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335224B00034G

Description
Heat Sinks
CategoryThermal management products   
File Size197KB,1 Pages
ManufacturerAavid Thermalloy
Environmental Compliance
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335224B00034G Overview

Heat Sinks

335224B00034G Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
ManufacturerAavid Thermalloy
Product CategoryHeat Sinks
RoHSDetails
Factory Pack Quantity980
DATASHEET 
 
 
Board Level Cooling – 3352 
 
 
 
 
BOARD LEVEL COOLING ‐ 3352 
3352 is a series of square pin fin board level heat sinks designed to cool BGA 
and FPGA devices. Representative image only. 
ORDERING INFORMATION
 
Part Number 
335224B00032G 
335224B00034G 
 
Device Type 
BGA, FPGA 
BGA, FPGA 
 
 
 
 
 
HEAT SINK DETAILS 
Property 
 Material 
Finish 
Device Attachment Options 
Thermal Interface Material 
335224B00032G 
Thermal Interface Material 
335224B00034G 
Details 
Aluminum 
Black Anodize 
Tape 
T405R Chomerics Tape for Metal 
Surfaces 
T410R Chomerics Tape for Plastic 
Surfaces 
Property 
 Heat Sink Width (mm) 
Heat Sink Length (mm) 
Heat Sink Height (mm) 
Heat Sink Mounting Direction 
Details 
25.02 
25.02 
9.91 
Horizontal, Vertical 
 
  
MECHANICAL & PERFORMANCE  
Drawing dimensions are shown in mm, (in) 
 
 
 
 
 
USA: 1.855.322.2843 
EUROPE: 39.051.764002 
ASIA: 86.21.6115.2000 x8122 
 
 
 
 
 
 
 
 
 
 
    Board Level Cooling 
    www.aavid.com 
 
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