SPC564A70B4CFAY datasheet, PDF

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SPC564A70B4CFAY: Description32-bit Microcontrollers - MCU 32-bit Pwr Architect MCU Auto Chassis; Categorysemiconductor The embedded processor and controller; File Size812KB，133 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/; Environmental Compliance

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32-bit Microcontrollers - MCU 32-bit Pwr Architect MCU Auto Chassis

SPC564A70B4CFAY Parametric

Parameter Name	Attribute value
Product Attribute	Attribute Value
Manufacturer	STMicroelectronics
Product Category	32-bit Microcontrollers - MCU
RoHS	Details
Packaging	Tray
Moisture Sensitive	Yes
Factory Pack Quantity	360

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SPC564A70B4, SPC564A70L7

32-bit Power Architecture

based MCU for automotive

powertrain applications

Datasheet

−

preliminary data

Features

■

150 MHz e200z4 Power Architecture

core

– Variable length instruction encoding (VLE)

– Superscalar architecture with 2 execution

units

– Up to 2 integer or floating point instructions

per cycle

– Up to 4 multiply and accumulate operations

per cycle

Memory organization

– 2 MB on-chip flash memory with ECC and

read-while-write (RWW)

– 128 KB on-chip SRAM with standby

functionality (32 KB) and ECC

– 8 KB instruction cache (with line locking),

configurable as 2- or 4-way

– 14 + 3 KB eTPU code and data RAM

– 4

4 crossbar switch (XBAR)

– 24-entry MMU

Fail Safe Protection

– 16-entry Memory Protection Unit (MPU)

– CRC unit with 3 submodules

– Junction temperature sensor

Interrupt

– Configurable interrupt controller (INTC)

with non-maskable interrupt (NMI)

– 64-channel eDMA

Serial channels

– 3 eSCI modules

– 3 DSPI modules (2 of which support

downstream Micro Second Channel [MSC])

– 3 FlexCAN modules with 64 message

buffers each

Device summary

PBGA324 (23 mm x 23 mm)

LQFP176 (24 mm x 24 mm)

– 1 FlexRay module (V2.1) up to 10 Mbit/s

w/dual or single channel, 128 message

objects, ECC

■

1 eMIOS (24 unified channels)

1 eTPU2 (second generation eTPU)

– 32 standard channels

– 1 reaction module (6 channels with 3

outputs per channel)

2 enhanced queued analog-to-digital

converters (eQADCs)

– Forty 12-bit input channels

– 688 ns minimum conversion time

On-chip CAN/SCI Bootstrap loader with Boot

Assist Module (BAM)

Nexus: Class 3+ for core; Class 1 for eTPU

JTAG (5-pin)

Development Trigger Semaphore (DTS)

Clock generation

– On-chip 4–40 MHz main oscillator

– On-chip FMPLL (frequency-modulated

phase-locked loop)

Up to 112 general purpose I/O lines

Power reduction modes: slow, stop, and

standby

Flexible supply scheme

– 5 V single supply with external ballast

– Multiple external supply: 5 V, 3.3 V , and

1.2 V

Designed for LQFP176, LBGA208, PBGA324

■

Table 1.

Memory Flash size

2MB

Part number

Package LQFP176

SPC564A70L7

Package LBGA208

Package PBGA324

SPC564A70B4

September 2013

Doc ID 18078 Rev 4

1/133

www.st.com

This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to

change without notice.

Contents

SPC564A70B4, SPC564A70L7

Contents

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

1.1

1.2

1.3

1.4

1.5

Document overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Device feature summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Feature details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

1.5.1

1.5.2

1.5.3

1.5.4

1.5.5

1.5.6

1.5.7

1.5.8

1.5.9

1.5.10

1.5.11

1.5.12

1.5.13

1.5.14

1.5.15

1.5.16

1.5.17

1.5.18

1.5.19

1.5.20

1.5.21

1.5.22

1.5.23

1.5.24

1.5.25

1.5.26

1.5.27

1.5.28

e200z4 core . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Crossbar switch (XBAR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Enhanced direct memory access (eDMA) . . . . . . . . . . . . . . . . . . . . . . . 16

Interrupt controller (INTC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Memory protection unit (MPU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Frequency-modulated phase-locked loop (FMPLL) . . . . . . . . . . . . . . . . 18

System integration unit (SIU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Flash memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Static random access memory (SRAM) . . . . . . . . . . . . . . . . . . . . . . . . . 21

Boot assist module (BAM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Enhanced modular input/output system (eMIOS) . . . . . . . . . . . . . . . . . 21

Second generation enhanced time processing unit (eTPU2) . . . . . . . . 22

Reaction module (REACM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Enhanced queued analog-to-digital converter (eQADC) . . . . . . . . . . . . 24

Deserial serial peripheral interface (DSPI) . . . . . . . . . . . . . . . . . . . . . . 26

Enhanced serial communications interface (eSCI) . . . . . . . . . . . . . . . . 27

Controller area network (FlexCAN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

FlexRay . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

System timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

Software watchdog timer (SWT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Cyclic redundancy check (CRC) module . . . . . . . . . . . . . . . . . . . . . . . . 30

Error correction status module (ECSM) . . . . . . . . . . . . . . . . . . . . . . . . . 30

Peripheral bridge (PBRIDGE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Calibration bus interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Power management controller (PMC) . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Nexus port controller (NPC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

JTAG controller (JTAGC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Development trigger semaphore (DTS) . . . . . . . . . . . . . . . . . . . . . . . . . 32

2/133

Doc ID 18078 Rev 4

SPC564A70B4, SPC564A70L7

Contents

Pinout and signal description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

