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BM77SPPS3MC2-0007AA

Description
Bluetooth / 802.15.1 Modules BT4.0 Dual Mode Shielded Module
CategoryWireless rf/communication    Telecom circuit   
File Size775KB,29 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
Environmental Compliance
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BM77SPPS3MC2-0007AA Overview

Bluetooth / 802.15.1 Modules BT4.0 Dual Mode Shielded Module

BM77SPPS3MC2-0007AA Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerMicrochip
package instruction,
Reach Compliance Codecompliant
Factory Lead Time20 weeks
JESD-30 codeR-XQMA-N33
length22 mm
Number of functions1
Number of terminals33
Maximum operating temperature70 °C
Minimum operating temperature-20 °C
Package body materialUNSPECIFIED
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Maximum seat height2.46 mm
surface mountYES
Telecom integrated circuit typesTELECOM CIRCUIT
Temperature levelOTHER
Terminal formNO LEAD
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width12 mm
 
 
 
30077 新竹科學工業園區工業東七路5號5樓
5F, No.5, Industry E. Rd. VII, Hsinchu Science Park, Hsinchu 30077, Taiwan, R.O.C.
TEL : 886-3-577-8385 FAX : 886-3-577-8945
www.issc-tech.com
 
 
Features: 
BM77SPPx3MC2 
Bluetooth® 4.0 Dual Mode Module
FIGURE 1: 
Complete, Fully Certified, Embedded 2.4 GHz 
Bluetooth® Version 4.0 Module
 
Bluetooth Classic (BR/EDR) and Low Energy (LE) 
Bluetooth SIG Certified 
Onboard embedded Bluetooth Stack 
Transparent UART mode for seamless serial data over 
UART interface 
Easy to configure with Windows GUI or direct by MCU 
Firmware can be field upgradable via UART 
Compact surface mount module: 22 x 12 x 2.4 mm 
Castellated surface mount pads for easy and reliable 
host PCB mounting 
Environmentally friendly, RoHS compliant 
Perfect for Portable Battery Operated Devices 
Internal Battery Regulator Circuitry 
Worldwide regulatory certifications 
Single operating voltage: 3.2V to 4.3V 
Temperature range: ‐40C to 85C Industrial 
Simple, UART interface 
Integrated crystal, internal voltage regulator, and 
matching circuitry 
Multiple I/O pins for control and status 
Frequency: 2.402 to 2.480 GHz 
Receive Sensitivity: ‐90 dBm (Classic); ‐92 dBm (LE) 
Power Output: 2 dBm (typ.) 
3 Mbps (Classic) 
8 Kbps (LE) 
Secure AES128 encryption 
GAP, SDP, SPP, GATT profiles 
Ceramic Chip Antenna (BM77SPPS3MC2) 
External Antenna Connection via RF Pad 
(BM77SPP03MC2) 
Bluetooth SIG QDID: B021961 
Modular Certified for the United States (FCC) and 
Canada (IC) 
European R&TTE Directive Assessed Radio Module 
Australia, New Zealand, Korea, Taiwan, Japan 
 
 
Operational: 
 
 
 
General Description: 
The BM77 is a fully‐certified Bluetooth® Version 4.0 
(BR/EDR/LE) module for designers who want to easily add 
dual mode Bluetooth® wireless capability to their products.  
Delivering local connectivity for the Internet of Things (IoT), 
the BM77 bridges your product to Smart Phones and Tablets 
for convenient data transfer, control and access to cloud 
applications.   
 
This Bluetooth SIG certified module  provides a complete 
wireless solution with Bluetooth stack onboard, integrated 
antenna, and worldwide radio certifications in a compact 
surface mount package, 22 x 12 x 2.4 mm.  It supports GAP, 
SDP, SPP, and GATT profiles.  Data is transferred over the 
Bluetooth link by sending/receiving data via transparent 
UART mode, making it easy to integrate with any processor 
or Microcontroller with a UART interface.  Configuration is 
made easy using a Windows® based GUI or directly via UART 
by a MCU. 
 
RF/Analog: 
Data Throughput: 
MAC/Baseband/Higher Layer: 
Antenna: 
Applications: 
Mobile Point of Sales (mPOS) 
LED lighting 
Wearables 
Digital Sports 
Fitness Devices 
Health Care/ Medical 
Automotive Accessories 
Home Automation 
Remote Control Toys 
Compliance: 
 
 
 
 
© 2014 ISSC Technologies Corp. 
Preliminary
 
Revision 2.0 – October 24, 2014   Page 1 
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