Si860x Data Sheet
Bidirectional I
2
C Isolators with Unidirectional Digital Channels
The Si860x series of isolators are single-package galvanic isolation solutions for I
2
C and
SMBus serial port applications. These products are based on Silicon Labs proprietary
RF isolation technology and offer shorter propagation delays, lower power consumption,
smaller installed size, and more stable operation with temperature and age versus opto
couplers or other digital isolators.
All devices in this family include hot-swap, bidirectional SDA and/or SCL isolation chan-
nels with open-drain, 35 mA sink capability that operate to a maximum frequency of 1.7
MHz. The 8-pin version (Si8600) supports bidirectional SDA and SCL isolation; the
Si8602 supports bidirectional SDA and unidirectional SCL isolation, and the 16-pin ver-
sions (Si8605, Si8606) feature two unidirectional isolation channels to support additional
system signals, such as interrupts or resets. All versions contain protection circuits to
guard against data errors when an unpowered device is inserted into a powered system.
Small size, low installed cost, low power consumption, and short propagation delays
make the Si860x family the optimum solution for isolating I
2
C and SMBus serial ports.
Automotive Grade is available for certain part numbers. These products are built using
automotive-specific flows at all steps in the manufacturing process to ensure the robust-
ness and low defectivity required for automotive applications.
Industrial Applications
• Isolated I
2
C, SMBus
•
Isolated digital power supply
communications
• Power over Ethernet
• Motor Control Systems
• Hot-swap applications
• Intelligent Power systems
Safety Regulatory Approvals
• UL 1577 recognized
• Up to 5000 V
RMS
for 1 minute
• CSA component notice 5A approval
• IEC 60950-1, 61010-1, 60601-1 (re-
inforced insulation)
• VDE certification conformity
• Si863xxT options certified to rein-
forced VDE 0884-10
• All other options certified to IEC
60747-5-5 and reinforced 60950-1
• CQC certification approval
• GB4943.1
Automotive Applications
• On-board chargers
• Battery management systems
• Charging stations
• Traction inverters
• Hybrid Electric Vehicles
• Battery Electric Vehicles
KEY FEATURES
• Independent, bidirectional SDA and SCL
isolation channels
• Open drain outputs with 35 mA sink
current
• Supports I
2
C clocks up to 1.7 MHz
• Unidirectional isolation channels support
additional system signals (Si8605, Si8606)
• Up to 5000 VRMS isolation
• UL, CSA, VDE, CQC recognition
• 60-year life at rated working voltage
• High electromagnetic immunity
• Wide operating supply voltage
• 3.0 to 5.5 V
• Wide temperature range
• –40 to +125 °C
• Transient immunity 50 kV/µs
• AEC-Q100 qualification
• RoHS-compliant packages
• SOIC-8 narrow body
• SOIC-16 wide body
• SOIC-16 narrow body
• RoHS-compliant packages
• SOIC-16 wide body
• SOIC-16 narrow body
• SOIC-8 narrow body
• Automotive-grade OPNs available
• AIAG compliant PPAP documentation
support
• IMDS and CAMDS listing support
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Rev. 1.71
Si860x Data Sheet
Ordering Guide
1. Ordering Guide
Table 1.1. Ordering Guide
1, 2
Ordering Part
Number (OPN)
Number of Bi-
directional
2
C Channels
I
Max I
2
C Bus
Speed (MHz)
Number of
Unidirection-
al Non-I
2
C
Channels
Max Data
Rate of
Non-I
2
C Uni-
directional
Channels
(Mbps)
—
—
—
10
10
10
10
Isolation
Ratings
(kVrms)
Temp Range
(°C)
Package
Si8600AB-B-IS
Si8600AC-B-IS
Si8600AD-B-IS
Si8602AB-B-IS
Si8602AC-B-IS
Si8602AD-B-IS
Si8605AB-B-IS1
2
2
2
1
1
1
2
1.7
1.7
1.7
1.7
1.7
1.7
1.7
0
0
0
1
1
1
1 Forward
1 Reverse
2.5
3.75
5.0
2.5
3.75
5.0
2.5
–40 to 125
–40 to 125
–40 to 125
–40 to 125
–40 to 125
–40 to 125
–40 to 125
NB SOIC-8
NB SOIC-8
WB SOIC-16
NB SOIC-8
NB SOIC-8
WB SOIC-16
NB SOIC-16
Si8605AC-B-IS1
2
1.7
1 Forward
1 Reverse
10
3.75
–40 to 125
NB SOIC-16
Si8605AD-B-IS
2
1.7
1 Forward
1 Reverse
10
5.0
–40 to 125
WB SOIC-16
Si8606AC-B-IS1
Si8606AD-B-IS
2
2
1.7
1.7
2 Forward
2 Forward
10
10
3.75
5.0
–40 to 125
–40 to 125
NB SOIC-16
WB SOIC-16
Note:
1. All packages are RoHS-compliant with peak reflow temperature of 260 °C according to the JEDEC industry standard classifica-
tions and peak solder temperature.
