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BUH50G

Description
Bipolar Transistors - BJT 4A 500V 50W NPN
CategoryDiscrete semiconductor    The transistor   
File Size245KB,8 Pages
ManufacturerON Semiconductor
Websitehttp://www.onsemi.cn
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BUH50G Overview

Bipolar Transistors - BJT 4A 500V 50W NPN

BUH50G Parametric

Parameter NameAttribute value
Brand NameON Semiconductor
Is it lead-free?Lead free
MakerON Semiconductor
Parts packaging codeTO-220AB
package instructionROHS COMPLIANT, CASE 221A-09, 3 PIN
Contacts3
Manufacturer packaging code221A-09
Reach Compliance Codenot_compliant
ECCN codeEAR99
Factory Lead Time1 week
Other featuresLEADFORM OPTIONS ARE AVAILABLE
Shell connectionCOLLECTOR
Maximum collector current (IC)4 A
Collector-emitter maximum voltage500 V
ConfigurationSINGLE
Minimum DC current gain (hFE)5
JEDEC-95 codeTO-220AB
JESD-30 codeR-PSFM-T3
JESD-609 codee3
Number of components1
Number of terminals3
Maximum operating temperature150 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formFLANGE MOUNT
Peak Reflow Temperature (Celsius)260
Polarity/channel typeNPN
Maximum power dissipation(Abs)50 W
Certification statusNot Qualified
surface mountNO
Terminal surfaceTin (Sn)
Terminal formTHROUGH-HOLE
Terminal locationSINGLE
Maximum time at peak reflow temperature40
transistor applicationsSWITCHING
Transistor component materialsSILICON
Nominal transition frequency (fT)4 MHz
BUH50G
Switch‐mode NPN Silicon
Planar Power Transistor
The BUH50G has an application specific state−of−art die designed
for use in 50 W HALOGEN electronic transformers and switch-mode
applications.
Features
www.onsemi.com
Improved Efficiency Due to Low Base Drive Requirements:
High and Flat DC Current Gain h
FE
Fast Switching
ON Semiconductor Six Sigma Philosophy Provides Tight and
Reproductible Parametric Distributions
Specified Dynamic Saturation Data
Full Characterization at 125°C
These Devices are Pb−Free and are RoHS Compliant*
POWER TRANSISTOR
4 AMPERES
800 VOLTS, 50 WATTS
COLLECTOR
2,4
1
BASE
3
EMITTER
MAXIMUM RATINGS
Rating
Collector−Emitter Sustaining Voltage
Collector−Base Breakdown Voltage
Collector−Emitter Breakdown Voltage
Emitter−Base Voltage
Collector Current
Collector Current
Base Current
Base Current
− Continuous
− Peak (Note 1)
− Continuous
− Peak (Note 1)
Symbol
V
CEO
V
CBO
V
CES
V
EBO
I
C
I
CM
I
B
I
BM
P
D
T
J
, T
stg
Value
500
800
800
9
4
8
2
4
50
0.4
−65 to 150
Unit
Vdc
Vdc
Vdc
Vdc
Adc
Adc
Adc
Adc
W
W/_C
_C
1
2
3
4
TO−220
CASE 221A
STYLE 1
Total Device Dissipation @ T
C
= 25_C
Derate above 25°C
Operating and Storage Temperature
MARKING DIAGRAM
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Pulse Test: Pulse Width = 5 ms, Duty Cycle
10%.
BUH50G
AY WW
THERMAL CHARACTERISTICS
Characteristics
Thermal Resistance, Junction−to−Case
Thermal Resistance, Junction−to−Ambient
Maximum Lead Temperature for Soldering
Purposes 1/8″ from Case for 5 Seconds
Symbol
R
qJC
R
qJA
T
L
Max
2.5
62.5
260
Unit
_C/W
_C/W
_C
BUH50
A
Y
WW
G
1
= Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
ORDERING INFORMATION
Device
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
BUH50G
Package
TO−220
(Pb−Free)
Shipping
50 Units / Rail
©
Semiconductor Components Industries, LLC, 2014
1
November, 2014 − Rev. 8
Publication Order Number:
BUH50/D

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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