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374224B60023G

Description
Heat Sinks 23mm x 23mm x 25mm SOLDER ANCHOR MOUNT
CategoryThermal management products    Heat resisting bracing   
File Size181KB,1 Pages
ManufacturerAavid Thermalloy
Environmental Compliance
Download Datasheet Parametric View All

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374224B60023G Overview

Heat Sinks 23mm x 23mm x 25mm SOLDER ANCHOR MOUNT

374224B60023G Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
package instructionROHS COMPLIANT
Reach Compliance Codeunknown
Factory Lead Time9 weeks
Main materialALUMINUM
colorBLACK
structureFIN
fin directionOMNIDIRECT
Surface layerANODIZED
high25 mm
length23 mm
contourPIN FIN ARRAY
Heat Resistant Support Device TypeHEAT SINK
width23 mm
Base Number Matches1
DATASHEET 
 
 
 
BOARD LEVEL COOLING – 3742 
3742 is a square pin fin board level heat sink designed to cool BGA and 
FPGA devices. Representative image only. 
Board Level Cooling – 3742 
 
 
 
ORDERING INFORMATION
 
Part Number 
374224B60023G 
 
Device Type 
BGA, FPGA 
 
 
 
HEAT SINK DETAILS 
Property 
 Material 
Finish 
Device Attachment Options 
Thermal Interface Material 
   
Details 
Aluminum 
Black Anodize 
Solder Anchor Clip 
T766 Chomerics Phase 
Change for All Surfaces 
Property 
Heat Sink Width (mm) 
Heat Sink Length (mm) 
Heat Sink Height (mm) 
Heat Sink Mounting Direction 
Details 
23.0 
23.0 
25.0 
Horizontal, Vertical 
 
MECHANICAL & PERFORMANCE  
Drawing dimensions are shown in mm, (in) 
Mounting Details: 
USA: 1.855.322.2843 
EUROPE: 39.051.764002 
ASIA: 86.21.6115.2000 x8122 
 
 
 
 
 
 
 
 
 
 
    Board Level Cooling 
    www.aavid.com 
 
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