IEC 60115-2, IEC 60115-4, JIS C 5201-4, EIAJ RC-2138
●
RoHS compliant
Explanation of Part Numbers
Ex.1 : ERX type
1
2
3
4
5
6
7
8
9
10
11
12
E
R
X
2
S
Z
J
W
1
R
0
E
Product Code
Metal Film
ERX
Resistors
Resistance
Resistance Value
Style · Specification
Tolerance
Small size
The first two digits are significant figures
S
J
±5 %
0.5 W to 5 W
of resistance and the third one denotes
G
±2 %
Small size Anti-heat
number of zeros following.
conducting type
Decimal point is expressed by
F (Fe lead wire)
(Ex.) 1R0 : 1.0
Ω
1 W to 5 W
“Z” is added according to resistance.
The matrix of forming and packaging is as shown in the table below.
Forming & Taping matrix
Resistance
Resistance Value Range (Ω)
Part No. Tolerance
Code
Forming / Packaging
12S 1S 2S 3S 5S 1F 2F 3F 5F
ERX□□SZ
ERX□□S
□···□
Straight lead wire type
±5 %
0.10 to 0.18
0.20 to 9.1
○ ○ ○ ○ ○ ○ ○ ○ ○
ERX12S
□···P
Cut & Forming type
±2 %
0.10 to 0.91
1.0 to 9.1
○ ○ ○ ○ ○
□···V
Axial taping type (Straight lead)
○ ○ ○ ○
ERX1S
±5 %
0.10 to 0.18
0.20 to 9.1
○ ○ ○
U···V Axial taping type (Stand off)
ERX1F
±2 %
0.10 to 0.91
1.0 to 9.1
○ ○ ○
□···E
Radial taping type (E type)
ERX2S
±5 %
0.10 to 0.20
0.22 to 9.1
○ ○ ○
W···E Radial taping type (WE type)
ERX2F
±2 %
0.10 to 0.91
1.0 to 9.1
○ ○ ○ ○
□··H
Cut & Forming type
ERX3S
±5 %
0.10 to 0.20
0.22 to 9.1
○ ○ ○ ○
S···E Radial taping type (SE type)
ERX3F
±2 %
0.10 to 0.91
1.0 to 9.1
○ ○ ○
ERX5S
±5 %
0.33 to 9.1
—
ERX5F
±2 %
1.0 to 9.1
Power Rating at 70 °C
12
0.5 W
1
1W
2
2W
3
3W
5
5W
The above example 1 shows a small metal film resistor, 2 W power rating, resistance value of 1.0
Ω,
tolerance ±5 %, and package of radial taping.
Ex.2 : ERG type
1
2
3
4
5
6
7
8
9
10
11
12
E
R
G
2
S
J
W
1
0
3
E
Product Code
Metal Oxide
ERG
Film Resistors
Power Rating at 70 °C
12
0.5 W
1
1W
2
2W
3
3W
5
5W
Style · Specification
S Small size
0.5 W to 5 W
Small size Anti-heat
conducting type
F
(Fe lead wire)
1 W to 5 W
Resistance
Tolerance
J
±5 %
G
±2 %
Resistance Value
The first two digits are significant figures
of resistance and the third one denotes
number of zeros following.
Decimal point is expressed by
(Ex.) 103 : 10 kΩ
The matrix of forming and packaging is as shown in the table below.
Forming & Taping matrix
Forming / Packaging
Code
12S 1S 2S 3S 5S 1F 2F 3F 5F
□···□
Straight lead wire type
○ ○ ○ ○ ○ ○ ○ ○ ○
□···P
Cut & Forming type
○ ○ ○ ○ ○
□···V
Axial taping type(Straight lead)
○ ○ ○ ○
○ ○ ○
U···V Axial taping type(Stand off)
○ ○ ○
□···E
Radial taping type(E type)
○ ○ ○
W···E Radial taping type(WE type)
○ ○ ○ ○
□···H
Cut & Forming type
○ ○ ○ ○ ○
S···E Radial taping type(SE type)
○ ○ ○
The above example 2 shows a small metal oxide film resistor, 2 W power rating, resistance value of 10 kΩ, tolerance ±5 %, and package of radial taping.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
02 Sep. 2014
Metal (Oxide) Film Resistors
Construction
High reliable metal oxide film (ERG)
High reliable metal plating film
(ERX)
Dimensions in mm (not to scale)
(
Lead wire
S type : Cu wire
F type : Fe wire
)
k
L
k
fd
fD
Dimensions (mm)
Ceramic core
(High thermal conductivity)
Part No.
