NUMBER
TYPE
GS-12-194
TITLE
PRODUCT SPECIFICATION
PAGE
REVISION
1 of 11
Serial-ATA Connector
AUTHORIZED BY
DATE
H
19 Oct 2017
HK LIM
CLASSIFICATION
UNRESTRICTED
1.0
OBJECTIVE
This specification defines the performance, test, quality and reliability requirement of the Serial-ATA host
and device connectors.
2.0
SCOPE
This specification is applicable to the termination characteristics of the Serial-ATA family of products
which provides for direct blind mate interconnection of disk drives to backplanes.
3.0
RATINGS
3.1
3.2
3.3
3.4
Operating Voltage Rating = 30 Volts Max (V
AC
or V
DC
)
Operating Current Rating = 1.5 Amperes per contact (DC or AC (RMS) MAX. @ 60 HZ)
Operating Temperature Range = 0 to 85 (
o
C)
Non-Operating Temperature Range = -40 to 85 (
o
C)
4.0
APPLICABLE DOCUMENTS
4.1
Application
4.1.1
4.1.2
Engineering drawings
Process drawings
4.2
Federal Specifications
4.2.1
4.2.2
QQ-N-290 :
QQ-S-571 :
Nickel Plating (Electrodeposited)
Solder
4.3 Other Standards and Specifications
4.3.1
4.3.2
4.3.3
UL94-V0 :
EIA 364 :
Serial-ATA :
Flammability
Electrical Connector/Socket Test Procedures Including Environmental
Classifications
Current Revision
4.4 FCI Specifications
4.4.1
4.4.2
4.4.3
4.4.4
©2016 AFCI
BUS-03-114 : Capacitance Measurement
BUS-03-404 : Normal Force Measurement
BUS-03-405 : Insertion / Withdrawal Force Measurement
BUS-15-002/X : Nickel Plating
PDS: Rev :H
STATUS:Released
Printed: Oct 26, 2017
NUMBER
TYPE
GS-12-194
TITLE
PRODUCT SPECIFICATION
PAGE
REVISION
2 of 11
Serial-ATA Connector
AUTHORIZED BY
DATE
H
19 Oct 2017
HK LIM
CLASSIFICATION
UNRESTRICTED
4.4.5
4.4.6
4.4.7
4.4.8
4.4.9
4.4.10
4.4.11
4.4.12
BUS-15-006/X : Tin/Lead Plating
BUS-15-005/X : Gold in Contact Plating
BUS-19-002: Solderability
BUS-19-020: Porosity
BUS-19-040: Plating Adhesion
BUS-19-122: Solder Joint Reliability
GS-22-011:
Pb-free Solder Heat Resistance Procedure – Convection Oven Flow
GS-22-012:
Pb-free Solder Heat Resistance Procedure – Wave Solder
5.0
REQUIREMENTS
5.1 Qualification
Connectors furnished under this specification shall be capable of meeting the qualification test
requirements specified herein. Unless otherwise specified, all measurements shall be performed
within the following lab conditions ;
Temperature : 15 to 35°C
Relative Humidity : 20% to 80%
Atmospheric Pressure : 650mm to 800mm of Hg (86 ~106Kpa)
5.2 Material
Material for each part shall be specified herein, or equivalent. Substitute material shall meet the
performance requirements of this specification.
5.2.1
5.2.2
5.2.3
Receptacle Terminal - The base material shall be phosphor-bronze strip or equivalent.
Plug Terminal - The base material shall be brass or equivalent.
Plug and Receptacle Insulator Housings - The insulators for the plug and receptacle
connectors shall be molded of glass filled high performance polyplastic that is rated
UL94V-0 or better in accordance with UL-94. See applicable product drawing for
material.
Plug Hold-down Terminal – The base material shall be brass or equivalent.
Receptacle Hold-down Terminal – The base material shall be phosphor-bronze or brass.
See applicable product drawing for material.
