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374924B60024G

Description
Heat Sinks 40mm x 40mm x 10mm SOLDER ANCHOR MOUNT
CategoryThermal management products    Heat resisting bracing   
File Size221KB,2 Pages
ManufacturerAavid Thermalloy
Environmental Compliance
Download Datasheet Parametric View All

374924B60024G Online Shopping

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374924B60024G Overview

Heat Sinks 40mm x 40mm x 10mm SOLDER ANCHOR MOUNT

374924B60024G Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
package instructionROHS COMPLIANT
Reach Compliance Codecompliant
Main materialALUMINUM
colorBLACK
structureFIN
Surface layerANODIZED
high10 mm
length40 mm
contourPIN FIN ARRAY
Heat Resistant Support Device TypeHEAT SINK
width40 mm
Base Number Matches1
DATASHEET 
 
 
Board Level Cooling – 3749 
 
 
 
 
 
Device Type 
BGA, FPGA 
BGA, FPGA 
BOARD LEVEL COOLING ‐ 3749 
3749 is a series of square pin fin board level heat sinks designed to cool BGA 
and FPGA devices. Representative image only. 
 
ORDERING INFORMATION
 
Part Number 
374924B00035G 
374924B60024G 
 
 
 
HEAT SINK DETAILS 
Property 
 Material 
Finish 
Device Attachment Options: 
374924B00035G 
Device Attachment Options: 
374924B60024G 
Thermal Interface Material: 
374924B00035G 
Thermal Interface Material: 
374924B60024G 
Details 
Aluminum 
Black Anodize 
Tape 
Solder Anchor Clip 
T411 Chomerics Tape for All Surfaces 
T766 Chomerics Phase Change for All 
Surfaces 
Property 
 Heat Sink Width (mm) 
Heat Sink Length (mm) 
Heat Sink Height (mm) 
Heat Sink Mounting Direction 
Details 
40.00 
40.00 
10.00 
Horizontal, Vertical 
 
 
 
 
 
MECHANICAL & PERFORMANCE  
Drawing dimensions are shown in mm, (in) 
 
  
 
 
 
 
 
 
 
 
 
 
 
 
USA: 1.855.322.2843 
EUROPE: 39.051.764002 
ASIA: 86.21.6115.2000 x8122 
 
 
 
 
 
 
 
 
 
 
    Board Level Cooling 
    www.aavid.com 
 
Part Number: 374924B00035G 
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