2.1

2.2

2.3

2.4

2.5

LQFP176 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

LBGA208 ballmap . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

PBGA324 ballmap . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

Signal summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

Signal details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63

Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69

3.1

3.2

3.3

3.4

3.5

3.6

Parameter classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69

Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70

Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72

3.3.1

General notes for specifications at maximum junction temperature . . . 73

EMI (electromagnetic interference) characteristics . . . . . . . . . . . . . . . . . 76

Electrostatic discharge (ESD) characteristics . . . . . . . . . . . . . . . . . . . . . 76

Power management control (PMC) and power on reset (POR) electrical

specifications 77

3.6.1

3.6.2

Regulator example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79

Recommended power transistors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81

3.7

3.8

3.9

Power up/down sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81

DC electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82

I/O pad current specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87

3.9.1

3.9.2

I/O pad V

RC33

current specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . 88

LVDS pad specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90

3.10

3.11

3.12

3.13

3.14

3.15

3.16

3.17

Oscillator and PLLMRFM electrical characteristics . . . . . . . . . . . . . . . . . 90

Temperature sensor electrical characteristics . . . . . . . . . . . . . . . . . . . . . 92

eQADC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93

Configuring SRAM wait states . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95

Platform flash controller electrical characteristics . . . . . . . . . . . . . . . . . . 96

Flash memory electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 96

AC specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98

3.16.1

Pad AC specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98

AC timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102

3.17.1

3.17.2

3.17.3

Reset and configuration pin timing . . . . . . . . . . . . . . . . . . . . . . . . . . . 102

IEEE 1149.1 interface timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102

Nexus timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106

Doc ID 18078 Rev 4

3/133

SPC564A70B4, SPC564A70L7

List of tables

Table 1.

Table 2.

Table 3.

Table 4.

Table 5.

Table 6.

Table 7.

Table 8.

Table 9.

Table 10.

Table 11.

Table 12.

Table 13.

Table 14.

Table 15.

Table 16.

Table 17.

Table 18.

Table 19.

Table 20.

Table 21.

Table 22.

Table 23.

Table 24.

Table 25.

Table 26.

Table 27.

Table 28.

Table 29.

Table 30.

Table 31.

Table 32.

Table 33.

Table 34.

Table 35.

Table 36.

Table 37.

Table 38.

Table 39.

Table 40.

Table 41.

Table 42.

Table 43.

Table 44.

Table 45.

Table 46.

Table 47.

Table 48.

Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

SPC564A70 device feature summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

SPC564A70 series block summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

SPC564A70 signal properties. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

Pad types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63

Signal details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63

Power/ground segmentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68

Parameter classifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69

Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70

Thermal characteristics for 176-pin LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72

Thermal characteristics for 208-pin LBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72

Thermal characteristics for 324-pin PBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73

EMI testing specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76

ESD ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76

PMC operating conditions and external regulators supply voltage . . . . . . . . . . . . . . . . . . . 77

PMC electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77

SPC564A70 External network specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80

Transistor recommended operating characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81

Power sequence pin states—Fast type pads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81

Power sequence pin states—Medium, slow and multi-voltage type pads . . . . . . . . . . . . . 81

DC electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82

I/O pad average I

DDE

specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87

I/O pad V

RC33

average I

DDE

specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89

RC33

pad average DC current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89

DSPI LVDS pad specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90

PLLMRFM electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90

Temperature sensor electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92

eQADC conversion specifications (operating) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93

eQADC single ended conversion specifications (operating). . . . . . . . . . . . . . . . . . . . . . . . 93

eQADC differential ended conversion specifications (operating) . . . . . . . . . . . . . . . . . . . . 94

Cutoff frequency for additional SRAM wait state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95

APC, RWSC, WWSC settings vs. frequency of operation . . . . . . . . . . . . . . . . . . . . . . . . . 96

Flash program and erase specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96

Flash EEPROM module life . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97

Pad AC specifications (V

DDE

= 4.75 V). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98

Pad AC specifications (V

DDE

= 3.0 V). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99

Reset and configuration pin timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102

JTAG pin AC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102

Nexus debug port timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106

Nexus debug port operating frequency. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109

Calibration bus interface maximum operating frequency . . . . . . . . . . . . . . . . . . . . . . . . . 110

Calibration bus operation timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110

External interrupt timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114

eTPU timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114

eMIOS timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115

DSPI channel frequency support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115

DSPI timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115

eQADC SSI timing characteristics (pads at 3.3 V or at 5.0 V) . . . . . . . . . . . . . . . . . . . . . 121

Doc ID 18078 Rev 4

5/133

SPC564A70B4CFAY Related Products

	SPC564A70B4CFAY	SPC564A70B4COBR	SPC564A70B4CFAR
Description	32-bit Microcontrollers - MCU 32-bit Pwr Architect MCU Auto Chassis	32-bit Microcontrollers - MCU 32-bit Pwr Architect MCU Auto Chassis	32-bit Microcontrollers - MCU 32-bit Pwr Architect MCU Auto Chassis
Product Attribute	Attribute Value	Attribute Value	Attribute Value
Manufacturer	STMicroelectronics	STMicroelectronics	STMicroelectronics
Product Category	32-bit Microcontrollers - MCU	32-bit Microcontrollers - MCU	32-bit Microcontrollers - MCU
RoHS	Details	Details	Details
Packaging	Tray	Reel	Reel
Moisture Sensitive	Yes	Yes	Yes
Factory Pack Quantity	360	350	350

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