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RTO050F27001FTE1

Description
Thick Film Resistors - Through Hole RTO 50 F 27K 1% TU50 e1
CategoryPassive components   
File Size108KB,5 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
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Thick Film Resistors - Through Hole RTO 50 F 27K 1% TU50 e1

RTO050F27001FTE1 Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
ManufacturerVishay
Product CategoryThick Film Resistors - Through Hole
TechnologyThick Film
Mounting StylePCB Mount
RTO 50
www.vishay.com
Vishay Sfernice
50 W Power Resistor, Thick Film Technology, TO-220
FEATURES
• 50 W at 25 °C heatsink mounted
• Adjusted by sand trimming
• Leaded or surface mount versions
• High power to size ratio
• Non inductive element
• Material categorization: for definitions of compliance
please see
www.vishay.com/doc?99912
DESIGN SUPPORT TOOLS
Models
Available
click logo to get started
Because of the knowledge and experience in Thick Film technology, Vishay Sfernice has been able to develop a high power
resistor in a TO-220 package called RTO 50. The special design of this component allows the dissipation of 50 W when mounted
on a heatsink. The ohmic value is adjusted by sand trimming. This process does not generate hot spots as in laser trimming,
which could lead to microcracks on each side of the curve. This process improves the reliability and the stability of the resistor
and at the same time gives a good overload capability.
DIMENSIONS
in millimeters
RTO 50F - LEADED
4.5
10.1
Ø 3.6
1.3
RTO 50C - FOR SURFACE MOUNTING
4.5
10.1
Ø 3.6
1.3
12.5
15
8.8
12.5
15
8.8
2
3
13.7
1.6
5.08
0.3
Ø 0.8
5.08
2.5
• Only for RTO 50 version C = during surface mount soldering, the
soldering temperature profile must not cause the metal tab of this
device to exceed 220 °C.
STANDARD ELECTRICAL SPECIFICATIONS
MODEL
RTO 50
Note
(1)
E24 series
SIZE
TO-220
RESISTANCE RATED POWER
RANGE
P
25 °C
W
(1)
0.010 to 550K
50
LIMITING ELEMENT
VOLTAGE
U
L
V
500
TOLERANCE
±%
1, 2, 5, 10
TEMPERATURE
COEFFICIENT
± ppm/°C
150
CRITICAL
RESISTANCE
5K
MECHANICAL SPECIFICATIONS
Mechanical Protection
Resistive Element
Connections
Weight
Molded
Thick film
Tinned copper alloy
2.2 g max.
TECHNICAL SPECIFICATIONS
Dissipation and Associated
Thermal Resistance
and Nominal Power
Dielectric Strength
MIL STD 202 (301)
Insulation Resistance
Inductance
Onto a heatsink
50 W at +25 °C
R
TH (j - c)
: 2.6 °C/W
Free air: 2.25 W at +25 °C
2000 V
RMS
- 1 min
10 mA max.
10
6
M
0.1 μH
ENVIRONMENTAL SPECIFICATIONS
Temperature Range
Climatic Category
Sealing
Flammability
-55 °C to 155 °C
55 / 155 / 156
Sealed container, solder immersion
IEC 60695-11-5,
2 applications 30 s separated by 60 s
DIMENSIONS
Standard Package
TO-220 insulated case
Note
• Not compatible with RoHS reflow profile
Revision: 16-Nov-17
Document Number: 50035
1
For technical questions, contact:
sferfixedresistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
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