Inductors for High-frequency Circuits
Multilayer/High-Q
MLG series
Type:
MLG0603P
0603[0201 inch]*
* Dimensions Code JIS[EIA]
Issue date:
August 2012
• All specifications are subject to change without notice.
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
(1/5)
Inductors for High-frequency Circuits
Multilayer/High-Q
MLG Series MLG0603P
FEATURES
• It serializes a product of inductance 0.6 to120nH.
• By the most suitable design, Q is higher than competing in a
conventional product MLG0603S type. In particular, Q in more
than 800MHz largely improved.
• Advanced monolithic structure is formed using a multilayering
and sintering process with ceramic and conductive materials for
high-frequency.
• The products contain no lead and also support lead-free
soldering.
• It is a product conforming to RoHS directive.
APPLICATIONS
For high-frequency applications including mobile phones, high
frequency modules (PA, VCO, FEM etc.), Bluetooth, W-LAN, UWB
and tuners.
SHAPES AND DIMENSIONS
0.6±0.03
Conformity to RoHS Directive
PRODUCT IDENTIFICATION
MLG 0603 P
(1)
(2) (3)
(1) Series name
(2) Dimensions L W
0603
0.60.3mm (LW)
2N2
(4)
S
T
(5) (6)
(7)
(3 Type name
(4) Inductance
2N2
12N
2.2nH
12nH
(5) Tolerance
B
C
S
H
J
±0.1nH
±0.2nH
±0.3nH
±3%
±5%
0.3±0.03
0.09±0.04
(6) Packaging style
T
Taping (reel)
0.3±0.03
(7) TDK internal code
Weight: 0.2mg
0.15±0.05
Dimensions in mm
SPECIFICATIONS
Operating temperature range
Storage temperature range
–55 to +125°C
–55 to +125°C(After mount)
RECOMMENDED PC BOARD PATTERN
0.25
0.3
0.25
PACKAGING STYLE AND QUANTITIES
0.3
Packaging style
Taping
Dimensions in mm
Quantity
15000 pieces/reel
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
10s max.
250 to 260˚C
230˚C
Natural
cooling
180˚C
150˚C
Preheating
60 to 120s
Time(s)
Soldering
30 to 60s
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components.
The preheating temperature should be set so that the
temperature difference between the solder temperature and
product temperature does not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• When hand soldering, apply the soldering iron to the printed
circuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• Please contact our Sales office when your application is considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• All specifications are subject to change without notice.
001-08 / 20120822 / e521_mlg_03
(3/5)
ELECTRICAL CHARACTERISTICS
Inductance
(nH)
30
33
36
39
43
47
51
56
62
68
75
82
91
100
110
120
Inductance
tolerance
±3%, ±5%
±3%, ±5%
±3%, ±5%
±3%, ±5%
±3%, ±5%
±3%, ±5%
±3%, ±5%
±3%, ±5%
±3%, ±5%
±3%, ±5%
±3%, ±5%
±3%, ±5%
±3%, ±5%
±3%, ±5%
±3%, ±5%
±3%, ±5%
Q
min.
10
10
10
10
10
10
10
10
10
9
9
9
9
9
9
9
Test frequency
L, Q (MHz)
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
Self-resonant
frequency
(GHz)
min.
typ.
1.8
2.3
1.8
2.4
1.8
2.2
1.8
2.2
1.6
2.0
1.6
2.0
1.4
1.9
1.4
1.8
1.2
1.6
1.2
1.6
1.0
1.5
1.0
1.5
0.9
1.3
0.9
1.3
0.8
1.1
0.8
1.0
DC resistance
( )
max.
2.20
2.20
2.40
2.40
2.90
2.90
3.50
3.50
3.50
3.50
4.00
4.00
4.50
4.50
5.00
5.00
typ.
1.37
1.55
1.49
1.72
1.61
2.18
1.87
2.35
2.12
2.69
2.59
2.71
2.92
3.20
3.50
3.79
Rated current
(mA)max.
130
130
120
120
110
110
100
100
100
100
80
80
80
80
80
80
Part No.
MLG0603P30N
T
MLG0603P33N
T
MLG0603P36N
T
MLG0603P39N
T
MLG0603P43N
T
MLG0603P47N
T
MLG0603P51N
T
MLG0603P56N
T
MLG0603P62N
T
MLG0603P68N
T
MLG0603P75N
T
MLG0603P82N
T
MLG0603P91N
T
MLG0603PR10
T
MLG0603PR11
T
MLG0603PR12
T
: Please specify inductance tolerance, B (±0.1nH), C (±0.2nH), S (±0.3nH), H (±3%) or J (±5%).
Please contact us for information on inductance tolerance, G(±2%).
• Test equipment
Inductance Q : HP4291A+16197A, or equivalent
SRF: HP8720C, or equivalent
Rdc: YOKOGAWA TYPE7561, or equivalent
• Short bar residual inductance =0.43nH
• All specifications are subject to change without notice.
001-08 / 20120822 / e521_mlg_03
DSP and ARM Processors
京公网安备 11010802033920号
EEWORLD