L
ERG(X)12S
6.35
–0.35
+0.65
0D
2.3
–0.3
2.8
4.0
5.5
8.0
+0.5
k
30.0
30.0
30.0
38.0
38.0
±3.0
0d
0.65
0.65
0.80
±3.0
±0.05
Mass
(Weight)
[g/pc.]
0.26
0.33
0.66
1.47
3.54
Spiralling
turns
Marking
ERG(X)1S
ERG(X)1F
ERG(X)2S
ERG(X)2F
±0.05
±0.05
9.00
+1.50
–1.00
±0.5
±3.0
12.00
–1.00
15.00
24.00
+1.50
±1.0
0.80
0.80
0.80
±0.05
Flame and solvent retardant
End cap
ERG(X)3S
ERG(X)3F
ERG(X)5S
ERG(X)5F
±1.50
±1.0
±3.0
±0.05
±1.50
±1.0
±3.0
±0.05
Ratings
Power
Rating
at 70 °C
(W)
0.5
1
2
3
5
Limiting
Element
(1)
Voltage
(V)
300
350
350
350
500
Maximum Dielectric
Maximum
Intermittent Withstanding
Overload
Overload
Voltage
(2)
Voltage
(3)
Voltage
(V)
(V)
(VAC)
600
600
700
700
1000
600
600
1000
1000
1500
350
350
600
1000
1000
Res.
Tol.
(4)
(%)
G
J
G
J
G
J
G
J
G
J
(±2)
(±5)
(±2)
(±5)
(±2)
(±5)
(±2)
(±5)
(±2)
(±5)
Resistance
(5)
Range (Ω)
min.
1
0.2
1
0.2
1
0.22
1
0.22
1
0.33
(6)
Part No.
Standard
T.C.R.
Resistance
–6
(×10 /°C)
Value
±350
±350
±350
±300
±200
E24
E24
E24
E24
E24
ERG(X)12S
ERG(X)1S
ERG(X)1F
ERG(X)2S
ERG(X)2F
ERG(X)3S
ERG(X)3F
ERG(X)5S
ERG(X)5F
max.
22 k
47 k
68 k
100 k
100 k
100 k
100 k
100 k
100 k
100 k
(1) Rated Continuous Working Voltage (RCWV) shall be determined
from RCWV=√Power Rating×Resistance Value or Limiting Element
Voltage listed above whichever less.
(2) Overload (Short-time Overload) Test Voltage (SOTV) shall be
determined from SOTV=2.5×Power Rating or max. Overload
Voltage listed above whichever less.
(3) Intermittent Overload Test Voltage (IOTV) shall be determined from
IOTV=4.0×Power Rating or max. Intermittent Overload Voltage
listed above whichever less.
(4) Resistance tolerance is of use besides range listed, please inquire.
(5) Resistance Range Type ERG :
>10
Ω
Type ERX :
<9.1
Ω
(6) As for the low resistance value range, "Z" is given to the part
number. (Refer to the explanation of part numbers.)
½
Z type is non standard resistance values.
Code Part No. Res.Tol. Res. Value Range Code Part No. Res.Tol. Res. Value Range
12S
Z
1S
1F
±2 % 0.1 to 0.91
Ω
±5 % 0.1 to 0.18
Ω
±2 % 0.1 to 0.91
Ω
±5 % 0.1 to 0.18
Ω
Z
3S
3F
2S
2F
±2 % 0.1 to 0.91
Ω
±5 % 0.1 to 0.2
Ω
±2 % 0.1 to 0.91
Ω
±5 % 0.1 to 0.2
Ω
Rated Load (%)
Power Derating Curve
For resistors operated in ambient temperatures above
70 °C, power rating shall be derated in accordance
with the figure on the right.
