MKL15Z64VFM4R datasheet, PDF - EEWORLD Datasheet

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MKL15Z64VFM4R: DescriptionRISC MICROCONTROLLER; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，57 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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MKL15Z64VFM4R Overview

RISC MICROCONTROLLER

MKL15Z64VFM4R Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Objectid	4000164535
package instruction	QFN-32
Reach Compliance Code	compliant
Country Of Origin	Mainland China
ECCN code	3A991.A.2
Factory Lead Time	16 weeks
Samacsys Manufacturer	NXP
Samacsys Modified On	2023-08-16 21:06:45
YTEOL	11.3
Has ADC	YES
Address bus width
bit size	32
boundary scan	NO
maximum clock frequency	48 MHz
DAC channel	YES
DMA channel	YES
External data bus width
JESD-30 code	S-XQCC-N32
length	5 mm
Humidity sensitivity level	3
Number of I/O lines	27
Number of terminals	32
On-chip program ROM width	8
Maximum operating temperature	105 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	UNSPECIFIED
encapsulated code	HVQCCN
Package shape	SQUARE
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	260
rom(word)	32768
ROM programmability	FLASH
speed	48 MHz
Maximum supply voltage	3.6 V
Minimum supply voltage	1.71 V
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	NO LEAD
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	40
width	5 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC

User Manual

【User Guide】Set of general Math and motor control functions for Arm? Cortex?-M0+ Core

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Freescale Semiconductor, Inc.

Data Sheet: Technical Data

Document Number: KL15P80M48SF0

Rev 5 08/2014

Kinetis KL15 Sub-Family

48 MHz Cortex-M0+ Based Microcontroller

Designed with efficiency in mind. Compatible with all other

Kinetis L families as well as Kinetis K1x family. General purpose

MCU featuring market leading ultra low-power to provide

developers an appropriate entry-level 32-bit solution.

This product offers:

• Run power consumption down to 47 μA/MHz in very low

power run mode

• Static power consumption down to 2 μA with full state

retention and 4 μs wakeup

• Ultra-efficient Cortex-M0+ processor running up to 48MHz

with industry leading throughput

• Memory option is up to 128 KB flash and 16 KB RAM

• Energy-saving architecture is optimized for low power with

90 nm TFS technology, clock and power gating techniques,

and zero wait state flash memory controller

MKL15ZxxVFM4

MKL15ZxxVFT4

MKL15ZxxVLH4

MKL15ZxxVLK4

32-pin QFN (FM)

48-pin QFN (FT)

5 x 5 x 1 Pitch 0.5 mm 7 x 7 x 1 Pitch 0.5 mm

64-pin LQFP (LH)

80-pin LQFP (LK)

10 x 10 x 1.4 Pitch 0.5 12 x 12 x 1.4 Pitch 0.5

Performance

• 48 MHz ARM

Cortex

-M0+ core

Memories and memory interfaces

• Up to 128 KB program flash memory

• Up to 16 KB SRAM

Human-machine interface

• Low-power hardware touch sensor interface (TSI)

• Up to 70 general-purpose input/output (GPIO)

Communication interfaces

• Two 8-bit SPI modules

• One low power UART module

• Two UART modules

• Two I2C module

System peripherals

• Nine low-power modes to provide power optimization

based on application requirements

Analog Modules

• COP Software watchdog

• 4-channel DMA controller, supporting up to 63 request

• 16-bit SAR ADC

sources

• 12-bit DAC

• Low-leakage wakeup unit

• Analog comparator (CMP) containing a 6-bit DAC

• SWD debug interface and Micro Trace Buffer

and programmable reference input

• Bit Manipulation Engine

Clocks

• 32 kHz to 40 kHz or 3 MHz to 32 MHz crystal oscillator

• Multi-purpose clock source

• 1 kHz LPO clock

Operating Characteristics

• Voltage range: 1.71 to 3.6 V

• Flash write voltage range: 1.71 to 3.6 V

• Temperature range (ambient): -40 to 105°C

Timers

• Six channel Timer/PWM (TPM)

