Innovative
Technology
for a
Connected
World
Tpcm 670
TM
Tpcm 670DF
TM
Tpcm™ 670 is a high performance, inherently tacky, easy to rework phase change thermal
interface material. Developed specifically to meet the high thermal conductivity and low
thermal resistance requirements of Intel
®
mobile processors. Tpcm 670 is optimized for
multi-core and general CPU and GPU processors including Intel’s Penryn Quad-Core
mobile processor.
FEATURES AND BENEFITS
• Minimizes contact thermal resistance by filling the microscopic irregularities of the
components it contacts. Begins to soften and flow at approximately 48ºC.
• Designed to minimize migration (pump out) at CPU operating temperatures using a unique
material formulation that softens, but does not fully change phase.
• Naturally tacky at room temperature, requiring no adhesive.
• Heat sink preheating not required.
• Supplied on tabbed liners for easy manual or automatic application.
• Exceptionally high reliability.
• Available with Laird Technologies easy release DF
(patent pending)
layer. DF
(patent pending)
minimizes the force required to disassemble after burn-in while still maintaining the highest
possible thermal performance and exceptional reliability.
PROPERTIES
Color
Thickness, inches (mm)
0.008” (0.20)
0.010 (.25)
Tpcm
TM
670
Grey
0.005 (0.125)
0.008” (0.20)
0.010 (.25)
*Tpcm
TM
670DF
TEST METHOD
Visual
Thickness Tolerance, inches (mm)
Construction & Composition
Specific Gravity, g/cc
Shelf Life
Operating Temperature Range, °C
Phase Change Softening Range,°C
Thermal Conductivity, W/mK
Thermal Resistance
Outer core, 25 micron die height offset,
°C-cm
2
/W, (°C-mm
2
/W)
50 psi °C-in
2
/ W
345 Kpa, °C-cm
2
/W
* patent pending
+/-0.001” (0.025)
Non-reinforced Film
2.50
1 year
-40 to 125°C
45 to 70°C
4.3
0.117 (11.7)
0.010
0.065
0.025
0.161
Hot Disk Thermal
Constants Analyzer
Intel Mobile TIM Tester
ASTM D5470 (modified)
ASTM D5470 (modified)
Helium Pycnometer
global
solutions:
local
support
Americas: +1.800.843.4556
Europe: +49.8031.2460.0
Asia: +86.755.2714.1166
CLV-customerservice@lairdtech.com
www.lairdtech.com/thermal
TM
THR-DS-Tpcm-670-670DF 0910
Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and
application of Laird Technologies materials rests with the end user, since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the
fitness, merchantability or suitability of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages
of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request.
© Copyright 2010 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technolo-
gies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party
intellectual property rights.
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