Embedded ZigBee modules provide OEMs with a simple
way to integrate mesh technology into their application
Digi XBee and Digi XBee-PRO ZigBee RF modules provide
cost-effective wireless connectivity to electronic devices. They
are interoperable with other ZigBee PRO feature set devices,
including devices from other vendors*.
Digi XBee and Digi XBee-PRO ZigBee modules are ideal
for applications in the energy and controls markets where
manufacturing efficiencies are critical. The Serial Peripheral
Interface (SPI) provides a high-speed interface and optimizes
integration with embedded microcontrollers, lowering
development costs and reducing time to market.
Products in the Digi XBee family require little to no
configuration or additional development. Programmable
BENEFITS
– Programmable versions with on-board microprocessor
enable custom ZigBee application development
– Through-Hole and Surface Mount form factors enable
flexible design options
– Link budgets of 110 dB for Digi XBee and 119 dB for
Digi XBee-PRO
– Industry-leading sleep current
– Firmware upgrades via UART, SPI or over the air (OTA)
– Thread updatable on the S2D EM3587 variant for
maximum flexibility
DIGI XBEE®
ZIGBEE GATEWAY
Ethernet
versions of the Digi XBee and Digi XBee-PRO ZigBee module
make customizing applications easy. Programming directly
on the module eliminates the need for a separate processor.
Because the wireless software is isolated, applications can be
developed with no risk to RF performance or security.
Digi’s ZigBee compatible module is based on the Ember
EM35x (EM357 and EM3587) system on chip (SoC) radio ICs
from SiliconLabs, utilizing 32-bit ARM Cortex™ M3 processor.
The S2D EM3587 version has a larger memory footprint for
customers who may want to upgrade to Thread, an IPv6
based networking stack.
*Interoperability requires the ZigBee Feature Set or ZigBee PRO Feature Set to be deployed on all
devices. Contact Digi Support for details.
APPLICATION EXAMPLE
REMOTE MONITORING
OFFICE
DIGI REMOTE MANAGER®
ZIGBEE WIRELESS MESH NETWORK
Cellular/Wi-Fi/Ethernet
RELATED PRODUCTS
Solar
panel
Solar
Inverter
Digi XBee
Gateways
Modules
Network
Extenders
Development
Kits
Digi Remote
Manager®
DIGI XBEE®
MODULE
SPECIFICATIONS
SPECIFICATIONS
PERFORMANCE
Digi XBee
®
S2C ZigBee
Standard
| Programmable
Digi XBee-PRO® S2C ZigBee
Standard
| Programmable
Digi XBee® S2D ZigBee Thread Ready
Standard
TRANSCEIVER CHIPSET
DATA RATE
INDOOR/URBAN RANGE*
OUTDOOR/RF LINE-OF-SIGHT
RANGE*
TRANSMIT POWER
RECEIVER SENSITIVITY
(1% PER)
FEATURES
Silicon Labs EM357 SoC
RF 250 Kbps, Serial up to 1 Mbps
Up to 200 ft (60 m)
Up to 4000 ft (1200 m)
3.1 mW (+5 dBm) / 6.3 mW (+8 dBm)
boost mode
-100 dBm / -102 dBm boost mode
Up to 300 ft (90 m)
Up to 2 miles (3200 m)
63 mW (+18 dBm)
-101 dBm
Silicon Labs EM3587 Soc
Up to 200 ft (60 m)
Up to 4000 ft (1200 m)
3.1 mW (+5 dBm) / 6.3 mW (+8 dBm)
boost mode
-100 dBm / -102 dBm boost mode
SERIAL DATA INTERFACE
CONFIGURATION METHOD
FREQUENCY BAND
FORM FACTOR
INTERFERENCE IMMUNITY
ADC INPUTS
DIGITAL I/O
ANTENNA OPTIONS
OPERATING TEMPERATURE
DIMENSIONS (L X W X H) AND
WEIGHT
PROGRAMMABILITY
UART, SPI
API or AT commands, local or over-the-air (OTA)
ISM 2.4 GHz
Through-Hole, Surface Mount
DSSS (Direct Sequence Spread Spectrum)
(4) 10-bit ADC inputs
15
Through-Hole: PCB Antenna, U.FL Connector, RPSMA Connector, or Integrated Wire
SMT: RF Pad, PCB Antenna, or U.FL Connector
-40º C to +85º C
Through-Hole: 0.960 x 1.087 in
(2.438 x 2.761 cm)
SMT: 0.866 x 1.33 x 0.120 in
(2.199 x 3.4 x 0.305 cm)
Through-Hole: 0.960 x 1.297 in
(2.438 x 3.294 cm)
SMT: 0.866 x 1.33 x 0.120 in
(2.199 x 3.4 x 0.305 cm)
SMT: 0.866 x 1.33 x 0.120 in
(2.199 x 3.4 x 0.305 cm)
Surface Mount
MEMORY
CPU/CLOCK SPEED
NETWORKING AND SECURITY
N/A
N/A
32 KB Flash /
2 KB RAM
HCS08 /
up to 50.33 MHz
N/A
N/A
32 KB Flash /
2 KB RAM
HCS08 / up to
50.33 MHz
N/A
N/A
PROTOCOL
ENCRYPTION
RELIABLE PACKET DELIVERY
IDS
CHANNELS
POWER REQUIREMENTS
ZigBee PRO 2007, HA-Ready with support for binding/multicasting
128-bit AES
Retries/Acknowledgements
PAN ID and addresses, cluster IDs and endpoints (optional)
16 channels
15 channels
16 channels
SUPPLY VOLTAGE
TRANSMIT CURRENT
RECEIVE CURRENT
POWER-DOWN CURRENT
REGULATORY APPROVALS
2.1 to 3.6V
33 mA @ 3.3 VDC /
45 mA boost mode
28 mA @ 3.3 VDC /
31 mA boost mode
<1 μA @ 25º C
47 mA @ 3.3 VDC /
59 mA boost mode
42 mA @ 3.3 VDC /
45 mA boost mode
1.5 μA @ 25º C
2.7 to 3.6V
120 mA @ 3.3 VDC
31 mA @ 3.3 VDC
<1 μA @ 25º C
120 mA @ 3.3 VDC
45 mA @ 3.3 VDC
1.5 μA @ 25º C
2.1 to 3.6V
33 mA @ 3.3 VDC / 45 mA boost mode
28 mA @ 3.3 VDC / 31 mA boost mode
<3 μA at 25º C
FCC, IC (NORTH AMERICA)
ETSI (EUROPE)
RCM (AUSTRALIA AND
NEW ZEALAND)
Yes
Yes
Yes
Yes
No
Yes
Yes
Yes
No (Coming Soon)
* Range figure estimates are based on free-air terrain with limited sources of interference. Actual range will vary based on transmitting power, orientation of transmitter and receiver,
height of transmitting antenna, height of receiving antenna, weather conditions, interference sources in the area and terrain between receiver and transmitter including indoor and
outdoor structures such as walls, trees, buildings, hills, mountains, etc.
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