High-Speed(10
+
Gbps) BGA Mezzanine Connectors
IT3 Series
■Flexibility
Hirose’s IT3 mezzanine connector system is as
comfortable in today’s data rates of PCIe and
XAUI as it is in tomorrow’s 10
+
Gbps systems.
With the ability to transmit differential, single-
ended, and power through one package and
being stackable from 14 – 40mm, IT3 can solve
your interface needs for both current and future
generations.
Nov.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
■Mechanical
features
●
Unique 3-piece structure for flexibility
●
Stacking heights from 14 to 40mm
●
Staggered 1.5mm
∞
1.75mm ball grid array
●
Number of Contacts: 100, 200, &300 signals
+ 90% additional grounds
●
Differential, single-ended, and power
●
Low mating/extracting forces
●
Wide misalignment tolerances for multiple
connector use
●
Both of SnPb and Pb-free are available
●
Excellent reflow solderability
●
IT3 is inter-mateable with IT5 Series
Interposer
Signal
Ground
Signal / Ground Configuration
■Signal
integrity features
●
Insertion loss to Crosstalk Ratio (ICR)
The ICR performance meets the
extrapolated IEEE 802.3ap
specification for 6.25Gbps with
fully-populated pin assignment,
and 10
+
Gbps with skipped pin
assignment.
60
50
40
ICR (dB)
0
ICR
IEEE spec
-10
30
20
10
0
RL (dB)
-20
-30
●
Return Loss
The differential return loss meets
the extrapolated IEEE 802.3ap
specification up to 12GHz.
-40
RL
IEEE Spec
0
5
10
Frequency (GHz)
15
20
0
5
10
Frequency (GHz)
15
20
-50
■Stacking
height variations
2piece
3piece
Stacking Height
Contact Position
100
14
mm
15
mm
17
mm
18
mm
20
mm
22
mm
25
mm
26
mm
28
mm
30
mm
*
32
mm
35
mm
38
mm
40
mm
*
200
300
* : Under planning
In cases where the application will demand a high level of reliability, such as automotive,
please contact a company representative for further information.
2017.10⑤
1
IT3 Series●High-Speed(10
+
Gbps) BGA Mezzanine Connectors
■Product
Specifications
Rating
Item
1. Insulation Resistance
2. Withstanding Voltage
3. Contact Resistance
Current Rating : 1.0A / pin (note 1)
Voltage Rating : 50Vrms
Storage Temperature Range : -10˚C to +60˚C
Specification
1000Mø min.
No flashover or insulation breakdown
40mø max. (height 14-15mm)
50mø max. (height 17-24mm) (note 2)
55mø max. (height 25-32mm) (note 2)
60mø max. (height 33-40mm) (note 2)
1) No electrical discontinuity of 1μs or more
2) No damage, crack, or loose part
1) Contact resistance change: 20mø or less
2) No damage, crack or loose part
1) Contact resistance change: 20mø or less
2) No damage, crack or loose part
Operating Temperature Range: -55˚C to +85˚C
Operating Humidity Range: For relative humidity,
90% max (no condensation is permitted)
Conditions
100V DC
150V duty for 60 seconds (2mA max leak)
100mA
Frequency : 50 to 2000Hz; power spectrum density :
2
0.1G /Hz for 90 minutes in three directions
25˚C, 80% RH : 60 min dwell time, 30 min ramp time
65˚C, 50% RH : 60 min dwell time under 24 cycles
100 cycles
Nov.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
4. Vibration
5. Cyclic Temperature
and Humidity
6. Durability
(Mating/Un-mating)
Note1 : Refer to IT3 derating curves on test report TR636E-20041 for power application.
Note2 : The value of contact resistance includes 2 contact points and the bulk resistance.
