DATASHEET
Board Level Cooling – 3750
BOARD LEVEL COOLING ‐ 3750
3750 is a series of square pin fin board level heat sinks designed to cool BGA
and FPGA devices. Representative Image Only.
ORDERING INFORMATION
Part Number
375024B00032G
375024B60024G
Device Type
BGA, FPGA
BGA, FPGA
HEAT SINK DETAILS
Property
Material
Finish
Device Attachment Options:
375024B00032G
Device Attachment Options:
375024B60024G
Thermal Interface Material:
375024B00032G
Thermal Interface Material:
375024B60024G
Details
Aluminum
Black Anodize
Tape
Solder Anchor Clip
T411 Chomerics Tape for All Surfaces
T766 Chomerics Phase Change for All
Surfaces
Property
Heat Sink Width (mm)
Heat Sink Length (mm)
Heat Sink Height (mm)
Heat Sink Mounting Direction
Details
40.00
40.00
18.00
Horizontal, Vertical
MECHANICAL & PERFORMANCE
Drawing dimensions are shown in mm, (in)
Part Number: 375024B00032G
USA: 1.855.322.2843
EUROPE: 39.051.764002
ASIA: 86.21.6115.2000 x8122
Board Level Cooling
www.aavid.com
DATASHEET
Board Level Cooling – 3750
Part Number: 375024B60024G
Mounting Details:
USA: 1.855.322.2843
EUROPE: 39.051.764002
ASIA: 86.21.6115.2000 x8122
Board Level Cooling
www.aavid.com