DATASHEET
Board Level Cooling – 3358
BOARD LEVEL COOLING ‐ 3358
3358 is a series of square pin fin board level heat sinks designed to cool BGA
and FPGA devices. These heat sinks use pressure sensitive adhesive for
mounting. Representative image only.
ORDERING INFORMATION
Part Number
335824B00032G
335824B00034G
Device Type
BGA, FPGA
BGA, FPGA
HEAT SINK DETAILS
Property
Material
Finish
Device Attachment Options
Thermal Interface Material
335824B00032G
Thermal Interface Material
335824B00034G
Details
Aluminum
Black Anodize
Tape
T405R Chomerics Tape for
Metal Surfaces
T410R Chomerics Tape for
Plastic Surfaces
Property
Heat Sink Width (mm)
Heat Sink Length (mm)
Heat Sink Height (mm)
Heat Sink Mounting Direction
Details
29.97
29.97
9.40
Horizontal, Vertical
MECHANICAL & PERFORMANCE
Drawing dimensions are shown in mm, (in)
USA: 1.855.322.2843
EUROPE: 39.051.764002
ASIA: 86.21.6115.2000 x8122
Board Level Cooling
www.aavid.com