FPGA - Field Programmable Gate Array 6864 LUTs 335 I/O 1.2V 3 SPEED
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | Lattice |
| package instruction | HBGA, BGA484,22X22,40 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| JESD-30 code | S-PBGA-B484 |
| JESD-609 code | e1 |
| length | 23 mm |
| Humidity sensitivity level | 3 |
| Number of entries | 335 |
| Number of logical units | 6864 |
| Output times | 335 |
| Number of terminals | 484 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | HBGA |
| Encapsulate equivalent code | BGA484,22X22,40 |
| Package shape | SQUARE |
| Package form | GRID ARRAY, HEAT SINK/SLUG |
| Peak Reflow Temperature (Celsius) | 250 |
| power supply | 1.2 V |
| Programmable logic type | FIELD PROGRAMMABLE GATE ARRAY |
| Certification status | Not Qualified |
| Maximum seat height | 2.6 mm |
| Maximum supply voltage | 1.26 V |
| Minimum supply voltage | 1.14 V |
| Nominal supply voltage | 1.2 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | OTHER |
| Terminal surface | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal form | BALL |
| Terminal pitch | 1 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | 30 |
| width | 23 mm |
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