DATASHEET
Board Level Cooling – 3749
Device Type
BGA, FPGA
BGA, FPGA
BOARD LEVEL COOLING ‐ 3749
3749 is a series of square pin fin board level heat sinks designed to cool BGA
and FPGA devices. Representative image only.
ORDERING INFORMATION
Part Number
374924B00035G
374924B60024G
HEAT SINK DETAILS
Property
Material
Finish
Device Attachment Options:
374924B00035G
Device Attachment Options:
374924B60024G
Thermal Interface Material:
374924B00035G
Thermal Interface Material:
374924B60024G
Details
Aluminum
Black Anodize
Tape
Solder Anchor Clip
T411 Chomerics Tape for All Surfaces
T766 Chomerics Phase Change for All
Surfaces
Property
Heat Sink Width (mm)
Heat Sink Length (mm)
Heat Sink Height (mm)
Heat Sink Mounting Direction
Details
40.00
40.00
10.00
Horizontal, Vertical
MECHANICAL & PERFORMANCE
Drawing dimensions are shown in mm, (in)
USA: 1.855.322.2843
EUROPE: 39.051.764002
ASIA: 86.21.6115.2000 x8122
Board Level Cooling
www.aavid.com
Part Number: 374924B00035G
DATASHEET
Board Level Cooling – 3749
Part Number: 374924B60024G
Mounting Details:
USA: 1.855.322.2843
EUROPE: 39.051.764002
ASIA: 86.21.6115.2000 x8122
Board Level Cooling
www.aavid.com