Operating Temperature Range ......................... -40NC to +85NC
Storage Temperature Range .......................... -65NC to +150NC
Junction Temperature .....................................................+150NC
Lead Temperature (soldering, 10s) ...............................+300NC
Soldering Temperature (reflow) .....................................+260NC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TDFN
Junction-to-Ambient Thermal Resistance (B
JA
) ...... 83.9NC/W
Junction-to-Case Thermal Resistance (B
JC
) .............. 37NC/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to
www.maxim-ic.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(V
IN
= +2.2V to +36V, T
A
= -40NC to +85NC, unless otherwise noted. Typical values are at V
IN
= +5.0V and T
A
= +25NC.) (Note 2)
PARAMETER
Input Voltage
Preset Regulated Output Voltage
SYMBOL
V
IN
V
PROV
I
OUT
= 0mA, V
IN
= 6.5V
I
OUT
= 200mA, V
IN
= 6.5V
I
OUT
= 800mA, V
IN
= 6V (Note 3)
V
IN
> V
PROV
I
OUT
= 0mA
V
IN
< V
PROV
(Note 4)
IN rising
% of typ V
OVLO
I
IN
I
IN_Q
R
ON
EN
= low, V
IN
= 4.5V, I
OUT
= 0mA
EN
= low, V
IN
= 7V, I
OUT
= 0mA
EN
= high, V
IN
= 3V
V
IN
= 5V, V
OUT
= 4V,
EN
= high
V
IN
= 4.75V, I
OUT
= 100mA
I
OUT
up to 0.8A
-1
10
1.4
0.4
V
EN
= 0V or 5.5V
V
IO
= 3.3V, I
SINK
= 1mA (see
Typical
Operating Circuit)
V
IO
= 3.3V,
ACOK
deasserted (see
Typical
Operating Circuit)
-200
-150
+150
0.4
+200
CONDITIONS
MIN
2.2
4.85
4.75
4.75
5.15
5.15
5.15
V
PROV
V
IN
7.44
8
1
120
300
2.5
260
550
5
+1
280
8.56
TYP
MAX
36
5.45
5.45
5.45
V
V
V
%
FA
FA
FA
mI
FF
V
V
nA
V
nA
V
UNITS
V
Output Voltage
Overvoltage Lockout Cutoff
Threshold Rising
Overvoltage Lockout Hysteresis
Input Supply Current
Input Shutdown Current
OUT Shutdown Current
On-Resistance
LDO Load Capacitance
DIGITAL SIGNALS (EN,
ACOK)
EN
Input High Voltage
EN
Input Low Voltage
EN
Input Leakage Current
ACOK
Output Low Voltage
ACOK
Leakage Current
V
OUT
V
OVLO
V
IH
V
IL
I
LEAK
V
OL
2
36V-Capable Overvoltage Protector with
Regulated Output Voltage
ELECTRICAL CHARACTERISTICS (continued)
(V
IN
= +2.2V to +36V, T
A
= -40NC to +85NC, unless otherwise noted. Typical values are at V
IN
= +5.0V and T
A
= +25NC.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
V
IN_MIN
< V
IN
< V
OVLO
until charge pump
turns on, see Figure 1
V
IN_MIN
< V
IN
< V
OVLO
to
ACOK
low until
charge pump turns on, see Figure 1
R
LOAD
= 100I, C
LOAD
= 1FF, V
OUT
=
20% of V
IN
to 80% of V
IN
, see Figure 1
V
IN
> V
OVLO
to V
OUT
= 80% of V
PROV
,
R
LOAD
= 100I, see Figure 1
MIN
TYP
MAX
UNITS
TIMING CHARACTERISTICS (Note 4)
Input Debounce Time
ACOK
Time
Turn-on Time During Soft-Start
Overvoltage Turn-Off Time
THERMAL PROTECTION
Thermal Shutdown
Thermal Hysteresis
T
SHDN
T
HYST
150
20
NC
NC
t
DEB
t
ACOK
t
ON
t
OFF
10
20
20
40
48
1
35
70
ms
ms
Fs
Fs
MAX14562
Note 2:
All devices are 100% production tested at T
A
= +25NC. Limits over the operating temperature range are guaranteed by
design and not production tested.
