HSSC423.xxx - 0201 High Stability Silicon
Capacitor
Rev 3.2
Key features
n
Ultra high stability :
w
Temperature <±0.5% (-55 °C to +150 °C)
w
Voltage <0.1 %/V
w
Negligible aging <0.001% /1000hours
n
Unique high capacitance in EIA/0201 package
size, up to 10 nF
n
High reliability (FIT <0.017 parts / billion hours)
n
Low leakage current down to 100 pA
n
Low ESL and Low ESR
n
Suitable with lead free reflow-soldering
*Please
refer to our assembly Application Note for further recommendations
Key applications
n
n
n
n
n
n
All demanding applications, such as
medical, aerospace, automotive industry
High stability applications
Decoupling / Filtering / Charge pump
(i.e.: Pacemakers / defibrillators)
Devices with battery operations
Replacement of X7R and NP0
Downsizing
Thanks to the unique IPDiA Silicon capacitor
technology, most of the problems encountered in
demanding application can be solved.
High Stability Silicon Capacitors
are dedicated to
applications
where
Reliability
is
the
main
The
IPDiA
technology
features
a
capacitor
²
integration capability (up to 250nF/mm ) which
allows a
smaller case size
than existing solutions
to
answer
high
volume
constraints.
This
technology also offers
high reliability,
up to 10
times
better
than
alternative
capacitor
parameter thanks to our end of production Burn-
in.
HSSC avoid the need to oversize the capacitor
value for sensitive capacitive circuitry and offers a
higher DC voltage stability.
This
technology
provides
industry
leading
technologies, such as Tantalum or MLCC, and
eliminates cracking phenomena.
This Silicon based technology is RoHS compliant
and compatible with lead free reflow soldering
process.
performances relative to the
capacitor stability
over the full
operating voltage & temperature
range.
The very high and stable insulation resistance of
silicon capacitors can enhance up to 30 % the
battery lifetime
in mobile applications.
HSSC423.xxx
Electrical specification
Capacitance value
10
Contact
1 pF
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10 pF
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0.1 nF
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10nF:
935.131.423.510
1 nF
935.131.723.510
15
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22
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33
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47
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68
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(*) Thinner thickness (as low as 100 µm thick) available, see Low Profile Silicon Capacitor product: LPSC
(**) Extended temperature range (up to +250 °C) available, see Xtreme Temperature Silicon Capacitor product: XTSC
(***) Other values on request.
Parameters
Capacitance range
Capacitance tolerances
Operating temperature range
Storage temperatures
Temperature coefficient
Breakdown voltage (BV)
Capacitance variation versus
RVDC
Equivalent Serial Inductor (ESL)
Equivalent Serial Resistor (ESR)
Insulation resistance
Ageing
Reliability
Capacitor height
Value
10 nF
(***)
±15
%
(***)
-55 °C to 150 °C
(**)
- 70 °C to 165 °C
<±0.5 %, from -55 °C to +150 °C
11, 30 V
(***)
0.1 % /V (from 0 V to RVDC)
Max 100 pH
(***)
Max 400mW
100G
W
min @ 3V,from
-55°C to +150°C
Negligible, < 0.001 % / 1000 h
FIT<0.017 parts / billion hours,
(*)
Max 400 µm
Unit
Temperature coefficient
PICS vs. MLCC capacitors
Capacitance change (%)
Capacitance change (%)
DC Voltage stability
MLCC capacitors vs. PICS
10
PICS
0
1,1
1
0,9
ESL (nH) @25°C
0402 C0G(NPO) vs. PICS
20
10
0
-10
-20
-30
-40
Y5V
PICS
C0G
X7R
PICS
-10
Capacitance change (%)
C0G
Capacitance change (%)
C0G
X8R
C0G
0,8
0,7
X8R
-20
X7R
-40
-50
-60
-70
-80
Y5V
X7R
Z5U
ESL(nH)
-30
0,6
0,5
0,4
0,3
0,2
-50
-60
-70
Z5U
Z5U
Temperature (°C)
Y5V
PICS
0,1
0
Y5V
-80
-50
0
50
Temperature (°C)
Temperature (°C)
100
150
200
-90
-100
0
1
2
3
Bias voltage (V)
4
5
6
7
0
50
100
150
200
250
300
350
400
450
500
550
600
650
700
750
800
850
900
950 1000
Capacitance (pF)
Fig.1 Capacitance change versus temperature
variation compared with alternative dielectrics
Fig.2 Capacitance change versus voltage
variation compared with alternative dielectrics
Fig.3 ESL versus capacitance value
compared with alternative dielectrics
Part Number
935.131.
B.2
Breakdown
Voltage
4 = 11V
7 = 30V
S.
Size
3 = 0201
U
Unit
0 = 10 f
1 = 0.1 p
2=1p
3 = 10 p
4 = 0.1 n
xx
i.e.: 10 nF/0201 case (HSSC type)
à
935.131.423.510
5=1n
6 = 10 n
7 = 0.1 µ
8=1µ
9 = 10 µ
Value (E6)
10
15
22
33
47
68
Termination and Outline
Termination
Lead-free nickel/solder coating compatible
with automatic soldering technologies:
reflow and manual.
