SCALE™-2+ 2SC0435T2F1-17, 2SC0435T2F1C-17
2SC0435T2F1-17 and 2SC0435T2F1C-17
Preliminary Datasheet
Dual-Channel SCALE™-2+ IGBT and MOSFET Driver Core
Abstract
The SCALE™-2+ dual-driver core 2SC0435T2F1-17 (Connector pin length of 5.84mm; increased EMI
capability; lead free) / 2SC0435T2F1C-17 (Coated version using ELPEGUARD SL 1307 FLZ/2 from Lackwerke
Peters) combines unrivalled compactness with broad applicability. The driver is designed for universal
applications requiring high reliability. The 2SC0435T2F1(C)-17 drives all usual high-power IGBT modules up to
1700V. The embedded paralleling capability allows easy inverter design covering higher power ratings. Multi-
level topologies are also supported.
The 2SC0435T2F1(C)-17 is the most compact driver core in its power range with a footprint of only 57.2 x
51.6mm and an insertion height of max. 20mm. It allows even the most restricted insertion spaces to be
efficiently used. Compared with conventional drivers, the highly integrated SCALE-2+ chipset allows about
85% of components to be dispensed with. This advantage is impressively reflected in increased reliability.
The 2SC0435T2F1(C)-17 combines a complete two-channel driver core with all components required for
driving, such as an isolated DC/DC converter, short-circuit protection, Advanced Active Clamping as well as
supply voltage monitoring. Each of the two output channels is electrically isolated from the primary side and
the other secondary channel.
An output current of 35A and 4W drive power is available per channel, making the 2SC0435T2F1(C)-17 an
ideal driver platform for universal usage in medium and high-power applications. The driver provides a gate
voltage swing of +15V/-10V. The turn-on voltage is regulated to maintain a stable 15V regardless of the
output power level.
Its outstanding EMC allows safe and reliable operation in even hard industrial applications.
Product Highlights
Applications
Ultra-compact dual-channel driver
Highly integrated SCALE-2+ chipset
Gate current ±35A, 4W output power per channel
+15V/-10V gate driving
Blocking voltages up to 1700V
Safe isolation to EN 50178
Short delay and low jitter
Interface for 3.3V ... 15V logic level
Advanced Active Clamping
UL recognition E321757 for UL508C (NMMS2/8)
UL recognition E346491 for UL60950-1 (NWGQ2/8)
Lead free
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General purpose drives
Uninterruptible power supplies (UPS)
Solar and wind power converters
Auxiliary converters for traction
Electro/hybrid drive vehicles
Driving parallel-connected IGBTs
Medical (MRT, CT, X-Ray)
Laser technology
Page 1
SCALE™-2+ 2SC0435T2F1-17, 2SC0435T2F1C-17
Preliminary Data Sheet
Safety Notice!
The data contained in this data sheet is intended exclusively for technically trained staff. Handling all high-
voltage equipment involves risk to life. Strict compliance with the respective safety regulations is mandatory!
Any handling of electronic devices is subject to the general specifications for protecting electrostatic-sensitive
devices according to international standard IEC 60747-1, Chapter IX or European standard EN 100015 (i.e. the
workplace, tools, etc. must comply with these standards). Otherwise, this product may be damaged.
Important Product Documentation
This data sheet contains only product-specific data. For a detailed description, must-read application notes and
important information that apply to this product, please refer to “2SC0435T Description & Application Manual”
on
www.power.com/igbt-driver/go/2SC0435T.
Absolute Maximum Ratings
Parameter
Supply voltage V
DC
Supply voltage V
CC
Logic input and output voltages
SOx current
Gate peak current I
out
External gate resistance
Average supply current I
DC
Output power
Switching frequency f
Test voltage (50Hz/1min.)