5.2.4
5.2.5
5.3
Finish
5.3.1 Plated finished for qualification components shall be as specified herein or equivalent.
The plug and receptacle terminals shall be plated in the contact area to the minimum gold
plating or palladium nickel with gold flash plating thickness specified on product prints
(over 1,27um/50u” minimum nickel underplate). The plug and receptacle terminal soldertail
sections shall be plated with 1,27um/50u” 90/10 tin–lead minimum or tin minimum as
specified on product prints (over 1,27um/50u” nickel minimum underplate). The plug and
receptacle press fit area shall be plated with 0,5um/20u” minimum – 1,5um/60u” maximum
90/10 tin-lead or tin (over 1,27um/50u” nickel minimum underplate). No plating at cut-off
point.
©2016 AFCI
PDS: Rev :H
STATUS:Released
Printed: Oct 26, 2017
NUMBER
TYPE
GS-12-194
TITLE
PRODUCT SPECIFICATION
PAGE
REVISION
3 of 11
Serial-ATA Connector
AUTHORIZED BY
DATE
H
19 Oct 2017
HK LIM
CLASSIFICATION
UNRESTRICTED
5.3.2
The metal hold down terminals for the plug and receptacle connectors shall be plated with
1,27um/50u” 90/10 tin-lead minimum or tin minimum as specified on product prints (over
1,27um/50umminimum nickel underplate). No plating at cut-off point.
5.4
Design and Construction
The plug connector shall be a multi-piece assembly having single row of contacts in the mating
area which dividing into signal segment (S1-S7) and power segment (P1-P15) or either one which
transition out to either surface mount style or solder style soldertail to accommodate various P.C.
board thickness. The contact pattern in the mating area will have short and long terminals in a
specific pattern that results in a 0.5mm (0,020’) differential between contact points in the long and
short terminals. (This allows for first mate-last break capability - see respective product prints for
location of short and long terminals.)
The receptacle connector shall be a multi-piece assembly having single row of contacts in the
mating area which dividing into signal segment (S1-S7) and power segment (P1-P15) which
transition out to a in-line or stagger through hole pattern or surface mount pad. The contact pattern
in the mating area will have short and long terminals in a specific pattern that results in a 0.5mm
(0.020”) differential between contact points in the long and short terminals. (This allows for first
mate-last break capability – see respective product prints for location of short and long terminals.)
The receptacle hold down terminal has the board retention features that secure the connector to
the board in preparation for solder reflow (through-hole) or board termination (press-fit).
A polarization peg (optional) on the bottom of the connector housing assures proper connector
orientation during board mounting. The receptacle through hole connector and press fit connector
are designed to terminate to board thickness of 1.57mm (0.062”), 2.36mm (0.093”) and 3.18mm
(0.125”). Visual examination of connectors to be done per EIA 364-18.
5.4.1
5.4.2
Mating. The connectors shall be capable of mating and unmating manually without the
use of special tools.
Workmanship. Connectors shall be uniform in quality and shall be free from burrs,
scratches, cracks, voids, chips, blisters, pin holes, sharp edges, and other defects that
will adversely affect product’s life or serviceability.
6
ELECTRICAL CHARACTERISTIC
6.1
Current Rating. The temperature rise above ambient shall not exceed 30°C at any point in the
system when contact positions specified are powered at the power levels specified herein:
a)
b)
c)
Ambient Conditions: still air at 25°C
Current Rating : 1.5A min per contact
Preparation: (i) Mount the connector to a test PCB;
(ii) Wire 3 adjacent pins(e.g. P1, P2, P3) in parallel for power supply;
(iii) Wire 3 adjacent pins(e.g. P4, P5, P6) in parallel for return;
(iv) Supply 4.5A in total of DC current to the power pins in parallel, returning
from the parallel ground pins;
©2016 AFCI
PDS: Rev :H
STATUS:Released
Printed: Oct 26, 2017
NUMBER
TYPE
GS-12-194
TITLE
PRODUCT SPECIFICATION
PAGE
REVISION
4 of 11
Serial-ATA Connector
AUTHORIZED BY
DATE
H
19 Oct 2017
HK LIM
CLASSIFICATION
UNRESTRICTED
(v) Record temperature rise when thermal equilibrium is reached.
d)
Reference : EIA 364-70A
6.2 Low Level Contact Resistance. The low-level contact resistance of a Serial-ATA receptacle connector
mated with a Serial-ATA plug connector shall not exceed a change of 15mΩ after environmental
exposure when measured in accordance with EIA 364-23. The maximum initial signal contact
resistance is 30mΩ shall not be exceeded after environmental exposure when measured in
accordance with EIA 364-23. The following details shall apply:
a) Test Voltage : 20mV DC maximum at open circuit.
b) Test Current : not to exceed 100mA.