■Materials
/ Finish
●Receptacle
Component
Housing(Mounting Side)
Housing(Detachable / Mating Side)
Locator
Contact
Solder Ball
Tray
Pick Up Cap
Pick Up Tape
Material
LCP
LCP
LCP
Copper Alloy
Tin-Lead (SnPb)
Tin (Pb-Free)
Polystyrene
Stainless steel
Paper (Nomex)
Finish & Remarks
Black , UL 94V-0
Gray , UL 94V-0
Black , UL 94V-0
Contact Area : Gold (0.76 μm) over Nickel (1.5 μm)
Mounting Area : Gold (0.05 μm) over Nickel (1.5 μm)
Other
: Nickel (1.5 μm)
Sn(63)-Pb(37)
Sn(96.5)-Ag(3)-Cu(0.5)
Black
300pos
100pos and 200pos
Finish & Remarks
Black , UL 94V-0
Gray , UL 94V-0
Gray , UL 94V-0
Black , UL 94V-0
Contact Area : Gold (0.76 μm) over Nickel (1.5 μm)
Other
: Nickel (1.5 μm)
----------
●Interposer
Component
Guide (Mounting Side)
Guide (Detachable/Mating Side)
Blade
Contact
Ground Shield
Tray
Material
PBT
LCP
PBT
LCP
Copper Alloy
Copper Alloy
Polypropylene
●Plug
Component
Housing
Locator
Contact
Solder Ball
Tray
Pick Up Cap
Material
LCP
LCP
Copper Alloy
Tin-Lead (SnPb)
Tin (Pb-Free)
Polystyrene
Stainless steel
Finish & Remarks
Black , UL 94V-0
Black , UL 94V-0
Contact Area : Gold (0.76 μm) over Nickel (1.5 μm)
Mounting Area : Gold (0.05 μm) over Nickel (1.5 μm)
Other
: Nickel (1.5 μm)
Sn(63)-Pb(37)
Sn(96.5)-Ag(3)-Cu(0.5)
Blue
100pos, 200pos and 300pos
2
IT3 Series●High-Speed(10
+
Gbps) BGA Mezzanine Connectors
■Product
Number Structure
Refer to the chart below when determining the product specifications from the product number.
Please select from the product numbers listed in this catalog when placing orders.
●Receptacle
IT 3
**
-
***
S - BGA
** (**)
❶
❷
❸
❹
❺
❻
❼
●Interposer
IT 3
**
-
***
P -
**
H
** (**)
Nov.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
❶
❷
❸
❹
½
❻
❾
●Plug
IT 3
**
-
***
P -
**
BGA
** (**)
❶
❷
❸
❹
½
❻
❼
❶
Series name : IT3
❷
Receptacle Type
D
: Mating Receptacle
D* : Mating Receptacle ( Customized )
M
: Mounting Receptacle
M* : Mounting Receptacle ( Customized )
Interposer Type
Blank : Standard
** : Customized
Plug Type
M
: Plug
M* : Plug ( Customized )
❸
Contact Positions : 100, 200, 300
❹
Connector type
S : Receptacle
P : Interposer , Plug
❺
BGA : Ball Grid Array
❻
Package Specification
Blank : Standard
** : Customized
❼
Material and Plating Specification of Mounting Receptacle, plug
Housing : Black
(37) : Pb-free Solder Sn(96.5)-Ag(3.0)-Cu(0.5)
Contact Area : Au(0.76μm)+Ni(1.5μm)
(57) : Eutectic Solder Sn(63)-Pb(37)
Contact Area : Au(0.76μm)+Ni(1.5μm)
Material and Plating Specification of Mating Receptacle
Housing : Glay
(39) : Pb-free Solder Sn(96.5)-Ag(3.0)-Cu(0.5)
Contact Area : Au(0.76μm)+Ni(1.5μm)
(59) : Eutectic Solder Sn(63)-Pb(37)
Contact Area : Au(0.76μm)+Ni(1.5μm)
½
Stacking Height (mm)
14, 15, 17, 18, 20, 22, 25, 26, 28, 30, 32, 35, 38, 40
Plug : 14, 15
Interposer : 17, 40
❾
Plating Specification of Interposer
(03), (04) : Contact Area : Au(0.76μm)+Ni(1.5μm)
■
Signal Integrity
●Pin
assignment
For the fully-populated pin assignment, adjacent pins are grouped into differential pairs as shown in the
figures below. In the following data, one victim pair and eight aggressor pairs are included.
7
8
9
16
17
18
4
5
6
13
14
15
1
2
3
10
11
12
Mating receptacle side
Signal
Ground
Victim pair
Mounting receptacle side
Aggressor pair
3
IT3 Series●High-Speed(10
+
Gbps) BGA Mezzanine Connectors
●Impedance
profile at 60ps rise time (20-80%)
The impedance profiles (of connector only) for the center pair are shown below. The IT3 receptacles
are designed with higher impedance to offset the via’s low impedance.
