L200BB12VK datasheet, PDF - EEWORLD Datasheet

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L200BB12VK: Description128K X 16 FLASH 3V PROM, 120 ns, PDSO48; Categorystorage; File Size707KB，46 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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L200BB12VK Overview

128K X 16 FLASH 3V PROM, 120 ns, PDSO48

L200BB12VK Parametric

Parameter Name	Attribute value
Number of functions	1
Number of terminals	48
Maximum operating temperature	70 Cel
Minimum operating temperature	0.0 Cel
Maximum supply/operating voltage	3.6 V
Minimum supply/operating voltage	2.7 V
Rated supply voltage	3 V
maximum access time	120 ns
Processing package description	MO-142DD, TSOP-48
state	TRANSFERRED
Craftsmanship	CMOS
packaging shape	Rectangle
Package Size	SMALL OUTLINE, THIN PROFILE
surface mount	Yes
Terminal form	GULL WING
Terminal spacing	0.5000 mm
Terminal location	pair
Packaging Materials	Plastic/Epoxy
Temperature level	COMMERCIAL
memory width	16
organize	128K × 16
storage density	2.10E6 deg
operating mode	ASYNCHRONOUS
Number of digits	131072 words
Number of digits	128K
Spare memory width	8
Memory IC type	FLASH 3V programmable read-only memory
serial parallel	parallel

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Am29LV200B

Data Sheet

The Am29LV200B is not offered for new designs. Please contact a Spansion representative for alter-

nates.

The following document contains information on Spansion memory products. Although the document

is marked with the name of the company that originally developed the specification, Spansion will

continue to offer these products to existing customers.

Continuity of Specifications

There is no change to this data sheet as a result of offering the device as a Spansion product. Any

changes that have been made are the result of normal data sheet improvement and are noted in the

document revision summary, where supported. Future routine revisions will occur when appro and

changes will be noted in a revision summary.

Continuity of Ordering Part Numbers

Spansion continues to support existing part numbers beginning with “Am” and “MBM”. To order these

products, please use only the Ordering Part Numbers listed in this document.

For More Information

Please contact your local sales office for additional information about Spansion memory solutions.

Publication Number

21521

Revision

Amendment

Issue Date

October 10, 2006

DATA SHEET

TABLE OF CONTENTS

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Special Handling Instructions ................................................... 6

Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Table 1. Am29LV200B Device Bus Operations ................................ 9

DQ2: Toggle Bit II ................................................................... 21

Reading Toggle Bits DQ6/DQ2 ............................................... 21

DQ5: Exceeded Timing Limits ................................................ 22

DQ3: Sector Erase Timer ....................................................... 22

Figure 6. Toggle Bit Algorithm ........................................................ 22

Table 6. Write Operation Status..................................................... 23

Word/Byte Configuration .......................................................... 9

Requirements for Reading Array Data ..................................... 9

Writing Commands/Command Sequences .............................. 9

Program and Erase Operation Status .................................... 10

Standby Mode ........................................................................ 10

Automatic Sleep Mode ................................................................10

RESET#: Hardware Reset Pin ...................................................10

Output Disable Mode .............................................................. 11

Table 2. Am29LV200BT Top Boot Block Sector Address Table..... 11

Table 3. Am29LV200BB Bottom Boot Block Sector Address Table 11

Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . 24

Extended (E) Devices ............................................................. 24

Supply Voltages .............................................................. 24

Figure 9. I

CC1

Current vs. Time (Showing Active and Automatic

Sleep Currents) .............................................................................. 26

Figure 10. Typical I

CC1

vs. Frequency ........................................... 26

Figure 11. Test Setup ..................................................................... 27

Table 7. Test Specifications ........................................................... 27

Autoselect Mode ..................................................................... 11

Table 4. Am29LV200B Autoselect Codes (High Voltage Method).. 12

Key to Switching Waveforms. . . . . . . . . . . . . . . . 27

Figure 12. Input Waveforms and Measurement Levels ................. 27

Sector Protection/Unprotection ............................................... 12

Temporary Sector Unprotect .................................................. 12

Figure 1. In-System Sector Protect/Unprotect Algorithms ...............13

Figure 2. Temporary Sector Unprotect Operation ...........................14

Read Operations .................................................................... 28

Figure 13. Read Operations Timings ............................................. 28

Hardware Reset (RESET#) .................................................... 29

Figure 14. RESET# Timings .......................................................... 29

Hardware Data Protection ...................................................... 14

Low V

Write Inhibit .............................................................. 14

Write Pulse “Glitch” Protection ............................................... 14

Logical Inhibit .......................................................................... 14

Power-Up Write Inhibit ............................................................ 14

Reading Array Data ................................................................ 15

Reset Command ..................................................................... 15

Autoselect Command Sequence ............................................ 15

Word/Byte Program Command Sequence ............................. 15

Unlock Bypass Command Sequence ..................................... 16

Figure 3. Program Operation ..........................................................16

Word/Byte Configuration (BYTE#) ........................................ 30

Figure 15. BYTE# Timings for Read Operations ............................ 30

Figure 16. BYTE# Timings for Write Operations ............................ 30

Erase/Program Operations ..................................................... 31

Figure 17. Program Operation Timings .......................................... 32

Figure 18. Chip/Sector Erase Operation Timings .......................... 33

Figure 19. Data# Polling Timings (During Embedded Algorithms) . 34

Figure 20. Toggle Bit Timings (During Embedded Algorithms) ...... 34

Figure 21. DQ2 vs. DQ6 ................................................................. 35

Temporary Sector Unprotect .................................................. 35

Figure 22. Temporary Sector Unprotect Timing Diagram .............. 35

Figure 23. Sector Protect/Unprotect Timing Diagram .................... 36

Chip Erase Command Sequence ........................................... 16

Sector Erase Command Sequence ........................................ 17

Erase Suspend/Erase Resume Commands ........................... 17

Figure 4. Erase Operation ...............................................................18

Alternate CE# Controlled Erase/Program Operations ............ 37

Figure 24. Alternate CE# Controlled Write Operation Timings ...... 38

Command Definitions ............................................................. 19

Table 5. Am29LV200B Command Definitions................................. 19

DQ7: Data# Polling ................................................................. 20

Figure 5. Data# Polling Algorithm ...................................................20

RY/BY#: Ready/Busy# ........................................................... 21

DQ6: Toggle Bit I .................................................................... 21

Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 39

TSOP and SO Pin Capacitance . . . . . . . . . . . . . . 39

Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

TS 048—48-Pin Standard TSOP ............................................ 40

SO 044—44-Pin Small Outline Package ................................ 41

FBA048—48-Ball Fine-Pitch Ball Grid Array, 0.80 mm pitch,

6 x 8 mm package .................................................................. 42

October 10, 2006 21521D6

Am29LV200B

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