|dV/dt|
Operating voltage
Operating temperature
Storage temperature
Surface temperature
Remarks
VDC to GND
VCC to GND
Primary side, to GND
Failure condition, total current
Note 1
Turn-on and turn-off
Notes 2, 3
Ambient temperature <70°C (Notes 4, 5)
Ambient temperature 85°C (Note 4)
Primary to secondary (Note 14)
Secondary to secondary (Note 14)
Rate of change of input to output voltage
Primary/secondary, secondary/secondary
Note 5
Note 18
Only for 2SC0435T2F1C-17 (Note 17)
-40
-40
Min
0
Max
16
Unit
V
0
16
V
-0.5 VCC+0.5 V
20
mA
-35
+35
A
0.5
Ω
1050
mA
6
W
4
W
100
kHz
5000 V
AC(eff)
4000 V
AC(eff)
50 kV/μs
1700 V
peak
85
50
125
°C
°C
°C
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Page 2
SCALE™-2+ 2SC0435T2F1-17, 2SC0435T2F1C-17
Preliminary Data Sheet
Recommended Operating Conditions
Power Supply
Supply voltage V
DC
Supply voltage V
CC
Remarks
VDC to GND, IGBT mode
VCC to GND
Min
14.5
14.5
Typ
15
15
Max
15.5
15.5
Unit
V
V
Electrical Characteristics (IGBT mode)
All data refer to +25°C and V
CC
= V
DC
= 15V unless otherwise specified.
Power supply
Supply current I
DC
Supply current I
CC
Supply current I
CC
Coupling capacitance C
io
Power Supply Monitoring
Supply threshold V
CC
Monitoring hysteresis
Supply threshold V
ISOx
-V
Ex
Monitoring hysteresis
Supply threshold V
Ex
-V
COMx
Monitoring hysteresis
Logic Inputs and Outputs
Input bias current
Turn-on threshold
Turn-off threshold
SOx output voltage
Short-Circuit Protection
Current through pin REFx
Minimum response time
Minimum blocking time
Remarks
Without load
f = 0Hz
f = 100kHz
Primary to output, total
Remarks
Primary side, clear fault
Primary side, set fault (Note 11)
Primary side, set/clear fault
Secondary side, clear fault
Secondary side, set fault (Note 12)
Secondary side, set/clear fault
Secondary side, clear fault
Secondary side, set fault (Note 12)
Secondary side, set/clear fault
Remarks
V(INx) > 3V
V(INx)
V(INx)
Failure condition, I(SOx) < 20mA
Remarks
R(REFx, VEx) < 70kΩ
Note 9
Note 10
Min
Min
11.9
11.3
0.35
12.1
11.5
0.35
5
4.7
0.15
Min
Min
Typ
32
22
32
22
Typ
12.6
12.0
12.6
12.0
5.15
4.85
Max
13.3
12.7
13.1
12.5
5.3
5
Max
Unit
mA
mA
mA
pF
Unit
V
V
V
V
V
V
V
V
V
Unit
µA
V
V
V
Unit
µA
µs
µs
Typ
190
2.6
1.3
Max
0.7
Typ
150
1.2
9
Max
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Page 3
SCALE™-2+ 2SC0435T2F1-17, 2SC0435T2F1C-17
Preliminary Data Sheet
Timing Characteristics
Turn-on delay t
d(on)
Turn-off delay t
d(off)
Jitter of turn-on delay
Jitter of turn-off delay
Output rise time t
r(out)
Output fall time t
f(out)
Transmission delay of fault state
Electrical Isolation
Test voltage (50Hz/1s)
Partial discharge extinction volt.
Creepage distance
Clearance distance
Remarks
Note 6
Note 6
Note 16
Note 16
Note 7
Note 7
Note 13
Remarks
Primary to secondary side (Note 14)
Secondary to secondary side (Note 14)
Primary to secondary side (Note 15)
Secondary to secondary side (Note 15)
Primary to secondary side
Secondary to secondary side
Primary to secondary side
Secondary to secondary side
Output
Blocking capacitance
Remarks
VISOx to VEx (Note 8)
VEx to COMx (Note 8)
Output voltage swing
The output voltage swing consists of two distinct segments. First, there is the turn-on voltage V
GHx
between
pins GHx and VEx. V
GHx
is regulated and maintained at a constant level for all output power values and
frequencies.
The second segment of the output voltage swing is the turn-off voltage V
GLx
. V
GLx
is measured between pins
GLx and VEx. It is a negative voltage. It changes with the output power to accommodate the inevitable
voltage drop across the internal DC/DC converter.