120
–55 °C
100
80
60
ERG(X)12S
40
20
130 °C
0
–60 –40 –20 0
Ambient Temperature (°C)
ERG(X)1S, 1F
ERG(X)2S, 2F
ERG(X)3S, 3F
ERG(X)5S, 5F
235 °C
70 °C
20 40 60 80 100 120 140 160 180 200 220 240
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
02 Sep. 2014
Metal (Oxide) Film Resistors Packaging Methods
Taped & Box
ERG(X)□□S□□□□V
6.0±0.5
fd
Stand-off Taped & Box
ERG(X)□□S□U□□□V
P
H
W
W
H
crush width 0.8 mm (1 W)
1.1 mm (2 W, 3 W)
Part Number
Standard
Quantity
(pcs./box)
2,000
Taping (mm)
P
5.0
±0.3
Box (mm)
W
1
—
—
0
+0.15
0
50×P
250
±2
W
52.0
±1.5
H
—
—
0d
0.65
±0.05
a
85
b
80
c
255
b
ERG(X) 12S□□□□□V
ERG(X) 1S□□□□□V
ERG(X) 1S□U□□□V
ERG(X) 2S□□□□□V
ERG(X) 2S□U□□□V
ERG(X) 3S□□□□□V
ERG(X) 3S□U□□□V
2,000
5.0
±0.3
250
±2
52.0
±1.5
12.0
–2.0
1.20
±1.5
0.65
±0.05
85
80
255
Ma
rkin
1,000
5.0
±0.3
250
±2
52.0
—
0
—
+0.15
0
g
W
1
15.5
–2.0
1.40
0.80
±0.05
fd
P
c
85
80
255
a
1,000
10.0
±0.5
500
±2
74.0
±2.0
—
23.0
0
–2.0
—
1.4
+0.15
0
0.80
±0.05
105
100
325
Cut & Formed Type
ERG(X)□□S□□□□P
Part Number
f
0.65±0.05 (0.5 W, 1 W)
f
0.80±0.05 (2 W, 3 W, 5 W)
S
L
fD
Standard
Quantity
(pcs./box)
1,000
1,000
1,000
1,000
500
Dimensions (mm)
L
6.35
–0.35
9.00
–1.00
12.00
–1.00
15.00
24.00
±1.50
+1.50
+1.50
+0.65
0D
2.3
–0.3
2.8
4.0
5.5
8.0
±0.5
+0.5
S
10.0
12.5
15.0
20.0
30.0
±1.5
h
4.0
4.0
6.0
6.5
7.5
±1.5
h
2
4.0
4.0
4.0
4.0
4.0
±1.5
ERG(X) 12S□□□□P
ERG(X) 1S□□□□P
±1.5
±1.5
±1.5
Upper surface
h of PW board
h
2
0.8 (0.5 W, 1 W)
1.0 (2 W, 3 W, 5 W)
1.2±0.2 (0.5 W, 1 W)
1.4±0.2 (2 W, 3 W, 5 W)
ERG(X) 2S□□□□P
ERG(X) 3S□□□□P
ERG(X) 5S□□□□P
±1.0
±1.5
±1.5
±1.5
±1.0
±2.0
±1.5
±1.5
±1.50
±1.0
±2.0
±1.5
±1.5
ERG(X)□F□□□□H
Part Number
Standard
Quantity
(pcs./box)
1,000
1,000
1,000
500
Dimensions (mm)
L
9.0
–1.0
12.0
–1.0
15.0
24.0
±1.5
+1.5
+1.5
0D
2.8
4.0
5.5
8.0
±0.5
S
12.5
15.0
20.0
30.0
±1.5
h
8
6
±2
h
2
4.0
5.0
5.0
5.0
±1.5
S
L
fD
f
0.80±0.05
h Upper surface
of PW board
h
2
1.0
1.4±0.2
ERG(X)1F□□□□H
ERG(X)2F□□□□H
ERG(X)3F□□□□H
ERG(X)5F□□□□H
±1.0
±1.5
±2
±1.5
±1.0
±2.0
10
10
±2
±1.5
±1.5
±1.0
±2.0
±2
±1.5
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
02 Sep. 2014
Metal (Oxide) Film Resistors Packaging Methods
For Panasert Automatic Insertion Machine Radial Taped & Box
ERG(X)□□S□□□□E (12S, 1S, 2S)
Insulated
Lead
P
P
2
fD
A
F
H
0
H
1
fd
W
1
fD
0
Dimensions (mm)
12S
A
0d
1S
2S
6.35
–0.35
9.0
–1.0
12.0
0.65±0.05
+1.5
–1.0
+1.5
+0.65
P
1
P
0
Dimensions (mm)
P
P
0
P
1
P
2
F
12.7±1.0
12.7±0.3
3.85±0.70
6.35±1.00
5.0±0.8
H
0
0D
0
W
W
1
Dimensions (mm)
18.0±0.5
9.0±0.5
H
1
Dimensions (mm)
12S
1S
2S
32 max.
