B300W35A102E1G datasheet, PDF - EEWORLD Datasheet

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B300W35A102E1G: DescriptionAudio DSPs BELASIGNA 300; Categorysemiconductor Analog mixed-signal IC; File Size270KB，27 Pages; ManufacturerON Semiconductor; Websitehttp://www.onsemi.cn; Environmental Compliance

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B300W35A102E1G Overview

Audio DSPs BELASIGNA 300

B300W35A102E1G Parametric

Parameter Name	Attribute value
Product Attribute	Attribute Value
Manufacturer	ON Semiconductor
Product Category	Audio DSPs
RoHS	Details
Packaging	Reel
Factory Pack Quantity	2500

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BelaSigna 300

Audio Processor for Portable

Communication Devices

Introduction

BelaSigna

300 is a DSP−based mixed−signal audio processing

system that delivers superior audio clarity without compromising size

or battery life. The processor is specifically designed for monaural

portable communication devices requiring high performance audio

processing capabilities and programming flexibility when form−factor

and power consumption are key design constraints.

The efficient dual−MAC 24−bit CFX DSP core, together with the

HEAR configurable accelerator signal processing engine, high speed

debugging interface, advanced algorithm security system, state−of−

the−art analog front end, Class D output stage and much more,

constitute an entire system on a single chip, which enables

manufacturers to create a range of advanced and unique products. The

system features a high level of instructional parallelism, providing

highly efficient computing capability. It can simultaneously execute

multiple advanced adaptive noise reduction and echo cancellation

algorithms, and uses an asymmetric dual−core patented architecture to

allow for more processing in fewer clock cycles, resulting in reduced

power consumption.

BelaSigna 300 is supported by a comprehensive suite of

development tools, hands−on training, full technical support and a

network of solution partners offering software and engineering

services to help speed product design and shorten time to market.

www.onsemi.com

WLCSP−35

W SUFFIX

CASE 567AG

MARKING DIAGRAM

BELASIGNA300

35−02−G

XXXXYZZ

BELASIGNA300 = Device Code

= Number of Balls

= Revision of Die

= Pb−Free

XXXX

= Date Code

= Assembly Plant Identifier

(May be Two Characters)

= Traceability Code

Key Features

•

Flexible DSP−based System:

a complete DSP−based, mixed−signal

audio system consisting of the CFX core, a fully programmable,

highly cycle−efficient, dual−Harvard architecture 24−bit DSP

utilizing explicit parallelism; the HEAR configurable accelerator for

optimized signal processing; and an efficient input/output controller

(IOC) along with a full complement of peripherals and interfaces,

which optimize the architecture for audio processing at extremely

low power consumption

Ultra−low−power:

typically 1−5 mA

Excellent Audio Fidelity:

up to 110 dB input dynamic range,

exceptionally low system noise and low group delay

Miniature Form Factor:

available in a miniature 3.63 mm x

2.68 mm x 0.92 mm (including solder balls) WLCSP package.

Multiple Audio Input Sources:

four input channels from five input

sources (depends on package selection) can be used simultaneously

for multiple microphones or direct analog audio inputs

Full Range of Configurable Interfaces:

including a fast I

C−based

interface for download, debug and general communication, a highly

configurable PCM interface to stream data into and out of the device,

a high−speed UART, an SPI port and 5 GPIOs

ORDERING INFORMATION

Device

B300W35A109XXG

Package

WLCSP

(Pb−Free)

Shipping

†

2500 / Tape &

Reel

•

†For information on tape and reel specifications, in-

cluding part orientation and tape sizes, please refer

to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

Semiconductor Components Industries, LLC, 2017

February, 2018 − Rev. 10

Publication Order Number:

B300/D

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