115
115
115
110
Z (Ohm)
Z (Ohm)
110
Z (Ohm)
S11
95
0
200
400
600
Time (ps)
800
1000
110
105
105
105
100
100
S11
100
S11
95
0
200
400
600
Time (ps)
800
1000
Nov.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
95
0
200
400
600
Time (ps)
800
1000
17mm Height
25mm Height
32mm Height
●Differential
propagation delay
Stacking Height (mm)
Delay (ps)
17
101.05
25
146.69
32
188.48
●Differential
Insertion Loss
The differential insertion loss is less than -2dB up to 12GHz.
0
-1
-2
-3
-4
S (dB)
S (dB)
-5
-6
-7
-8
-9
S514
-10
0
5
10
15
20
-10
0
5
10
15
0
-1
-2
-3
-4
-5
-6
-7
-8
-9
S514
20
-10
0
5
10
15
S (dB)
0
-1
-2
-3
-4
-5
-6
-7
-8
-9
S514
20
17mm Height
25mm Height
32mm Height
●Differential
Return Loss
The connector-only differential return loss for the center pair meets the extrapolated IEEE 802.3ap
spec up to 12GHz. (The attenuation of PCB traces in the channel will give an even larger margin.)
0
0
0
-10
-10
-10
RL (dB)
RL (dB)
-30
-30
RL (dB)
RL
IEEE Spec
0
5
10
Frequency (GHz)
15
20
-20
-20
-20
-30
-40
RL
IEEE Spec
0
5
10
Frequency (GHz)
15
20
-40
-40
RL
IEEE Spec
0
5
10
Frequency (GHz)
15
20
-50
-50
-50
17mm Height
25mm Height
32mm Height
4
IT3 Series●High-Speed(10
+
Gbps) BGA Mezzanine Connectors
●Differential
Near-End Crosstalk (NEXT)
The near-end crosstalk at the center pair from surrounding 8 aggressors is shown below. The NEXT
is not as critical because TX and RX can be grouped into separate wafers.
0
-10
-20
S (dB)
-30
-40
S51
S52
S53
S54
S56
S57
S58
S59
Sum
0
5
10
Frequency (GHz)
15
20
0
-10
-20
S (dB)
-30
-40
-50
-60
S51
S52
S53
S54
S56
S57
S58
S59
Sum
0
5
10
Frequency (GHz)
15
20
0
-10
-20
S (dB)
-30
-40
-50
-60
S51
S52
S53
S54
S56
S57
S58
S59
Sum
0
5
10
Frequency (GHz)
15
20
Nov.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
-50
-60
17mm Height
25mm Height
32mm Height
●Differential
Far-End Crosstalk (FEXT)
Low far-end crosstalk at the center pair from surrounding 8 aggressors is observed. Even lower
crosstalk can be achieved by skipping pins.
0
-10
-20
S (dB)
-30
-40
-50
-60
S141
S142
S143
S144
S146
S147
S148
S149
Sum
0
5
10
Frequency (GHz)
15
20
0
-10
-20
S (dB)
-30
-40
-50
-60
S141
S142
S143
S144
S146
S147
S148
S149
Sum
0
5
10
Frequency (GHz)
15
20
0
-10
-20
S (dB)
-30
-40
-50
-60
S141
S142
S143
S144
S146
S147
S148
S149
Sum
0
5
10
Frequency (GHz)
15
20
17mm Height
25mm Height
32mm Height
●Insertion-Loss-to-Crosstalk-Ratio
(ICR) for FEXT
The insertion-loss-to-crosstalk-ratio (ICR) for 8-aggressor FEXT meets the extrapolated IEEE
802.3ap specification up to 12GHz.
60
50
40
ICR (dB)
ICR (dB)
30
20
10
0
ICR
IEEE spec
60
50
40
30
20
10
0
ICR (dB)
ICR
IEEE spec
60
50
40
30
20
10
0
ICR
IEEE spec
0
5
10
Frequency (GHz)
15
20
0
5
10
Frequency (GHz)
15
20
0
5
10
Frequency (GHz)
15
20
17mm Height
25mm Height
32mm Height
5
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