• 8 Mb Flash EEPROM with Intel® Platform Innovation
Framework for EFI Plug and Play, IDE drive
auto-configure
• Advanced configuration and power interface
V2.0b, DMI 2.0, multilingual support
• Serial Peripheral Interface (SPI) Flash
intel® rapid bioS boot
• Optimized POST for fast access to PC from power-on
SYSteM MeMorY
Memory capacity
• Single-channel DDR3 with two connectors for
1066 / 800 MHz memory support (4 GB max
1
)
Memory types
• DDR3 1066 / 800 SDRAM memory support
• Non-ECC Memory
Memory Voltage
• 1.8 V
Wake-up from Network
• Wired for Management (WfM) 2.0 compatible
• Support for system wake-up using an add-in network
interface card with remote wake-up capability
expansion capabilities
• One PCI connector
• One PCI Express* Mini Card connector
JuMperS ANd froNt-pANeL coNNectorS
Jumpers
• Jumper: yellow
• Header: black
front-panel connectors
• Reset, HD LED, Power LEDs, power on/off, aux LED
• USB 2.0 headers
• Audio header
MecHANicAL
board Style
• Mini-ITX / microATX-compatible
board Size
• 6.7” x 6.7” (170mm x 170mm)
baseboard power requirements
• ATX12V or SFX12V
eNViroNMeNt
operating temperature
• 0°C to +50°C
Storage temperature
• -20°C to +70°C
reGuLAtioNS ANd SAfetY StANdArdS
united States and canada
UL 60950-1
canada
CAN / CSA-C22.2 No. 60950-1
europe
(Low Voltage Directive 2006/95/EC)
EN 60950-1
international
IEC 60950-1
eMc regulations (Class B)
united States
FCC CFR Title 47, Chapter I, Part 15, Subparts A / B
canada
ICES-003
europe
(EMC Directive 2004/108/EC)
EN 55022 and EN 55024
Australia/New Zealand
EN 55022
Japan
VCCI V-3, V-4
South Korea
KN-22 and KN-24
taiwan
CNS 13438
international
CISPR 22
environmental compliance
europe
Europe RoHS (Directive 2002/95/EC)
china
China RoHS (MII Order # 39)
1
System resources and hardware (such as PCI and PCI Express*) require physical memory address locations that can reduce available addressable system memory. This could result in a reduction of as much
as 1 GB or more of physical addressable memory being available to the operating system and applications, depending on the system configuration and operating system.
Intel® High Definition Audio requires a system with an appropriate Intel® chipset and a motherboard with an appropriate codec and the necessary drivers installed. System sound quality will vary depending
on actual implementation, controller, codec, drivers, and speakers. For more information about Intel® HD Audio, refer to www.intel.com/design/chipsets/hdaudio.htm
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS
GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS
OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR
INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT.
Intel products are not intended for use in medical, life-saving, or life-sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice.
All products, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. Availability in different channels may vary.
Actual Intel® Desktop Board may differ from the image shown.
Intel, the Intel logo, Intel Atom, Intel Atom Inside, and Intel AppUp are trademarks of Intel Corporation in the U.S. and other countries.
2
* Other names and brands may be claimed as the property of others.
京公网安备 11010802033920号
EEWORLD