32 max.
38 max.
16.0±0.5
4.0±0.2
W
Dimensions (mm)
12S
0D
1S
2S
2.3
–0.3
2.8±0.5
4.0±1.0
+0.5
●
Radial
Tape Package Specifications
Part Number
ERG(X) 12S□□□□E
ERG(X) 1S□□□□E
b
ERG(X) 2S□□□□E
a
c
Dimensions (mm)
a
46
46
49
b
130
130
100
c
335
335
335
Standard Quantity
(pcs./box)
2,000
2,000
1,000
Marking
For Panasert Automatic Insertion Machine Radial Taped & Box
ERG(X)□□S□W□□□E (12S, 1S, 2S, 3S)
P
P
1
P
P
0
A
B
fD
P
1
Dimensions (mm)
12S
1S, 2S, 3S
12S
1S, 2S, 3S
12S
1S, 2S, 3S
12S
1S, 2S, 3S
12S
1S, 2S, 3S
12S, 1S, 2S, 3S
12S, 1S, 2S, 3S
12S
H
0
1S, 2S
3S
12S
P
0
fD
0
H
1
1S, 2S
3S
12.7±1.0
30.0±1.0
12.7±0.3
15.0±0.3
6.35±1.00
7.5±1.0
3.85±0.70
3.75±0.50
5.0±0.5
7.5±0.8
18.0±0.5
9.0±0.5
16.0±0.5
18.0±1.0
19.0±1.0
6.5
6.5
8.0
+0.6
0
+1.0
0
+1.0
0
Dimensions (mm)
0D
0
12S, 1S, 2S, 3S
12S
A
1S
2S
3S
12S
B
1S
2S
3S
12S
0D
1S
2S
3S
0d
12S
1S, 2S, 3S
4.0±0.2
6.35
–0.35
9.0
–1.0
12.0
–1.0
15.0±1.5
11.2 max.
14.0 max.
17.0 max.
21.0 max.
2.3
–0.3
2.8±0.5
4.0±1.0
5.5±1.0
00.65±0.05
00.80±0.05
+0.5
+1.5
+1.5
+0.65
H
1
P
2
H
0
P
2
F
F
W
W
1
W
fd
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
02 Sep. 2014
W
1
Metal (Oxide) Film Resistors Packaging Methods
For Panasert Automatic Insertion Machine Radial Taped & Box
ERG(X)□F□S□□□E (1F, 2F, 3F)
Dimensions (mm)
P
1
A
H
2
P
P
B
fD
P
0
P
1
P
2
F
H
0
P
2
W
W
1
W
1
W
H
0
1F
H
1
2F
3F
30.0±1.0
15.0±0.3
7.5±1.0
3.75±0.50
7.5±0.8
18.0±0.5
9.0±0.5
16.0
+1.0
0
+1.0
0
+1.0
0
+1.0
0
Dimensions (mm)
H
2
0D
0
1F
A
2F
3F
1F
B
2F
3F
1F
0D
0d
2F
3F
1.0±0.3
4.0±0.2
9.0
–1.0
+1.5
+1.5
F
H
1
12.0
–1.0
15.0±1.5
14 max.
