I use LPC2378. I can find the chip almost all the time using H-JTAG. But when I use H-FLASHER, I can only find "Target:ARM7TDMI-S Little-Endian" and "Flash:ERROR". I have selected LPC 2378 and LPC2378...
I made a PWM circuit to control a DC motor. After compiling it in C language, there are 5 warnings when running it in Keil. I don't know where the error is. I would appreciate your advice. See the ori...
[i=s] This post was last edited by jameswangsynnex on 2015-3-3 20:03 [/i] The CS1610EP static VFD display driver circuit provides a very detailed driver circuit....
I use STM32F767 as the lower computer. It sends data to the computer every 50ms through the network port. The data is sent for 10 seconds and the computer displays it. The measured graph is shown abov...
As the title says: I want to write a FTP file upload program in winCE, vs2005 using VC++ to build a dialog-based smart device MFC application. When including the afxinet.h header file, the following e...
Flip-chip and ball grid array (BGA) are two widely used packaging technologies in the electronics industry. Each has its own advantages and limitations, and in some cases, they can complement each ...[Details]
Nios II is a configurable 16-/32-bit RISC processor. Combined with a rich set of peripheral-specific instructions and hardware acceleration units, it provides a highly flexible and powerful SOPC sy...[Details]
As more and more consumers purchase new energy vehicles, the safety of electric vehicles has become a major concern. This has been particularly prominent following a series of electric vehicle fire...[Details]
With the rapid development of technology, automotive intelligence is increasing at an unprecedented rate. This not only enhances vehicle functionality and comfort, but also places higher deman...[Details]
The mass production process of the new generation of cockpit platform has started, and the smart cockpit market has entered a new bonus cycle of technology iteration and platform upgrade.
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In mobile technology, sensors are the primary input for measured signals and form a component of a sensor system. They include sensitive and transducer elements connected to carriers and circuits. ...[Details]
According to foreign media reports, BMW has just been granted a patent for a screen that could cover the entire roof. BMW hopes to transform at least a portion of the vehicle's headliner into a dis...[Details]
Linear motor modules have become the "sweet spot" in various fields due to their advantages such as long stroke, fast speed, high precision, smooth operation and long life. Different models of line...[Details]
According to foreign media reports, Ford Motor has applied to the U.S. Patent and Social Security Office (USPTO) for a patent for a door anti-collision system that may be used in future Ford vehicl...[Details]
The mobile computing market is rapidly evolving, and manufacturers are fiercely competing for market share. A key area of competition is battery life, which encompasses two key aspects: how long th...[Details]
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As core electronic components used in vastly different fields, automotive-grade chips and mobile/consumer-grade chips exhibit significant differences in their...[Details]
As the power density of modern electronic systems continues to increase, effective thermal management has become critical to ensuring system performance, reliability, and longevity—especially in hi...[Details]
Today, the voltage of electronic products continues to rise to 400V, 600V and even 1000V, so there are few electronic load models that can handle such high voltages. Many people consider connecting...[Details]
With rapid economic development, the types of pollution sources are increasing, especially in chemical and industrial zones and their surroundings. The patterns of pollution and the types of ecolog...[Details]
On August 19, Reuters reported that people familiar with the matter said that Nvidia is developing a new AI chip based on its latest Blackwell architecture for the Chinese market. The performance o...[Details]