• Two 2-channel Timer/PWM modules

• Periodic interrupt timers

• 16-bit low-power timer (LPTMR)

• Real time clock

Security and integrity modules

• 80-bit unique identification number per chip

Freescale reserves the right to change the detail specifications as may be required to

Table of Contents

1 Ratings.................................................................................... 5

1.1 Thermal handling ratings................................................. 5

1.2 Moisture handling ratings................................................ 5

1.3 ESD handling ratings....................................................... 5

1.4 Voltage and current operating ratings............................. 5

2 General................................................................................... 6

2.1 AC electrical characteristics.............................................6

2.2 Nonswitching electrical specifications..............................6

2.2.1 Voltage and current operating requirements....... 7

2.2.2 LVD and POR operating requirements................7

2.2.3 Voltage and current operating behaviors.............8

2.2.4 Power mode transition operating behaviors........ 9

2.2.5 Power consumption operating behaviors............ 10

2.2.6 EMC radiated emissions operating behaviors..... 15

2.2.7 Designing with radiated emissions in mind..........16

2.2.8 Capacitance attributes.........................................16

2.3 Switching specifications...................................................16

2.3.1 Device clock specifications..................................16

2.3.2 General switching specifications......................... 17

2.4 Thermal specifications..................................................... 17

2.4.1 Thermal operating requirements......................... 17

2.4.2 Thermal attributes................................................18

3 Peripheral operating requirements and behaviors.................. 18

3.1 Core modules.................................................................. 18

3.1.1 SWD electricals .................................................. 18

3.2 System modules.............................................................. 20

3.3 Clock modules................................................................. 20

3.3.1 MCG specifications..............................................20

3.3.2 Oscillator electrical specifications........................22

3.4 Memories and memory interfaces................................... 24

3.4.1 Flash electrical specifications.............................. 24

3.5 Security and integrity modules........................................ 26

3.6 Analog............................................................................. 26

3.6.1

ADC electrical specifications............................... 26

3.6.2 CMP and 6-bit DAC electrical specifications....... 31

3.6.3 12-bit DAC electrical characteristics....................32

3.7 Timers..............................................................................35

3.8 Communication interfaces............................................... 35

3.8.1 SPI switching specifications................................ 35

3.8.2 Inter-Integrated Circuit Interface (I2C) timing...... 40

3.8.3 UART...................................................................41

3.9 Human-machine interfaces (HMI)....................................41

3.9.1 TSI electrical specifications................................. 41

Dimensions............................................................................. 42

4.1 Obtaining package dimensions....................................... 42

Pinout...................................................................................... 42

5.1 KL15 Signal Multiplexing and Pin Assignments...............42

5.2 KL15 pinouts....................................................................45

Ordering parts......................................................................... 49

6.1 Determining valid orderable parts....................................49

Part identification.....................................................................49

7.1 Description.......................................................................50

7.2 Format............................................................................. 50

7.3 Fields............................................................................... 50

7.4 Example...........................................................................50

Terminology and guidelines.................................................... 51

8.1 Definition: Operating requirement....................................51

8.2 Definition: Operating behavior......................................... 51

8.3 Definition: Attribute.......................................................... 52

8.4 Definition: Rating............................................................. 52

8.5 Result of exceeding a rating............................................ 52

8.6 Relationship between ratings and operating

requirements....................................................................53

8.7 Guidelines for ratings and operating requirements..........53

8.8 Definition: Typical value...................................................54

8.9 Typical value conditions.................................................. 55

9 Revision history.......................................................................55

Freescale Semiconductor, Inc.

Kinetis KL15 Sub-Family, Rev5 08/2014.