17 max.
21 max.
2.8±0.5
4.0±1.0
5.5±1.0
0.80±0.05
fd
P
0
fD
0
7.0
8.0
9.0
●
Radial
Tape Package Specifications
Part No.
ERG(X)12S□W□□□E
ERG(X) 1S□W□□□E
ERG(X) 1F□ S□□□E
ERG(X) 2S□W□□□E
ERG(X) 2F□ S□□□E
a
c
ERG(X) 3F□ S□□□E
b
Dimensions (mm)
a
46
49
b
145
150
c
325
317
Standard Quantity
(pcs./box)
2,000
1,000
49
49
150
190
317
315
500
500
Marking
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
1. Automotive Electronic Control and Safety System Inrecent years, China's automotive industry has grown rapidly and has a strong momentum of development. Therefore, some experts in the commentary cir...
[url=http://www.shengshengkan.com/]http://www.shengshengkan.com/[/url] Saving energy is everyone's responsibility. Let's save electricity together. p.s. Is there anyone interested in setting up an EEW...
I want to use Siemens GPRS module MC55 to send data to the internet. Now the module can successfully log in to the GPRS network. May I ask what AT commands should I use to send data? Thank you!...
Introduction to the national unified examination course for higher education self-study: Analog circuits and digital circuitsChinaITLab collected and sorted 2006-2-24Save this articleRecommend to frie...
[color=#333333][size=14px]Industry Development Background[/size][/color] [color=#333333][size=14px] Centralized meter reading products have been developed in China since the 1990s, and have a history ...
The most significant event in the technology circle during this period is undoubtedly the news that ZTE was banned by the United States. Once the news came out, it shocked the entire Chinese techno...[Details]
China's photovoltaic power generation installed capacity achieved rapid growth in 2017, and distributed photovoltaics achieved explosive growth. In 2017, the country's photovoltaic installed capaci...[Details]
1. Placement suspension void NVIC_Configuration(void) { NVIC_InitTypeDef NVIC_InitStructure; /* Set the Vector Table base location at 0x08004000 NVIC_SetVectorTable(NVIC_VectTab_FLASH, 0x4000)...[Details]
Processors with artificial intelligence are mostly integrated into cars, PCs, security cameras, smart speakers, robots and other related technology equipment, but
AI
chips were initially de...[Details]
Every era has its own representative company, and the small game between representative companies in the big era also reflects the big game between countries to a certain extent. Let's learn about ...[Details]
Many embedded geeks are wondering what the future holds if they continue to invest time, energy and money in MICroChip's PIC32 series MCUs. Will their investment be safe, and how does it compare ...[Details]
Kevin Jensen ams Semiconductor
Sensors
and lighting expert. Let's learn more about the relevant content with the network communication editor.
Everything is becoming "smart" these ...[Details]
Title: Use the table lookup method to convert a hexadecimal number into ASCII code. The input parameter is placed in the internal RAM 50H, and the output parameter is in R0. Requirements: Complete th...[Details]
I have been deeply affected by serial ports since 51. The MAX232 I bought from Huaqiang was originally broken. I thought there was something wrong with my circuit or schematic. Since there was no goo...[Details]
//------------------------------------------------------------ // MSP 430 subroutine (LCD controller subroutine) // Statement: Please keep the above information for reprinting. For commercial use,...[Details]
The entire international Internet of Things construction is showing
a stage of co-development of
eMTC
and
NB-IoT
. It can be said that each operator will comprehensively consider
th...[Details]
The atmega103 microcontroller is a reduced instruction set (RISC) AVR (Advanced RISC) series microcontroller product launched by Atmel. This is an enhanced RISC structure and an 8-bit microcontroller...[Details]
By building a medical imaging cloud platform, the central hospital of the medical alliance can provide medical imaging data and application services to medical institutions within the alliance. It ...[Details]
In such a pre-
Internet of Things
era, various smart devices have gradually emerged, and with them comes the rapid growth of mobile devices. The amount of data on mobile terminals has reach...[Details]
Automotive Electronics
京公网安备 11010802033920号
EEWORLD
