A
Datasheet
BT800
Bluetooth v4.0 Dual-Mode USB HCI Module
Version 2.3
BT800
Datasheet
R
EVISION
H
ISTORY
Version
1.0
1.1
1.2
Date
04 Sept 2013
23 Sept 2013
07 Oct 2013
Notes
Initial Release
Updated Regulatory/Certification section
Update BT SIG Approvals section
Edited text in
Low-voltage VDD_RADIO Linear
Regulator
section
Added a SPI note where applicable:
Note:
The purpose of the SPI interface is to access
the module’s inner settings such as selecting
different WLAN CO-EXIST scheme…
Updated the Bluetooth SIG Approvals section.
Updated Pin Definitions with “If Unconnected”
information.
Updated the Power Control and Regulation section.
Updated document links
Removed MIC certification references
Added Tape/Reel packaging information
Added MIC certification references
Replaced tray image with new one
Changed from HIG to Datasheet
Updates to
Power Control and Regulation
section
Updated Declaration of Conformity
Updated Declaration of Conformity for RED
Added clarifier that BT820 HID Proxy only pairs with
“Just Works” pairing and cannot pair to devices that
require a pincode or passkey
Approver
Jonathan Kaye
Jonathan Kaye
Jonathan Kaye
1.3
1.4
1.5
1.6
1.7
1.8
1.9
1.10
1.11
2.0
2.1
2.2
2.3
04 Feb 2014
05 Feb 2014
16 July 2014
03 Dec 2014
25 March 2015
28 April 2015
10 Aug 2015
08 Sept 2015
15 Dec 2015
06 July 2016
31 Aug 2016
05 May 2017
15 Aug 2017
Jonathan Kaye
Jonathan Kaye
Jonathan Kaye
Jonathan Kaye
Sue White
Sue White
Jonathan Kaye
Sue White
Maggie Teng
Andrew Chen
Sue White
Tom Smith
Jonathan Kaye
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/bluetooth
2
© Copyright 2016 Laird. All Rights Reserved
Americas: +1-800-492-2320
Europe: +44-1628-858-940
Hong Kong: +852 2923 0610
BT800
Datasheet
C
ONTENTS
1
2
3
4
5
6
7
8
Scope ..............................................................................................................................................................4
Operational Description .................................................................................................................................4
Block Diagram and Descriptions .....................................................................................................................5
Specifications ..................................................................................................................................................6
Pin Definitions ................................................................................................................................................7
DC Electrical Characteristics ...........................................................................................................................8
RF Characteristics ........................................................................................................................................ 10
Interface ...................................................................................................................................................... 11
8.1. PIO ........................................................................................................................................................... 11
8.2. WLAN Coexistence Interface ................................................................................................................... 11
8.3. USB Interface........................................................................................................................................... 11
8.4. PCM Interface.......................................................................................................................................... 12
8.5. GCI Interface............................................................................................................................................ 14
8.6. Slots and Sample Formats ....................................................................................................................... 14
8.7. PCM Timing Information .......................................................................................................................... 15
8.8. PCM Slave Timing .................................................................................................................................... 17
8.9. PCM Slave Mode Timing Parameters ...................................................................................................... 17
8.10. PCM_CLK and PCM_SYNC Generation .................................................................................................... 18
8.11. PCM Configuration .................................................................................................................................. 19
8.12. Digital Audio Interface (I²S) ..................................................................................................................... 19
Power Control and Regulation .................................................................................................................... 22
9.1. USB Linear Regulator............................................................................................................................... 22
9.2. High-voltage Linear Regulator................................................................................................................. 22
9.3. Voltage Regulator Enable and Reset ....................................................................................................... 23
9.4. Power Sequencing ................................................................................................................................... 23
Antenna Performance ................................................................................................................................. 24
Mechanical Dimensions and Land Pattern .................................................................................................. 26
Implementation Note .................................................................................................................................. 27
12.1. PCB Layout on Host PCB........................................................................................................................... 27
Application Note for Surface Mount Modules ............................................................................................ 29
13.1. Introduction ........................................................................................................................................... 29
13.2. Shipping ................................................................................................................................................. 29
13.3. Reflow Parameters ................................................................................................................................ 31
Japan (MIC) Regulatory ............................................................................................................................... 32
FCC and IC Regulatory ................................................................................................................................. 33
European Union Regulatory ........................................................................................................................ 35
Ordering Information .................................................................................................................................. 37
Bluetooth SIG Approvals.............................................................................................................................. 37
18.1. Application Note: Subsystem Combinations........................................................................................... 37
Additional Assistance................................................................................................................................... 38
9
10
11
12
13
14
15
16
17
18
19
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/bluetooth
3
© Copyright 2016 Laird. All Rights Reserved
Americas: +1-800-492-2320
Europe: +44-1628-858-940
Hong Kong: +852 2923 0610
BT800
Datasheet
1 S
COPE
This document describes key hardware aspects of the Laird BT800 Bluetooth HCI/HID module. This document is
intended to assist device manufacturers and related parties with the integration of this module into their host
devices. Data in this document are drawn from a number of sources including data sheets for the CSR8510.
