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ABA-51563-BLK

Description
3.5 GHz Broadband Silicon RFIC Amplifier
CategoryWireless rf/communication    Radio frequency and microwave   
File Size103KB,8 Pages
ManufacturerHP(Keysight)
Websitehttp://www.semiconductor.agilent.com/
Download Datasheet Parametric Compare View All

ABA-51563-BLK Overview

3.5 GHz Broadband Silicon RFIC Amplifier

ABA-51563-BLK Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerHP(Keysight)
package instructionTSSOP6,.08
Reach Compliance Codeunknown
Is SamacsysN
Other featuresHIGH RELIABILITY
Characteristic impedance50 Ω
structureCOMPONENT
Gain20 dB
Maximum input power (CW)20 dBm
JESD-609 codee0
Installation featuresSURFACE MOUNT
Number of functions1
Number of terminals6
Maximum operating frequency3500 MHz
Minimum operating frequency
Package body materialPLASTIC/EPOXY
Encapsulate equivalent codeTSSOP6,.08
power supply5 V
RF/Microwave Device TypesWIDE BAND LOW POWER
surface mountYES
technologyBIPOLAR
Terminal surfaceTin/Lead (Sn/Pb)
Maximum voltage standing wave ratio1.2
Base Number Matches1
Agilent ABA-51563
3.5 GHz Broadband Silicon
RFIC Amplifier
Data Sheet
Features
• Operating frequency: DC ~ 3.5 GHz
• 21.5 dB gain
• VSWR < 2.0 throughout operating
frequency
• 1.8 dBm output P1dB
Description
Agilent’s ABA-51563 is an
economical, easy-to-use, inter-
nally 50-ohm matched silicon
monolithic broadband amplifier
that offers excellent gain and flat
broadband response from DC to
3.5 GHz. Packaged in an ultra-
miniature industry-standard
SOT-363 package, it requires half
the board space of a SOT-143
package.
At 2 GHz, the ABA-51563 offers a
small-signal gain of 21.5 dB,
output P1dB of 1.8 dBm and
11.4 dBm output third order
intercept point. It is suitable for
use as buffer amplifiers for
wideband applications. They are
designed for low cost gain blocks
in cellular applications, DBS
tuners, LNB and other wireless
communications systems.
ABA-51563 is fabricated using
Agilent’s HP25 silicon bipolar
process, which employs a double-
diffused single polysilicon
process with self-aligned submi-
cron emitter geometry. The
process is capable of simulta-
neous high f
T
and high NPN
breakdown (25 GHz f
T
at 6V
BVCEO). The process utilizes
industry standard device oxide
isolation technologies and
submicron aluminum multilayer
interconnect to achieve superior
performance, high uniformity,
and proven reliability.
Surface Mount Package
SOT-363/SC70
• 3.7 dB noise figure
• Unconditionally stable
• Single 5V supply (Id = 18 mA)
• Lead-free option available
Applications
• Amplifier for cellular, cordless,
special mobile radio, PCS, ISM,
wireless LAN, DBS, TVRO, and TV
tuner applications
Output
& Vcc
Pin Connections and
Package Marking
GND 1
GND 2
Input
Note:
Top View. Package marking provides orientation
and identification. “x” is character to identify
date code.
Simplified Schematic
Vcc
AHx
GND 3
Vcc
Attention:
Observe precautions for
handling electrostatic
sensitive devices.
ESD Machine Model (Class A)
ESD Human Body Model (Class 1A)
Refer to Agilent Application Note A004R:
Electrostatic Discharge Damage and Control.
RF
Output
& Vcc
RF
Input
Ground 2
Ground 3
Ground 1

ABA-51563-BLK Related Products

ABA-51563-BLK ABA-51563 ABA-51563-TR1G ABA-51563-TR2 ABA-51563-TR2G ABA-51563-BLKG ABA-51563-TR1
Description 3.5 GHz Broadband Silicon RFIC Amplifier 3.5 GHz Broadband Silicon RFIC Amplifier 0 MHz - 3500 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER GT 7C 7#16S PIN PLUG GT 7C 7#16S SKT PLUG 3.5 GHz Broadband Silicon RFIC Amplifier GT 2C 2#12 SKT PLUG
Is it Rohs certified? incompatible - conform to incompatible conform to conform to incompatible
Maker HP(Keysight) - HP(Keysight) HP(Keysight) HP(Keysight) HP(Keysight) HP(Keysight)
package instruction TSSOP6,.08 - TSSOP6,.08 TSSOP6,.08 TSSOP6,.08 TSSOP6,.08 TSSOP6,.08
Reach Compliance Code unknown - unknow unknow unknown unknown unknow
Other features HIGH RELIABILITY - HIGH RELIABILITY HIGH RELIABILITY HIGH RELIABILITY HIGH RELIABILITY HIGH RELIABILITY
Characteristic impedance 50 Ω - 50 Ω 50 Ω 50 Ω 50 Ω 50 Ω
structure COMPONENT - COMPONENT COMPONENT COMPONENT COMPONENT COMPONENT
Gain 20 dB - 20 dB 20 dB 20 dB 20 dB 20 dB
Maximum input power (CW) 20 dBm - 20 dBm 20 dBm 20 dBm 20 dBm 20 dBm
JESD-609 code e0 - e3 e0 e3 e3 e0
Installation features SURFACE MOUNT - SURFACE MOUNT SURFACE MOUNT SURFACE MOUNT SURFACE MOUNT SURFACE MOUNT
Number of functions 1 - 1 1 1 1 1
Number of terminals 6 - 6 6 6 6 6
Maximum operating frequency 3500 MHz - 3500 MHz 3500 MHz 3500 MHz 3500 MHz 3500 MHz
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
Encapsulate equivalent code TSSOP6,.08 - TSSOP6,.08 TSSOP6,.08 TSSOP6,.08 TSSOP6,.08 TSSOP6,.08
power supply 5 V - 5 V 5 V 5 V 5 V 5 V
RF/Microwave Device Types WIDE BAND LOW POWER - WIDE BAND LOW POWER WIDE BAND LOW POWER WIDE BAND LOW POWER WIDE BAND LOW POWER WIDE BAND LOW POWER
surface mount YES - YES YES YES YES YES
technology BIPOLAR - BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR
Terminal surface Tin/Lead (Sn/Pb) - Tin (Sn) Tin/Lead (Sn/Pb) Tin (Sn) Tin (Sn) Tin/Lead (Sn/Pb)
Maximum voltage standing wave ratio 1.2 - 1.2 1.2 1.2 1.2 1.2

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