6.3
Insulation Resistance. The insulation resistance of mated connectors shall not be less than
1000mΩ when measured in accordance with EIA 364-21. The following details shall apply:
a) Test Voltage : 500V DC
b) Preparation : The connectors shall be mated but not soldered to a PC board
c) Electrification Time : 1 minute
d) Point of Measurement: Between adjacent contacts.
6.4
Dielectric Withstanding Voltage. There shall be no evidence of arc-over, insulation breakdown, or
excessive leakage current (0.5mA max) when the mated connectors are tested in accordance with
EIA 364-20, method B. The following details shall apply:
a) Test Voltage : DC 500V or AC 500V
rms
.
b) Test Duration : 1 minute
c) Preparation : The connectors shall be mated but not soldered to a PC board
d) Test Condition : 1 (760 Torr, or sea level)
e) Points of measurement : Between adjacent contacts
6.5
Low Level Press-fit Interface Resistance. The interface between compliant section and plated
through hole. The change in low level contact resistance shall not exceed 1.0mΩ after
environmental exposure when measured in accordance with EIA 364-23. The following details
shall apply:
a) Test Voltage : 20mV DC maximum at open circuit.
b) Test Current : not to exceed 100mA.
©2016 AFCI
PDS: Rev :H
STATUS:Released
Printed: Oct 26, 2017
NUMBER
TYPE
GS-12-194
TITLE
PRODUCT SPECIFICATION
PAGE
REVISION
5 of 11
Serial-ATA Connector
AUTHORIZED BY
DATE
H
19 Oct 2017
HK LIM
CLASSIFICATION
UNRESTRICTED
7
MECHANICAL CHARACTERISTIC
7.1
Mating / Unmating Force (Insertion/ Removal) : The force to mate a receptacle connector and
compatible plug connector shall not exceed 20N(2.04kgf). The unmating force shall not be less
than 4N(0.41kgf) after 500 cycles. The following details shall apply:
a) Cross Head Speed : max. rate 12.5mm per minute
b) Utilise free floating fixtures
c) Reference: EIA 364-13
7.2
Durability. EIA 364-09C
a) Number of Cycles : Device / Host Connectors : 500 cycles
Internal Cabled Connector : 50 cycles
b) Cycling Rates: Maximum 200 cycles/hour
c) Preconditioning Cycles : Device / Host connectors : 50 cycles
Cabled Connector : 20 cycles
d) No physical damage shall be observed
7.3
Contact Retention : Individual contacts (signal and hold down terminal ) in the plug and
receptacle housing shall withstand an axial load of 1.1 lbs ( 500 grams) minimum applied at a rate
of 0.20 inches/minute without dislodging from the housing cavity. Shall there is any deviation of
this load from drawing callout, drawing will supercede.
a)
7.4
Reference : EIA 364-29B
Normal force : The contact normal force shall not be less than 60 grams (nor greater than 200
grams) when tested in accordance with FCI test specification BUS-03-404.
Individual Pin Insertion / Retention Force : The force required to insert an individual compliant
pin into a plated through hole in a printed circuit board at a rate of 5mm/ 0.2 inches per minute
shall not exceed 50N. The retention force in the axial direction opposite that of insertion shall not
be less than 5N.
PCB Hole Deformation Radius : Cross-section parallel to board surface. Photograph and
measure hole deformation (deformation on board material) radius at a point 0.25 mm/ 0.010” from
the surface and at the center of the compliant pin section. Include 10 holes. The minimum average
(of 10 holes) hole deformation radius shall be no greater than 37,5um/ 0.0015” when measured
form the drilled hole. The absolute maximum deformation radius shall not exceed 50um/ 0.002”.
Reference MIL-STD-2166.
7.5
7.6
7.7 PCB Hole Wall Damage : Cross-section perpendicular to board surface and through the
compliant section wear track. Photograph and measure the copper thickness remaining between
the compliant section and the printed wiring board laminate. Include 10 holes. The minimum
average (of 10 holes) copper thickness remaining between the compliant pin and the printed
©2016 AFCI
PDS: Rev :H
STATUS:Released
Printed: Oct 26, 2017
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