2. “Si” and “SI” are used interchangeably.
3. An "R" at the end of the part number denotes tape and reel packaging option.
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Rev. 1.71 | 2
Si860x Data Sheet
Ordering Guide
Automotive Grade OPNs
Automotive-grade devices are built using automotive-specific flows at all steps in the manufacturing process to ensure robustness and
low defectivity. These devices are supported with AIAG-compliant Production Part Approval Process (PPAP) documentation, and fea-
ture International Material Data System (IMDS) and China Automotive Material Data System (CAMDS) listing. Qualifications are compli-
ant with AEC-Q100, and a zero-defect methodology is maintained throughout definition, design, evaluation, qualification, and mass pro-
duction steps.
Table 1.2. Ordering Guide for Automotive Grade OPNs
1, 2, 4, 5
Ordering Part
Number (OPN)
Number of
Bi- direction-
al I
2
C Chan-
nels
1
2
Max I
2
C Bus
Speed (MHz)
Isolation Rat-
Max Data
Number of
ing (kV)
Unidirection- Rate of Non-
2
C Uni-direc-
2
C
I
al Non-I
tional Chan-
Channels
nels (Mbps)
1
1 Forward
1 Reverse
Si8606AD-AS
2
1.7
2 Forward
10
5.0
–40 to 125
WB SOIC-16
10
10
5.0
5.0
Temp Range
(°C)
Package
Si8602AD-AS
Si8605AD-AS
1.7
1.7
–40 to 125
–40 to 125
WB SOIC-16
WB SOIC-16
Note:
1. All packages are RoHS-compliant with peak reflow temperatures of 260 °C according to the JEDEC industry standard classifica-
tions.
2. “Si” and “SI” are used interchangeably.
3. An "R" at the end of the part number denotes tape and reel packaging option.
4. Automotive-Grade devices (with an "–A" suffix) are identical in construction materials, topside marking, and electrical parameters
to their Industrial-Grade (with a "–I" suffix) version counterparts. Automotive-Grade products are produced utilizing full automotive
process flows and additional statistical process controls throughout the manufacturing flow. The Automotive-Grade part number is
included on shipping labels.
5. Additional Ordering Part Numbers may be available in Automotive-Grade. Please contact your local Silicon Labs sales represen-
tative for further information.
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Rev. 1.71 | 3
Table of Contents
1. Ordering Guide
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2. System Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1 Theory of Operation .
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. 6
3. Typical Application Overview . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.1 I
2
C Background .
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. 7
. 8
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. 9
3.2 I
2
C Isolator Operation .
3.3 I
2
C Isolator Design Constraints .
3.5 Typical Application Schematics .
3.4 I
2
C Isolator Design Considerations .
4. Device Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.1 Device Startup
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.11
.11
.12
.12
.12
.12
.13
4.2 Undervoltage Lockout .
4.3 Input and Output Characteristics for Non-I
2
C Digital Channels
4.4 Layout Recommendations. .
4.4.1 Supply Bypass . . .
4.4.2 Output Pin Termination.
4.5 Typical Performance Characteristics .
5. Electrical Specifications
5.1 Test Circuits
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. . . . . . . . . . . . . . . . . . . . . . . . . . 14
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.19
6. Pin Descriptions
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
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.24
.25
.26
6.1 Si8600/02 SOIC-8 Package .
6.2 Si8600/02 SOIC-16 Package .
6.3 Si8605/06 SOIC-16 Package .
7. Package Outline: 16-Pin Wide Body SOIC. . . . . . . . . . . . . . . . . . . .
27
8. Land Pattern: 16-Pin Wide-Body SOIC . . . . . . . . . . . . . . . . . . . . . 29
9. Package Outline: 8-Pin Narrow Body SOIC
10. Land Pattern: 8-Pin Narrow Body SOIC
. . . . . . . . . . . . . . . . . . . 30
. . . . . . . . . . . . . . . . . . . . 31
. . . . . . . . . . . . . . . . . . 32
34
11. Package Outline: 16-Pin Narrow Body SOIC
12. Land Pattern: 16-Pin Narrow Body SOIC . . . . . . . . . . . . . . . . . . . .
13. Si860x Top Markings . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
13.1 Top Marking: 16-Pin Wide Body SOIC .
13.2 Top Marking: 8-Pin Narrow Body SOIC .
13.3 Top Marking: 16-Pin Narrow Body SOIC
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.35
.36
.37
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14. Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
38
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