Innovative
Technology
for a
Connected
World
Electrically and Thermally
Conductive Interface Pad
HigH-PERFORMANCE, COST EFFECTivE THERMAl iNTERFACE MATERiAl
Used where electrical isolation is not required, Tgon
™
800 is ideal for where electrical
contact and thermal transfer are desired.
Its unique grain-oriented, plate-like structure provides a high thermal conductivity of
240 W/mK in the XY plane and 5 W/mK through the z-axis.. Tgon 800 can be supplied
in 12” x 18” (305mm x 457mm) or 18” x 24” (457mm x 610mm) sheets, rolls or die-cut
to specific configurations.
It is also available with proprietary pressure sensitive adhesive on one side. This adhesive
coating is the thinnest available, minimizing any impact on thermal performance.
Tgon
TM
800 Series
FEATURES
•
•
•
•
High thermal conductivity of 5 W/mK in Z axis and 240 W/mK in the X-Y axis
>98% graphite
Low thermal resistance
Thicknesses of 0.005”, 0.010” and 0.020” (0.125mm, 0.25mm, and 0.50mm)
APPliCATiONS
•
•
•
•
•
Power conversion equipment
Power supplies
Large telecommunications switching hardware
Notebook computers
Where electrical grounding is required with good thermal conductivity
global
solutions:
local
support
Americas: +1.888.246.9050
Europe: +49.0.8031.2460.0
Asia: +86.755.2714.1166
CLV-customerservice@lairdtech.com
www.lairdtech.com/thermal
TM
Innovative
Technology
for a
Connected
World
Electrically and Thermally
Conductive Interface Pad
Tgon
TM
800 Series
TgON 800 TYPiCAl PROPERTiES
TM
TgoN™ 805
Construction & Composition
Color
Thickness
Thickness Tolerance
Density
Hardness
Tensile strength
Outgassing TML
Outgassing CVCM
UL Flammability rating
Temperature range
Thermal conductivity - Z Axis
Thermal conductivity - XY Axis
Thermal resistance @ 100 psi
Thermal resistance @ 681 KPa
Volume resistivity (In-Plane)
Flexible Graphite
Pewter
0.005" (0.13mm)
± 0.001"
(± 0.025mm)
2.20 g/cc
85 Shore A
650 psi
0.15%
0.09%
94 VO
-240°C to 300°C
5 W/mK
240 W/mK
0.07 °C-in
2
/W
0.42 °C-cm
2
/W
11 x 10
-5
ohm-cm
TgoN™ 810
Flexible Graphite
Pewter
0.010" (0.25mm)
± 0.001"
(± 0.025mm)
2.20 g/cc
85 Shore A
650 psi
0.15%
0.09%
94 VO
-240°C to 300°C
5 W/mK
240 W/mK
0.10 °C-in
2
/W
0.66 °C-cm
2
/W
11 x 10
-5
ohm-cm
TgoN™ 820
Flexible Graphite
Pewter
0.020" (0.51mm)
± 0.002"
(± 0.05mm)
2.20 g/cc
85 Shore A
650 psi
0.15%
0.09%
94 VO
-240°C to 300°C
5 W/mK
240 W/mK
0.17 °C-in
2
/W
1.07 °C-cm
2
/W
11 x 10
-5
ohm-cm
TesT MeTHod
Visual
Helium Pycnometer
ASTM D2240
ASTM D412
ASTM E595
ASTM E595
ASTM D5470 (modified)
ASTM D5470 (modified)
ASTM D5470 (modified)
ASTM D5470 (modified)
ASTM D257
STANDARD THiCKNESSES
0.005” (0.13mm), 0.010” (0.25mm), 0.020” (0.51mm)
Consult the factory for alternate thicknesses.
STANDARD SHEET SizE
18” x 24” (457mm x 609.6mm)
Tgon™ 800 sheets are supplied with no liners when ordered without adhesive.
With adhesive, they are supplied with no top liner and white release liner on the bottom.
Tgon™ 800 is available on rolls and individual die cut shapes.
PRESSURE SENSiTivE ADHESivE
Request no adhesive with “AO” suffix.
Request adhesive on one side with “A1” suffix.
Striped adhesive option on one side designated with SA.
Double-sided adhesive is not available.
THR-DS-Tgon-800 1109
Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with
the end user, since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the fitness, merchantability or suitability of any Laird Technologies materials or products for any specific or
general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy
of which will be furnished upon request. © Copyright 2009 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc.
or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights. A13515-00 Rev I 11/2009
京公网安备 11010802033920号
EEWORLD
