374724B60024G datasheet, PDF - EEWORLD Datasheet

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Datasheet> All Categories > Thermal management products> Heat resisting bracing> 374724B60024G

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374724B60024G: DescriptionHeat Sinks 35mm x 35mm x 18mm SOLDER ANCHOR MOUNT; CategoryThermal management products Heat resisting bracing; File Size214KB，2 Pages; ManufacturerAavid Thermalloy; Environmental Compliance

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374724B60024G Overview

Heat Sinks 35mm x 35mm x 18mm SOLDER ANCHOR MOUNT

374724B60024G Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
package instruction	ROHS COMPLIANT
Reach Compliance Code	unknown
Main material	ALUMINUM
color	BLACK
structure	FIN
fin direction	OMNIDIRECT
Surface layer	ANODIZED
high	18 mm
length	35 mm
contour	PIN FIN ARRAY
Heat Resistant Support Device Type	HEAT SINK
width	35 mm
Base Number Matches	1

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DATASHEET

Board Level Cooling – 3747

BOARD LEVEL COOLING – 3747

37472 is a series of square pin fin board level heat sinks designed to cool BGA

and FPGA devices. Representative image only.

ORDERING INFORMATION

Part Number

374724B00032G

374724B00035G

374724B60024G

Device Type

BGA, FPGA

HEAT SINK DETAILS

Property

Material

Finish

Device Attachment Options:

374724B00032G

Device Attachment Options:

374724B00035G

Device Attachment Options

374724B60024G

Thermal Interface Material:

374724B00032G

Thermal Interface Material:

374724B00035G

Thermal Interface Material:

374724B60024G

Details

Aluminum

Black Anodize

Tape

Solder Anchor Clip

T405R Chomerics Tape for Metal

Surfaces

T411 Chomerics Tape for All Surfaces

T766 Chomerics Phase Change for All

Surfaces

Property

Heat Sink Width (mm)

Heat Sink Length (mm)

Heat Sink Height (mm)

Heat Sink Mounting Direction

Details

35.00

18.00

Horizontal, Vertical

MECHANICAL & PERFORMANCE

Drawing dimensions are shown in mm, (in)

Part Number: 374724B00032G, 374724B00035G

USA: 1.855.322.2843

EUROPE: 39.051.764002

ASIA: 86.21.6115.2000 x8122

Board Level Cooling

www.aavid.com

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