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89HPES16T4G2ZBBXG

Description
PCI Interface IC PCI EXPRESS SWITCH
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size299KB,31 Pages
ManufacturerIDT (Integrated Device Technology)
Environmental Compliance
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89HPES16T4G2ZBBXG Overview

PCI Interface IC PCI EXPRESS SWITCH

89HPES16T4G2ZBBXG Parametric

Parameter NameAttribute value
Brand NameIntegrated Device Technology
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerIDT (Integrated Device Technology)
Parts packaging codeSBGA
package instructionSBGA-288
Contacts288
Manufacturer packaging codeBXG288
Reach Compliance Codecompliant
ECCN codeEAR99
Address bus width
Bus compatibilityPCI
maximum clock frequency125 MHz
Drive interface standardsIEEE 1149.1
External data bus width
JESD-30 codeS-PBGA-B288
JESD-609 codee1
length23 mm
Humidity sensitivity level3
Number of terminals288
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Encapsulate equivalent codeBGA288,22X22,40
Package shapeSQUARE
Package formGRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Celsius)260
power supply1,2.5,3.3 V
Certification statusNot Qualified
Maximum seat height1.7 mm
Maximum slew rate908 mA
Maximum supply voltage1.1 V
Minimum supply voltage0.9 V
Nominal supply voltage1 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width23 mm
uPs/uCs/peripheral integrated circuit typeBUS CONTROLLER, PCI
Base Number Matches1
16-Lane 4-Port
Gen2 PCI Express® Switch
®
89HPES16T4G2
Data Sheet
Device Overview
The 89HPES16T4G2 is a member of IDT’s PRECISE™ family of PCI
Express® switching solutions. The PES16T4G2 is a 16-lane, 4-port
Gen2 peripheral chip that performs PCI Express Base switching with a
feature set optimized for high performance applications such as servers,
storage, and communications/networking. It provides connectivity and
switching functions between a PCI Express upstream port and up to
three downstream ports and supports switching between downstream
ports.
Features
High Performance PCI Express Switch
– Sixteen 5 Gbps Gen2 PCI Express lanes
– Four switch ports
• One x4 upstream port
• Three x4 downstream ports
– Low latency cut-through switch architecture
– Support for Max Payload Size up to 2048 bytes
– One virtual channel
– Eight traffic classes
– PCI Express Base Specification Revision 2.0 compliant
Flexible Architecture with Numerous Configuration Options
– Automatic per port link width negotiation to x4, x2 or x1
– Automatic lane reversal on all ports
– Automatic polarity inversion
– Ability to load device configuration from serial EEPROM
Legacy Support
– PCI compatible INTx emulation
– Bus locking
Highly Integrated Solution
– Incorporates on-chip internal memory for packet buffering and
queueing
– Integrates sixteen 5 Gbps embedded SerDes with 8b/10b
encoder/decoder (no separate transceivers needed)
• Receive equalization (RxEQ)
Reliability, Availability, and Serviceability (RAS) Features
– Internal end-to-end parity protection on all TLPs ensures data
integrity even in systems that do not implement end-to-end
CRC (ECRC)
– Supports ECRC and Advanced Error Reporting
– Supports PCI Express Native Hot-Plug, Hot-Swap capable I/O
– Compatible with Hot-Plug I/O expanders used on PC mother-
boards
– Supports Hot-Swap
Block Diagram
4-Port Switch Core / 16 PCI Express Lanes
Frame Buffer
Route Table
Port
Arbitration
Scheduler
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
SerDes
SerDes
SerDes
SerDes
(Port 0)
(Port 2)
(Port 4)
(Port 6)
Figure 1 Internal Block Diagram
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 31
©
2011 Integrated Device Technology, Inc.
August 10, 2011
DSC 6928

89HPES16T4G2ZBBXG Related Products

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Description PCI Interface IC PCI EXPRESS SWITCH PCI Interface IC PCI EXPRESS SWITCH PCI Interface IC PCI EXPRESS SWITCH PCI Interface IC PCI EXPRESS SWITCH
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology
Is it lead-free? Lead free Lead free Contains lead Contains lead
Is it Rohs certified? conform to conform to incompatible incompatible
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code SBGA SBGA SBGA SBGA
package instruction SBGA-288 SBGA-288 SBGA-288 SBGA-288
Contacts 288 288 288 288
Manufacturer packaging code BXG288 BXG288 BX288 BX288
Reach Compliance Code compliant compliant not_compliant not_compliant
ECCN code EAR99 EAR99 EAR99 EAR99
Bus compatibility PCI PCI; SMBUS PCI PCI; SMBUS
maximum clock frequency 125 MHz 125 MHz 125 MHz 125 MHz
JESD-30 code S-PBGA-B288 S-PBGA-B288 S-PBGA-B288 S-PBGA-B288
JESD-609 code e1 e1 e0 e0
length 23 mm 23 mm 23 mm 23 mm
Humidity sensitivity level 3 3 3 3
Number of terminals 288 288 288 288
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LBGA LBGA LBGA LBGA
Encapsulate equivalent code BGA288,22X22,40 BGA288,22X22,40 BGA288,22X22,40 BGA288,22X22,40
Package shape SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Celsius) 260 260 225 225
power supply 1,2.5,3.3 V 1,2.5,3.3 V 1,2.5,3.3 V 1.2,2.5,3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.7 mm 1.7 mm 1.7 mm 1.7 mm
Maximum supply voltage 1.1 V 1.1 V 1.1 V 1.1 V
Minimum supply voltage 0.9 V 0.9 V 0.9 V 0.9 V
Nominal supply voltage 1 V 1 V 1 V 1 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37)
Terminal form BALL BALL BALL BALL
Terminal pitch 1 mm 1 mm 1 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature 30 NOT SPECIFIED 20 NOT SPECIFIED
width 23 mm 23 mm 23 mm 23 mm
uPs/uCs/peripheral integrated circuit type BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI
Maximum slew rate 908 mA 908 mA 908 mA -
Base Number Matches 1 1 1 -
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