SMD2040
Datasheet revision 1.1
www.chipquik.com
Solder Spheres for BGAs
Product Highlights
Chip Quik® BGA solder spheres are manufactured from virgin materials to meet or exceed the requirements of building or
repairing BGA packages. Chip Quik® BGA solder spheres also exceed both the IPC and MIL standards for purity levels and
size tolerances. Nominal sizes are available from 12 to 30 mil.
Product Specifications
Part Number
SMD2165
SMD2165-25000
SMD2180
SMD2180-25000
SMD2190
SMD2190-25000
SMD2200
SMD2200-25000
SMD2205
SMD2205-25000
SMD2215
SMD2215-25000
SMD2040
SMD2040-25000
SMD2050
SMD2050-25000
SMD2055
SMD2055-25000
SMD2060
SMD2060-25000
Shelf Life:
Test Results
Test J-STD-004 or other
requirements as stated
Conflict Minerals Compliance
REACH Compliance
Alloy
Sn63/Pb37
Sn63/Pb37
Sn63/Pb37
Sn63/Pb37
Sn63/Pb37
Sn63/Pb37
Sn63/Pb37
Sn63/Pb37
Sn63/Pb37
Sn63/Pb37
Sn63/Pb37
Sn63/Pb37
Sn96.5/Ag3.0/Cu0.5
Sn96.5/Ag3.0/Cu0.5
Sn96.5/Ag3.0/Cu0.5
Sn96.5/Ag3.0/Cu0.5
Sn96.5/Ag3.0/Cu0.5
Sn96.5/Ag3.0/Cu0.5
Sn96.5/Ag3.0/Cu0.5
Sn96.5/Ag3.0/Cu0.5
>24 months
Melting Point
183°C (361°F)
183°C (361°F)
183°C (361°F)
183°C (361°F)
183°C (361°F)
183°C (361°F)
183°C (361°F)
183°C (361°F)
183°C (361°F)
183°C (361°F)
183°C (361°F)
183°C (361°F)
217-220°C (423-428°F)
217-220°C (423-428°F)
217-220°C (423-428°F)
217-220°C (423-428°F)
217-220°C (423-428°F)
217-220°C (423-428°F)
217-220°C (423-428°F)
217-220°C (423-428°F)
Diameter
0.012" (0.3048mm)
0.012" (0.3048mm)
0.016" (0.4064mm)
0.016" (0.4064mm)
0.020" (0.5080mm)
0.020" (0.5080mm)
0.024" (0.6096mm)
0.024" (0.6096mm)
0.025" (0.6350mm)
0.025" (0.6350mm)
0.030" (0.7620mm)
0.030" (0.7620mm)
0.020" (0.5080mm)
0.020" (0.5080mm)
0.024" (0.6096mm)
0.024" (0.6096mm)
0.025" (0.6350mm)
0.025" (0.6350mm)
0.030" (0.7620mm)
0.030" (0.7620mm)
Quantity (by weight)
250,000
25,000
250,000
25,000
250,000
25,000
250,000
25,000
250,000
25,000
250,000
25,000
250,000
25,000
250,000
25,000
250,000
25,000
250,000
25,000
Test Requirement
Electronic Industry Citizenship
Coalition (EICC)
Articles 33 and 67 of Regulation (EC)
No 1907/2006
Result
Compliant
Contains no substance >0.1% w/w that
is listed as a SVHC or restricted for
use in solder materials
Conforms to the following Industry Standards:
J-STD-006C, Amendments 1 & 2 (Solder Alloys and Fluxed/Non-Fluxed Solders):
RoHS 2 Directive 2011/65/EU:
Yes
Yes (Sn96.5/Ag3.0/Cu0.5) /
No (Sn63/Pb37)
1
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