Note 3:
Thermally limited, guaranteed by design, and not production tested.
Note 4:
In linear mode, as I
OUT
increases, the OUT voltage drops due to a voltage across Q1 (see
Functional Diagram).
Note 5:
All timing characteristics are measured using 20% and 80% levels unless otherwise specified.
Compiling any file will result in an errorThe following is the error message:Build started 7.7.2012 at 15:01:22avr-gcc -I"C:\WinAVR-20100110\avr\include\avr" -I"C:\WinAVR-20100110\mfile" -mmcu=atmega1...
When ADC analog input uses P6.0, the interrupt control register ADC12IE is 0x01. If the input is changed to P6.1, should ADC12IE be changed to 0x02? Why can't the 1602 display show anything after I ch...
In interruptthandle() of s3c2410 that comes with WinCE 5.0, sysIntr = NKCallIntChain((UCHAR)irq); if (sysIntr == SYSINTR_CHAIN || !NKIsSysIntrValid(sysIntr)) { // IRQ wasn't claimed, use static mappin...
I am using STM32F103RCT6, and I can communicate with serial port 3 with 7 data bits and even parity. I can send data, but I cannot remove the parity bit automatically when receiving. For example, when...
[size=4][font=微软雅黑][color=black]Event details: [url=https://bbs.eeworld.com.cn/thread-643348-1-1.html]Click here to view[/url][/color][/font][/size] [align=left][backcolor=transparent][font=微软雅黑][size...
If I use channel 1 of the STM32F103VBT6 TIM1 to send pulses, channel 2 to count the number of pulses of channel 1, and then control the stop of the first channel based on the number of pulses counted ...
Hardware designers have begun to adopt FPGA technology in high-performance DSP designs because it can provide 10-100 times faster computing than PC-based or microcontroller-based solutions. Previou...[Details]
1 Introduction
The high temperature tester is mainly used for temperature tracking measurement and data acquisition during the heating process. By systematically analyzing the test data, the...[Details]
Google's driverless technology is not only an eye-catching technology, but also a subversion of the car usage model.
Those who have watched anti-terrorism films and TV dramas must have been im...[Details]
With the rapid development of urban economy, elevators are increasingly used as a vertical transportation tool. However, elevator fault detection and maintenance, especially the role of elevator remot...[Details]
Editor's note: In order to help technicians or engineers who have knowledge of PIC microcontroller assembly language quickly master the method of using C language to program PIC microcontrollers, t...[Details]
A standard cell
is an electrochemical
cell
used as a voltage reference standard in many electrical standards laboratories
. If properly maintained, standard cells are very stable. The ...[Details]
Overview
As a remote network communication control method with advanced technology, high reliability, complete functions and reasonable cost, CAN-bus has been widely used in various automa...[Details]
LED is the abbreviation of light emitting diode, which is an electric light source made of semiconductor technology. The core part of LED is a chip composed of P-type semiconductor and N-type semi...[Details]
It is well known to automotive suppliers that automakers are demanding more from their supply base. For connector suppliers, this means stricter requirements for product performance, stability and ...[Details]
The era of mobile access to the Internet has arrived, and it will rapidly change the business and infrastructure needs of mobile operators under a whole new trend of requirements. We need 4G LTE to...[Details]
Today, with energy becoming increasingly scarce, the utilization of natural energy has become the focus of people's attention. Among various natural energies, the endless solar energy is highly fav...[Details]
Every time I go home and walk up the stairs, I am always scared. The corridor lights are often broken, and no one changes the bulbs, or they are not smart enough and need to be operated manually. E...[Details]
The future energy storage hotspot is not coal or iron ore, but lithium. This lightest metal in nature may be the heaviest resource in the future energy landscape. China launched an ambitious electr...[Details]
The capacity of a battery depends on the amount of charge and discharge, in addition to some factors of the battery itself. Obviously, if the charge and discharge of the battery can be recorded all...[Details]
1 Introduction
Automatic Test
System The ATS (Automatic Test System) integrates all the stimulus and measurement equipment required for testing.
The computer
efficiently comp...[Details]
Microchip MCU
京公网安备 11010802033920号
EEWORLD