Output Voltage
Turn-on voltage, V
GHx
Turn-off voltage, V
GLx
Turn-off voltage, V
GLx
Turn-off voltage, V
GLx
Turn-off voltage, V
GLx
Remarks
Any load condition
No load
1W output power
4W output power
6W output power
Min
Typ
15.0
-10.1
-9.8
-9.5
-9.3
Max
Unit
V
V
V
V
V
Min
5000
4000
1768
1700
15.7
12
15.7
7.3
Min
Typ
9.4
9.4
Max
Min
Typ
75
70
±3
±3
20
20
400
Typ
5050
4050
Max
5100
4100
Max
Unit
ns
ns
ns
ns
ns
ns
ns
Unit
V
eff
V
eff
V
peak
V
peak
mm
mm
mm
mm
Unit
µF
µF
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Page 4
SCALE™-2+ 2SC0435T2F1-17, 2SC0435T2F1C-17
Preliminary Data Sheet
Footnotes to the Key Data
1)
2)
The maximum peak gate current refers to the highest current level occurring during the product
lifetime. It is an absolute value and does also apply for short pulses.
The average supply input current is limited for thermal reasons. Higher values than specified by the
absolute maximum rating are permissible (e.g. during power supply start up) if the average remains
below the given value, provided the average is taken over a time period which is shorter than the
thermal time constants of the driver in the application.
There is no means of actively controlling or limiting the input current in the driver. In the case of
start-up with very high blocking capacitor values, or in case of short circuit at the output, the supply
input current has to be limited externally.
The maximum output power must not be exceeded at any time during operation. The absolute
maximum rating must also be observed for time periods shorter than the thermal time constants of
the driver in the application.
An extended output power range is specified in the output power section for maximum ambient
temperatures of 70°C. In that case, the absolute maximum rating for the operating temperature
changes to (-40°C - 70°C) and the absolute maximum output power rating changes to 6W.
The delay time is measured between 50% of the input signal and 10% voltage swing of the
corresponding output. The delay time is independent of the output loading.
Output rise and fall times are measured between 10% and 90% of the nominal output swing with an
output load of 4.7Ω and 270nF. The values are given for the driver side of the gate resistors. The time
constant of the output load in conjunction with the present gate resistors leads to an additional delay
at the load side of the gate resistors.
External blocking capacitors are to be placed between VISOx and VEx as well as VEx and COMx for
gate charges exceeding 3µC. Ceramic capacitors are recommended. A minimum external blocking
capacitance of 3µF is recommended for every 1µC of gate charge beyond 3µC. Insufficient external
blocking can lead to reduced driver efficiency and thus to thermal overload.
The minimum response time given is valid for the circuit given in the description and application
manual (Fig. 7) with the values of table 1 (C
ax
= 0pF, R
thx
= 43kΩ).
The blocking time sets a minimum time span between the end of any fault state and the start of
normal operation (remove fault from pin SOx). The value of the blocking time can be adjusted at pin
TB. The specified blocking time is valid if TB is connected to GND.
Undervoltage monitoring of the primary-side supply voltage (VCC to GND). If the voltage drops below
this limit, a fault is transmitted to both SOx outputs and the power semiconductors are switched off.
Undervoltage monitoring of the secondary-side supply voltage (VISOx to VEx and VEx to COMx which
correspond with the approximate turn-on and turn-off gate-emitter voltages). If the corresponding
voltage drops below this limit, the IGBT is switched off and a fault is transmitted to the corresponding
SOx output.
Transmission delay of fault state from the secondary side to the corresponding primary status output.
HiPot testing (= dielectric testing) must generally be restricted to suitable components. This gate
driver is suited for HiPot testing. Nevertheless, it is strongly recommended to limit the testing time to
1s slots as stipulated by EN 50178. Excessive HiPot testing at voltages much higher than 1200V
AC(eff)
may lead to insulation degradation. No degradation has been observed over 1min. testing at
5000V
AC(eff)
. Every production sample shipped to customers has undergone 100% testing at the given
value for 1s.
Partial discharge measurement is performed in accordance with IEC 60270 and isolation coordination
specified in EN 50178. The partial discharge extinction voltage between primary and either secondary
side is coordinated for safe isolation to EN 50178.
Jitter measurements are performed with input signals INx switching between 0V and 5V referred to
GND, with a corresponding rise time and fall time of 15ns.
The component surface temperature, which may strongly vary depending on the operating condition,
must be limited to the given value for coated driver versions to ensure long-term reliability of the
coating material.
3)
4)
5)
6)
7)
8)
9)
10)
11)
12)
13)
14)
15)
16)
17)
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Page 5
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