RoHS Compliant
Industrial Micro SD 3.0
Specifications
September 28
th
, 2011
Version 1.0
Apacer Technology Inc.
4
th
Fl., 75 Hsin Tai Wu Rd., Sec.1, Hsichih, New Taipei City, Taiwan 221
Tel: +886-2-2698-2888
www.apacer.com
Fax: +886-2-2689-2889
Industrial Micro SD 3.0
AP-MSDXXGCX4P-XTM
FEATURES:
Fully compatible with SD Card Association
specifications
Operating frequency: up to 100 MHz
Intelligent endurance design
-
-
-
-
-
Part 1, Physical Layer Specification, Version 3.1
Final
Part 3, Security Specification, Version 3.0 Final
Capacity range
4, 8, 16 GB
Performance*
Sustained Read: Up to 20 MB/sec
Sustained Write: Up to 14 MB/sec
SD-protocol compatible
Supports SD SPI mode
Backward compatible with 2.0
Upgradable to Micro SDHC via FAT32
NAND Flash Type: MLC
-
-
-
-
-
-
-
Built-in advanced ECC algorithm
Implements global wear-leveling algorithms
to substantially increase longevity of flash
media
Flash bad-block management
Built in write protect
Copyright protection mechanism: SDMI
standard compatible
Temperature ranges
Operating temperature: -25 ~ +85°C
Storage temperature: -40°C ~ +85°C
Operating voltage: 2.7V ~ 3.6V
Physical dimension :
15mm(L) x 11mm(W) x
1mm(H)
RoHS Compliant
*Vary from capacities. Performance values presented here are typical and may vary depending on settings and platforms.
1
© 2011 Apacer Technology, Inc.
Rev. 1.0
Industrial Micro SD 3.0
AP-MSDXXGCX4P-XTM
TABLE OF CONTENTS
1. General Description
..........................................................................................................3
1.1 P
RODUCT
F
UNCTION
B
LOCK
.................................................................................................................. 3
1.2 F
UNCTIONAL DESCRIPTION
..................................................................................................................... 3
1.2.1 Flash Management ....................................................................................................................... 4
1.2.2 Powerful ECC Algorithms ............................................................................................................. 4
1.2.3 Power Management...................................................................................................................... 4
2. Electrical characteristics
...............................................................................................5
2.1 C
ARD
A
RCHITECTURE
............................................................................................................................ 5
2.2 P
IN
A
SSIGNMENT
................................................................................................................................... 5
2.3 C
APACITY
S
PECIFICATION
...................................................................................................................... 6
2.4 P
ERFORMANCE
...................................................................................................................................... 6
2.5 A
BSOLUTE
M
AXIMUM
R
ATINGS
............................................................................................................... 6
2.6 P
OWER CONSUMPTION
........................................................................................................................... 6
3. Physical Characteristics
.................................................................................................7
3.1 P
HYSICAL
D
IMENSION
............................................................................................................................ 7
3.2 E
NVIRONMENTAL
S
PECIFICATIONS
.......................................................................................................... 9
4. AC Characteristics
..........................................................................................................11
4.1 M
ICRO
SD I
NTERFACE
T
IMING
(D
EFAULT
).............................................................................................
11
4.2 M
ICRO
SD I
NTERFACE
T
IMING
(H
IGH
S
PEED
M
ODE
)..............................................................................
12
4.3 SD I
NTERFACE
T
IMING
(SDR12, SDR25
AND
SDR50 M
ODES
)
I
NPUT
................................................... 13
4.3.1 SDR50 Input Timing.................................................................................................................... 13
4.3.2 Output ......................................................................................................................................... 14
4.3.3 SD Interface Timing (DDR50 Mode)........................................................................................... 14
4.3.4 Bus Timings – Parameters Values (DDR50 Mode) .................................................................... 15
5. Product Ordering Information
....................................................................................16
5.1 V
ALID
C
OMBINATIONS
.......................................................................................................................... 16
2
© 2011 Apacer Technology, Inc.
Rev. 1.0
Industrial Micro SD 3.0
AP-MSDXXGCX4P-XTM
1. General Description
As the demand of reliable and high-performance data storage in a small form factor increases, Apacer’s
Micro SD card 3.0 is designed specifically for multiple applications by offering high endurance, reliability,
and agility, where extreme traceability, enhanced data integrity, and exceptionally velocity are required.
The Micro SD 3.0 card fully complies with SD Card Association standard. The Command List is
compatible with [Part 1 Physical Layer Specification Ver3.1 Final] definitions, while the Card Capacity of
Non-secure Area, Secure Area supports [Part 3 Security Specification Ver3.0 Final] Specifications
Regarding its operation efficiency, it can operate at maximum frequency up to 100 MHz and is able to alternate
communication protocols between SD and SPI modes. For data read/write speed, the card can perform up to 19
MB/sec.
The card also comes with endurance features for data error detection and correction, ESD protection, built-in
permanent/temporary write protection, password protection, and SDMI standard compliant copyright protection
mechanism.
1.1 Product Function Block
The Micro SD contains a card controller and a memory core for the SD standard interface.
1.2 Functional description
The Micro SD device contains a high level, intelligent flash management that provides many capabilities
including:
Host independence from details of erasing and programming flash memories.
Powerful ECC algorithms
Global wear-leveling algorithms
Power management for low power operation
3
© 2011 Apacer Technology, Inc.
Rev. 1.0
Industrial Micro SD 3.0
AP-MSDXXGCX4P-XTM
1.2.1 Flash Management
The SD controller contains logic/physical flash block mapping and bad block management system. It will
manage all flash block including user data space and spare block.
The Micro SD also contains a sophisticated defect and error management system. It does a read after
write under margin conditions to verify that the data is written correctly (except in the case of write pre-
erased sectors). In case that a bit is found to be defective, the SD will replace this bad bit with a spare bit
within the sector header. If necessary, the Micro SD will even replace the entire sector with a spare sector.
This is completely transparent to the master (host device) and does not consume any user data space.
1.2.2 Powerful ECC Algorithms
The powerful ECC algorithms will enhance flash block use rate and whole device life. The SD controller
has an innovative algorithm to detect, correct and/or recover the data.
1.2.3 Power Management
A power saving feature of the Micro SD is automatic entrance and exit from sleep mode. Upon completion
of an operation, the SD will enter the sleep mode to conserve power if no further commands are received
within X seconds, where X is programmable by software. The master does not have to take any action for
this to occur. The SD is in sleep mode except when the host is accessing it, thus conserving power.
Any command issued by the master to the Micro SD will cause it to exit sleep mode and response to the
master.
4
© 2011 Apacer Technology, Inc.
Rev. 1.0
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