Typical dimensions, all dimensions in mm.
Package outline
L
Typ.
Comp.
size
L
W
0201
W
0.76±0.03
0.56±0.03
Land
pattern
IPD
component
Solder
Resist
(0201 PCB footprint)
Packaging
Tape and reel, tray, waffle pack or wafer delivery.
Reproduction in whole or in part is prohibited without the
prior written consent of the copyright owner. The information
presented in this document does not form part of any
quotation or contract, is believed to be accurate and reliable
and may be changed without notice. No liability will be
accepted by the publisher for any consequence of its use.
Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
For more information, please visit:
http://www.ipdia.com
To contact us, email to:
sales@ipdia.com
Date of release: 28
th
February 2014
Document identifier: CL431 111 615 138
IPD Capacitor Assembly Set Up
Rev 1.0
Application Note
Outline
Silicon Capacitor for surface mounting device (SMD) assembly is a Wafer Level Chip Scale Packaging
with the following features:
Package dedicated to solve tombstoning effect of small SMD package;
Package compatible with SMD assembly;
Package without underfilling step;
Interconnect available with various optional finishing for specific assembly.
Assembly consideration
Standard pick & place equipment dedicated to WLCSP down to 400µm pitch.
Solder paste type 3 in most cases of EIA size.
Reflow has to be done with standard lead-free profile (for SAC alloys) or
according to JEDEC recommendations J-STD 020D-01.
Lead
Leadfree
Tp: 235 °C
T
L: 183 °C
Ts min: 100 °C
Ts max: 150 °C
t
L
: 60-150 s
Tp: 260 °C
T
L:
217 °C
Ts min: 150 °C
Ts max: 200 °C
t
L
: 60-150 s
Process recommendation
After soldering, no solder paste should touch the side of the capacitor die as that might results in
leakage currents due to remaining flux.
In order to use IPDiA standard capacitors within the JEDEC format and recommendation, the solder
flux must be cleaned after reflow soldering step.
Notes: for a proper flux cleaning process, “rosin” flux type (R) or “water soluble” flux type (WS) is
recommended for the solder printing material. “No clean” flux (NC) solder paste is not recommended.
In case the flux is not cleaned after the reflow soldering, the standard JEDEC would probably not be
appropriate and the solder volume must be controlled:
- using smallest aperture design for the stencil, and using finer solder paste type 4 or 5 for a
proper printing process.
- Mirroring pads would be the best recommendation
Application Note
Pad recommendation
The capacitor is compatible with generic requirements for flip chip design (IPC7094).
Standard IPDiA 3D package can be compliant with established EIA size (0201, 0402, 0603, …).
Die size and land pattern dimensions is set up according to following range :
EIA size
Dimension max(X1 x X2) mm
Typical . die thickness X3 (mm)
Typical pad size* (mm)
Typical pad separation (X4
mm)
0201
0.86x0.66
0402
1.26x0.76
0603
1.86x1.16
0805
2.26x1.46
1206
3.46x1.86
1812
4.76x3.66
0.1 or 0.4
0.15x0.40
0.3
0.30x0.50
0.4
0.40x0.90
0.8
0.50x1.20
1
0.60x1.60
2
0.90x3.40
2.7
X3
X2
X1
Top side
silicon
Typ.UBM thickness
3 to 5 µm
X4
After soldering, no solder paste should touch the side of the capacitor die as that might result in
leakage currents due to remaining flux.
Rev 1.0
2 of 3
Application Note
Manual Handling Considerations
These capacitors are designed to be mounted with a standard SMT line, using solder printing step,
pick and place machine and a final reflow soldering step. In case of manual handling and mounting
conditions, please follow below recommendations:
Minimize mechanical pressure on the capacitors (use of a vacuum nozzle is
recommended).
Use of organic tip instead of metal tip for the nozzle.
Minimize temperature shocks (Substrate pre-heating is recommended).
No wire bonding on 0402 47nF, 0402 100nF, 1206 1 F and 1812 3,3µF
Process steps:
On substrate, form the solder meniscus on each land pattern targeting 100 µm
height after reflow (screen printing, dispensing solder paste or by wire soldering).
Pick the capacitor from the tape & reel or the Gel Pack keeping backside visible
using a vacuum nozzle and organic tip.
Temporary place the capacitor on land pattern assuming the solder paste (Flux)
will stick and maintain the capacitor.
Reflow the assembly module with a dedicated thermal profile (see reflow
recommendation profile).
Reproduction in whole or in part is prohibited without the
prior written consent of the copyright owner. The information
presented in this document does not form part of any
quotation or contract, is believed to be accurate and reliable
and may be changed without notice. No liability will be
accepted by the publisher for any consequence of its use.
Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
For more information, please visit:
http://www.ipdia.com
To contact us, email to:
sales@ipdia.com
Date of release: 20
th
April 2012
Document identifier:
京公网安备 11010802033920号
EEWORLD
