BM78SPPS5NC2-0002AA datasheet, PDF

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BM78SPPS5NC2-0002AA: DescriptionBluetooth / 802.15.1 Modules Bluetooth 4.2 Dual Mode (ROM) Data Module, Shielded, Antenna, 12x22mm; CategoryWireless rf/communication Telecom circuit; File Size2MB，61 Pages; ManufacturerMicrochip; Websitehttps://www.microchip.com

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BM78SPPS5NC2-0002AA Overview

Bluetooth / 802.15.1 Modules Bluetooth 4.2 Dual Mode (ROM) Data Module, Shielded, Antenna, 12x22mm

BM78SPPS5NC2-0002AA Parametric

Parameter Name	Attribute value
Maker	Microchip
package instruction	MODULE
Reach Compliance Code	compliant
Factory Lead Time	13 weeks
Samacsys Description	Bluetooth 4.2 Module w/Antenna w/ROM
JESD-30 code	X-XXMA-N
Number of functions	1
Maximum operating temperature	70 °C
Minimum operating temperature	-20 °C
Package body material	UNSPECIFIED
Package shape	UNSPECIFIED
Package form	MICROELECTRONIC ASSEMBLY
Nominal supply voltage	1.9 V
surface mount	YES
Telecom integrated circuit types	TELECOM CIRCUIT
Temperature level	OTHER
Terminal form	NO LEAD
Terminal location	UNSPECIFIED

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BM78

Bluetooth

4.2 Dual-Mode Module

Features

• Bluetooth Classic (BR/EDR) and Low Energy (LE)

• Certified to FCC, IC, MIC, KCC, and NCC radio

regulations

• European R&TTE Directive Assessed Radio mod-

ule

• Bluetooth SIG 4.2 qualified

• Transparent UART mode for seamless serial data

over UART interface

• Easy to configure with User Interface (UI) tool, a

Windows

configuration utility or directly by

MCUs

• Firmware can be upgraded in the field over UART

(Flash version)

• Integral chip antenna (BM78SPPS5MC2/NC2) or

external antenna (BM78SPP05MC2/NC2)

• Integrated crystal, internal voltage regulator, and

matching circuitry

• Configurable I/O pins for control and status

• Supports Apple

iPod Accessory Protocol (iAP2),

(only BM78SPPx5MC2)

• Supports Bluetooth 4.2 LE secure connections

• Bluetooth 4.2 LE data packet length extension

• Small and compact surface mount module

• Castellated SMT pads for easy and reliable PCB

mounting

• Ideal for portable battery operated devices

• One LED driver with 16 steps brightness control

MAC/Baseband/Higher Layer

• Secure AES128 encryption

• Bluetooth 3.0: GAP, SPP, SDP, RFCOMM, and

L2CAP

• Bluetooth 4.2: GAP, GATT, ATT, SMP, and L2CAP

Operating Conditions

• Operating voltage range: 3.3V to 4.2V

• Operating temperature: -20ºC to +70ºC

Applications

•

Internet of Things (IoT)

Secure Payment

Home and Security

Health and Fitness

Industrial and Data Logger

LED Lighting (16 configurations)

RF/Analog

• Frequency: 2.402 GHz to 2.480 GHz

• Receive Sensitivity: -90 dBm (BR/EDR), -92 dBm

(LE)

• Class 2 output power (+1.5 dBm typical)

Data Throughput

Data Throughput at 1 Mbps UART baud rate:

• BR/EDR: up to 32 Kbps

• LE: up to 7 Kbps

Data Throughput at 115200 bps UART baud rate

• BR/EDR: upto 10 Kbps

• LE: up to 6 Kbps



2016 Microchip Technology Inc.

Advance Information

DS60001380A-Page 1

BM78

Table of Contents

1.0 System Overview ............................................................................................................................................................................ 5

2.0 Application Information ................................................................................................................................................................. 11

3.0 Operating Pattern .......................................................................................................................................................................... 23

4.0 Electrical Characteristics ............................................................................................................................................................... 31

5.0 Radio Characteristics .................................................................................................................................................................... 35

6.0 Physical Dimensions ..................................................................................................................................................................... 37

7.0 Reflow profile ................................................................................................................................................................................ 43

8.0 Module Placement ........................................................................................................................................................................ 45

9.0 Ordering Information ..................................................................................................................................................................... 49

Appendix A: Certification Notices ........................................................................................................................................................ 51

TO OUR VALUED CUSTOMERS

It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip

products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and

enhanced as new volumes and updates are introduced.

If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via

E-mail at

docerrors@microchip.com

or fax the

Reader Response Form

in the back of this data sheet to (480) 792-4150. We

welcome your feedback.

Most Current Data Sheet

To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:

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You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.

The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).

Errata

An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current

devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision

of silicon and revision of document to which it applies.

To determine if an errata sheet exists for a particular device, please check with one of the following:

• Microchip’s Worldwide Web site;

http://www.microchip.com

• Your local Microchip sales office (see last page)

When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are

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to receive the most current information on all of our products.



2016 Microchip Technology Inc.

Advance Information

DS60001380A-Page 3

BM78SPPS5NC2-0002AA Related Products

	BM78SPPS5NC2-0002AA	BM78SPP05MC2-0002AA	BM78SPP05MC2-0004AA	BM78SPPS5MC2-0004AA
Description	Bluetooth / 802.15.1 Modules Bluetooth 4.2 Dual Mode (ROM) Data Module, Shielded, Antenna, 12x22mm	Bluetooth / 802.15.1 Modules BT 4.2 dual-mode no shield no ant	Bluetooth / 802.15.1 Modules BT 4.2DualModeModule Unshielded v1.35	Bluetooth / 802.15.1 Modules BT 4.2DualModeModule Shielded v1.35
Maker	Microchip	Microchip	Microchip	Microchip
package instruction	MODULE	MODULE	MODULE-30	MODULE-33
Reach Compliance Code	compliant	compliant	compliant	compliant
Factory Lead Time	13 weeks	13 weeks	12 weeks	13 weeks
JESD-30 code	X-XXMA-N	X-XXMA-N	R-XXMA-N30	R-XXMA-N33
Number of functions	1	1	1	1
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C
Minimum operating temperature	-20 °C	-20 °C	-20 °C	-20 °C
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
Package shape	UNSPECIFIED	UNSPECIFIED	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
surface mount	YES	YES	YES	YES
Telecom integrated circuit types	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT
Temperature level	OTHER	OTHER	OTHER	OTHER
Terminal form	NO LEAD	NO LEAD	NO LEAD	NO LEAD
Terminal location	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED

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