Platinum Resistance Temperature Detector
SMD 0805 (V)
The PRTD SMD 0805 is designed for automatic mounting in large volume applications on printed circuit boards where long
time stability, interchangeability combined with low costs are important.
Nominal
Resistance R0
100 Ohm at 0°
C
1000 Ohm at 0°
C
Tolerance
DIN EN 60751
1996-07
Class B
Class 2B
Class B
Class 2B
Tolerance
DIN EN 60751
2009-05
F 0.3
F 0.6
F 0.3
F 0.6
Order Number
32 207 605
32 207 604
32 207 615
32 207 614
Specification
Tolerance
DIN EN 60751
Class B (R
0
: ±0.12 %)
Class 2B (R
0
: ±0.24 %)
-50°C to +130° (Possible working temperatures
C
using volume expansion aligned conductor board
material: 150°
C)
Tolerance Class B or 2B: -50° up to +130°C
C
TCR = 3850 ppm/K
End-termination galvanic tin plated with
Ni-barrier layer
max. R
0
-drift 0.06 % after 1000h at 130°
C
unhoused for dry environments only
> 100 MΩ at 20° > 2 M
Ω
at 130°
C;
C
(glass covering)
100Ω: 0.3 to 1.0mA
1000Ω: 0.1 to 0.3mA
(self heating has to be considered)
0.8 K/mW at 0°C
Flowing water (v= 0.4m/s):
Air flow (v= 2m/s):
t
0.5
= 0.10s
t
0.9
= 0.25s
t
0.5
= 2.5s
t
0.9
= 8s
Temperature range
Temperature coefficient
Soldering connection
Long term stability
Environmental conditions
Insulation resistance
Measuring current
Self heating
Reaction time
Processing instructions
face up-mounting: reflow soldering or wave
soldering, e. g. double wave < 8s / 235°
C
Min. 9 months (in dry environment)
„Face-up“ in blister reel, 4000 pcs / reel
Other tolerances and values of resistance are
available on request.
Storage life
Packaging
Note
We reserve the right to make alterations and technical data printed. All technical data serves as a guideline and does not guarantee
particular properties to any products.
Heraeus Sensor Technology USA
770 Township Line Road, Suite 300
Yardley, PA 19067 USA
Phone 1-215-944-9010 Fax 1-215-944-9392
Email info.hst-us@heraeus.com
www.hst-us.com
Name of document: 30910037 Index C
Status: 06/2016
Platinum Resistance Temperature Detector
Solderability test of SMD type sensor elements
Assembly conditions
Layout of PCB:
Tested PCB surfaces:
Solder Paste:
SMD 0805 (V)
Benchmarker II 150µm (material FR4 35µm Cu, size 190.5 x 127 x 1.5mm)
chem. Ag, Cu OSP, NiAu, chem. Sn
F640 SA30C5-89 M30 (material SnAgCu 96.5/3.0/0.5)
Tested elements
Pt 1000 SMD- V 0603
Pt 1000 SMD- V 0805
Pt 1000 SMD- V 1206
Solder conditions
Profiles:
Atmosphere:
High and Low
Nitrogen and Air
Mid
2
Mass
3
Mix
Mid:
Mass:
3
Mix:
2
1
1
Peak (max. temperature)
High
Low
237 °
C
245 °
C
231 °
C
238 °
C
238 °
C
248 °
C
time above 217 °C in s
High
Low
60
92
49
68
65
103
Position of temperature sensor in the middle of the PCB
Position of temperature sensor at a big mass area on the PCB
Position of temperature sensors on right and left side on the PCB
Profile High: complete processing time 520 s
Profile Low : complete processing time 280 s
Result
All tested samples showed a sufficient wetting under the described profiles High and Low,
based on a visual soldering point inspection.
All given data should not be construed as guaranteeing specific properties of the product or its suitability for a specific particular
application. The data are an extract from a test report with status from July 2010.
We reserve the right to make alterations and technical data printed. All technical data serves as a guideline and does not guarantee
particular properties to any products.
Heraeus Sensor Technology USA
770 Township Line Road, Suite 300
Yardley, PA 19067 USA
Phone 1-215-944-9010 Fax 1-215-944-9392
Email info.hst-us@heraeus.com
www.hst-us.com
Name of document: 30910037 Index C
Status: 06/2016
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