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Description	RISC MICROCONTROLLER	ARM Microcontrollers - MCU 32 BIT,ARM M0+ CORE 128K	ARM Microcontrollers - MCU Kinetis L ARM M0+ 128k Flash	ARM Microcontrollers - MCU 32BIT ARM M0+CORE64K	ARM Microcontrollers - MCU 32 bit ,64k Flash	RISC MICROCONTROLLER	ARM Microcontrollers - MCU MKL15Z32VFM4/HVQFN32///REEL 13 Q2/T3 *STANDARD MA	ARM Microcontrollers - MCU Kinetis L ARM M0+ 128k Flash	RISC MICROCONTROLLER
Is it Rohs certified?	conform to	-	conform to	-	-	conform to	-	conform to	conform to
package instruction	QFN-32	-	QFN-48	-	-	LQFP-64	-	QFN-32	QFN-32
Reach Compliance Code	compliant	-	compliant	-	-	compliant	-	compliant	compliant
ECCN code	3A991.A.2	-	3A991.A.2	-	-	3A991.A.2	-	3A991.A.2	3A991.A.2
Has ADC	YES	-	YES	-	-	YES	-	YES	YES
bit size	32	-	32	-	-	32	-	32	32
maximum clock frequency	48 MHz	-	32 MHz	-	-	32 MHz	-	32 MHz	32 MHz
DAC channel	YES	-	YES	-	-	YES	-	YES	YES
DMA channel	YES	-	YES	-	-	YES	-	YES	YES
JESD-30 code	S-XQCC-N32	-	S-XQCC-N48	-	-	S-PQFP-G64	-	S-XQCC-N32	S-XQCC-N32
Humidity sensitivity level	3	-	3	-	-	3	-	3	3
Number of I/O lines	27	-	40	-	-	54	-	28	28
Number of terminals	32	-	48	-	-	64	-	32	32
On-chip program ROM width	8	-	8	-	-	8	-	8	8
Maximum operating temperature	105 °C	-	105 °C	-	-	105 °C	-	105 °C	105 °C
Minimum operating temperature	-40 °C	-	-40 °C	-	-	-40 °C	-	-40 °C	-40 °C
PWM channel	YES	-	YES	-	-	YES	-	YES	YES
Package body material	UNSPECIFIED	-	UNSPECIFIED	-	-	PLASTIC/EPOXY	-	UNSPECIFIED	UNSPECIFIED
encapsulated code	HVQCCN	-	HVQCCN	-	-	LFQFP	-	QCCN	HVQCCN
Package shape	SQUARE	-	SQUARE	-	-	SQUARE	-	SQUARE	SQUARE
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	-	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	-	-	FLATPACK, LOW PROFILE, FINE PITCH	-	CHIP CARRIER	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	260	-	260	-	-	260	-	260	260
rom(word)	32768	-	131072	-	-	65536	-	131072	65536
ROM programmability	FLASH	-	FLASH	-	-	FLASH	-	FLASH	FLASH
speed	48 MHz	-	48 MHz	-	-	48 MHz	-	48 MHz	48 MHz
Maximum supply voltage	3.6 V	-	3.6 V	-	-	3.6 V	-	3.6 V	3.6 V
Minimum supply voltage	1.71 V	-	1.71 V	-	-	3.3 V	-	1.71 V	3.3 V
Nominal supply voltage	3.3 V	-	3.3 V	-	-	3.3 V	-	3.3 V	3.3 V
surface mount	YES	-	YES	-	-	YES	-	YES	YES
technology	CMOS	-	CMOS	-	-	CMOS	-	CMOS	CMOS
Temperature level	INDUSTRIAL	-	INDUSTRIAL	-	-	INDUSTRIAL	-	INDUSTRIAL	INDUSTRIAL
Terminal form	NO LEAD	-	NO LEAD	-	-	GULL WING	-	NO LEAD	NO LEAD
Terminal pitch	0.5 mm	-	0.5 mm	-	-	0.5 mm	-	0.5 mm	0.5 mm
Terminal location	QUAD	-	QUAD	-	-	QUAD	-	QUAD	QUAD
Maximum time at peak reflow temperature	40	-	40	-	-	40	-	40	40
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC	-	MICROCONTROLLER, RISC	-	-	MICROCONTROLLER, RISC	-	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC

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