcomm X85 5G modem and RF and Qualcomm FastConnect 7900 mobile connection system, seamless switching can be achieved between cellular net...[Details]
During daily operation of an R-type power transformer, the voltage used varies as the equipment being used adjusts. This raises the question: can the transformer change voltage at this point? The a...[Details]
On August 22, the Wall Street Journal reported on the 21st local time that the new US government does not plan to acquire equity in semiconductor wafer foundry giant TSMC and Micron, one of the thr...[Details]