Because the BT800 is currently in development stage, this document is preliminary and the information in this
document is subject to change. Please contact Laird Technologies or visit the Laird website at
www.Lairdtech.com
to obtain the most recent version of this document.
2 O
PERATIONAL
D
ESCRIPTION
The BT800 series of USB HCI devices are designed to meet the needs of OEMs adding robust
Bluetooth connectivity and using embedded Bluetooth stacks within these products.
Leveraging the market-leading CSR8510 chipset, the BT800 series provides exceptionally
low power consumption with outstanding range. Supporting the latest Bluetooth v4.0
BT800 module
Specification with EDR (Enhanced Data Rate), the Laird BT800 series enables OEMs to
accelerate their development time for leveraging either Classic Bluetooth or Bluetooth Low
Energy (BLE) into their operating system based devices.
With a tiny footprint as small as 8.5 x 13 mm, yet output power at 8 dBm, these modules
are ideal for applications where designers need high performance in minimal size. For
BT820 USB dongle
maximum flexibility in systems integration, the modules are designed to support a full
speed USB interface plus GPIO and additionally I2S and PCM audio interfaces.
These modules present an HCI interface and have native support for Windows and Linux Bluetooth software
stacks. All BT800 series devices are fully qualified as Bluetooth Controller Subsystem products. This also allows
designers to integrate their existing pre-approved Bluetooth Host and Profile subsystem stacks to gain a
Bluetooth END product approval for their products.
The BT800 series is engineered to provide excellent RF performance with integrated antenna and additional
band pass filters. It further reduces regulatory and testing requirements for OEMs and ensures a hassle free
development cycle. As an additional benefit of the BT800 series, Laird has implemented CSR’s HID (Human
Interface Device) Proxy Mode enabling out of the box HID connectivity for pointing devices and / or keyboard
functionality, requiring zero host device software or configuration.
Note:
On the BT820, HID Proxy mode works with “Just Works” devices and will not pair with BT devices
that require a pincode or passkey.
A fully featured, low-cost developer’s kit is available for prototyping, debug, and integration testing of the BT800
series modules and further reduces risk and time in development cycles.
Features and Benefits
Bluetooth v4.0 - Dual mode (Classic Bluetooth and BLE)
Compact footprint
2-wire and 3-wire Wi-Fi coexistence scheme
High antenna radiation gain and efficiency
Good interference rejection for multi-com system (GSM/WCDMA)
Class 1 output – 8 dBm
USB, GPIO, I2S, and PCM
Industrial Temperature Range
64 k EEPROM support for HID Proxy mode
Bluetooth Controller subsystem
FCC, IC, MIC, and CE approvals
4
© Copyright 2016 Laird. All Rights Reserved
Application Areas
Medical devices
ePOS terminals
Barcode scanners
Industrial Cable Replacement
M2M Connectivity
Automotive Diagnostic
Equipment
Personal Digital Assistants (PDA)
Bluetooth HID device (keyboard,
mouse, joystick)
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/bluetooth
Americas: +1-800-492-2320
Europe: +44-1628-858-940
Hong Kong: +852 2923 0610
BT800
Datasheet
3 B
LOCK
D
IAGRAM AND
D
ESCRIPTIONS
Figure 1: BT800 module block diagram
CS8510A10
(Main chip)
The BT800 is based on CSR8510A10 dual mode chip. The chip is a single-chip radio with on-
chip LDO regulators and baseband IC for Bluetooth 2.4 GHz systems including EDR to 3 Mbps.
Dedicated signal and baseband processing is included for full Bluetooth operation. The chip
provides SPI/PCM and USB interfaces. Up to four general purpose I/Os are available for
general use such as Wi-Fi coexistence or general indicators.
Note:
The purpose of the SPI interface is to access the module’s inner settings such as
selecting different WLAN CO-EXIST scheme and enabling HID proxy mode. The SPI
interface can also be used to put the module in RF test mode. You cannot use the
module over the SPI interface for normal operation as the main host interface.
Antenna
Band Pass
Filter
EEPROM
Crystal
BT800 – The antenna is a ceramic monopole chip antenna.
The band pass filter filters the out-of-band emissions from the transmitter to meet the
specific regulations for type approvals of various countries.
There are 64 k bits EEPROM embedded on the BT800 module which can be used to store
customizable parameters, such as maximum TX power, PCM configuration, USB product ID,
USB vendor ID, and USB product description. With that, the BT800 module can support
HID/HCI Proxy mode.
The embedded 26 MHz crystal is used for generating the clock for the entire module.
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/bluetooth
5
© Copyright 2016 Laird. All Rights Reserved
Americas: +1-800-492-2320
Europe: +44-1628-858-940
Hong Kong: +852 2923 0610
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