HSMS-2818-BLK datasheet, PDF - EEWORLD Datasheet

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HSMS-2818-BLK: DescriptionSILICON, MIXER DIODE; CategoryDiscrete semiconductor diode; File Size132KB，10 Pages; ManufacturerHP（Keysight）; Websitehttp://www.semiconductor.agilent.com/

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HSMS-2818-BLK Overview

SILICON, MIXER DIODE

HSMS-2818-BLK Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	HP（Keysight）
Parts packaging code	SOT-143
package instruction	R-PDSO-G4
Contacts	4
Reach Compliance Code	unknown
Shell connection	CATHODE
Configuration	BRIDGE, 4 ELEMENTS
Maximum diode capacitance	0.2 pF
Diode component materials	SILICON
Diode type	MIXER DIODE
Maximum forward voltage (VF)	0.4 V
JESD-30 code	R-PDSO-G4
JESD-609 code	e0
Humidity sensitivity level	NOT SPECIFIED
Number of components	4
Number of terminals	4
Maximum operating temperature	150 °C
Minimum operating temperature	-65 °C
Package body material	PLASTIC/EPOXY
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum repetitive peak reverse voltage	20 V
Maximum reverse current	0.2 µA
Reverse test voltage	15 V
surface mount	YES
technology	SCHOTTKY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
Base Number Matches	1

HSMS-2818-BLK Preview

Surface Mount RF Schottky

Barrier Diodes

Technical Data

HSMS-281x Series

Features

• Surface Mount Packages

• Low Flicker Noise

• Low FIT (Failure in Time)

Rate*

• Six-sigma Quality Level

• Single, Dual and Quad

Versions

• Tape and Reel Options

Available

• Lead-free Option Available

Package Lead Code Identification, SOT-23/SOT-143

(Top View)

COMMON

SINGLE

SERIES

ANODE

CATHODE

UNCONNECTED

PAIR

RING

QUAD

BRIDGE

QUAD

* For more information see the

Surface Mount Schottky Reliability

Data Sheet.

Description/Applications

These Schottky diodes are

specifically designed for both

analog and digital applications.

This series offers a wide range of

specifications and package

configurations to give the

designer wide flexibility. The

HSMS-281x series of diodes

features very low flicker (1/f)

noise.

Note that Agilent’s manufacturing

techniques assure that dice found

in pairs and quads are taken from

adjacent sites on the wafer,

assuring the highest degree of

match.

Package Lead Code

Identification, SOT-323

(Top View)

SINGLE

SERIES

Package Lead Code

Identification, SOT-363

(Top View)

HIGH ISOLATION

UNCONNECTED PAIR

UNCONNECTED

TRIO

COMMON

ANODE

COMMON

CATHODE

Pin Connections and

Package Marking

Notes:

1. Package marking provides

orientation and identification.

2. See “Electrical Specifications” for

appropriate package marking.

GUx

Absolute Maximum Ratings

[1]

= 25°C

Symbol

stg

Parameter

Forward Current (1

µs

Pulse)

Peak Inverse Voltage

Junction Temperature

Storage Temperature

Thermal Resistance

[2]

Unit

Amp

°C

°C/W

SOT-23/SOT-143

Same as V

150

-65 to 150

500

SOT-323/SOT-363

Same as V

150

-65 to 150

150

Notes:

1. Operation in excess of any one of these conditions may result in permanent damage to the device.

2. T

= +25°C, where T

is defined to be the temperature at the package pins where contact is made to the circuit board.

ESD WARNING:

Handling Precautions Should Be Taken To Avoid Static Discharge.

Electrical Specifications T

= 25

C, Single Diode

[4]

Part

Package

Number Marking Lead

HSMS

[5]

Code

2810

2812

2813

2814

2815

2817

2818

281B

281C

281E

281F

281K

281L

[3]

[7]

Maximum

Minimum Maximum Forward

Breakdown Forward

Voltage

(V) @

(V)

(mV)

(mA)

400

1.0

Maximum

Reverse

Typical

Leakage

Maximum

Dynamic

(nA) @ Capacitance Resistance

Ω

(V)

(pF)

(Ω)

[6]

200

1.2

Configuration

Single

Series

Common Anode

Common Cathode

Unconnected Pair

Ring Quad

[5]

Bridge Quad

[5]

Single

Series

Common Anode

Common Cathode

High Isolation

Unconnected Pair

Unconnected Trio

Test Conditions

= 10

µA

= 1 mA

= 0 V

f = 1 MHz

= 5 mA

Notes:

∆V

for diodes in pairs and quads in 15 mV maximum at 1 mA.

∆C

for diodes in pairs and quads is 0.2 pF maximum.

3. Package marking code is in white.

4. Effective Carrier Lifetime (τ) for all these diodes is 100 ps maximum measured with Krakauer method at 5 mA.

5. See section titled “Quad Capacitance.”

6. R

= R

+ 5.2

Ω

at 25°C and I

= 5 mA.

7. Package marking code is laser marked.

Quad Capacitance

Capacitance of Schottky diode

quads is measured using an

HP4271 LCR meter. This

instrument effectively isolates

individual diode branches from

the others, allowing accurate

capacitance measurement of each

branch or each diode. The

conditions are: 20 mV R.M.S.

voltage at 1 MHz. Agilent defines

this measurement as “CM”, and it

is equivalent to the capacitance of

the diode by itself. The equivalent

diagonal and adjacent

capacitances can then be

calculated by the formulas given

below.

In a quad, the diagonal capaci-

tance is the capacitance between

points A and B as shown in the

figure below. The diagonal

capacitance is calculated using

the following formula

x C

DIAGONAL

= _______ + _______

+ C

The equivalent adjacent

capacitance is the capacitance

between points A and C in the

figure below. This capacitance is

calculated using the following

formula

ADJACENT

= C

+ ____________

–– + –– + ––

Linear Equivalent Circuit, Diode Chip

SPICE Parameters

Parameter Units

Ω

HSMS-281x

1.1

0.69

E-5

4.8E - 9

1.08

0.65

0.5

= series resistance (see Table of SPICE parameters)

= junction capacitance (see Table of SPICE parameters)

8.33 X 10

-5

+ I

where

= externally applied bias current in amps

= saturation current (see table of SPICE parameters)

T = temperature,

°K

n = ideality factor (see table of SPICE parameters)

Note:

To effectively model the packaged HSMS-281x product,

please refer to Application Note AN1124.

Typical Performance, T

= 25

C (unless otherwise noted), Single Diode

100

– FORWARD CURRENT (mA)

100,000

– DYNAMIC RESISTANCE (Ω)

1000

10,000

– REVERSE CURRENT (nA)

100

1000

100

0.1

0.01

= +125°C

= +75°C

= +25°C

= –25°C

0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8

– FORWARD VOLTAGE (V)

= +125°C

= +75°C

= +25°C

0.1

100

– REVERSE VOLTAGE (V)

– FORWARD CURRENT (mA)

Figure 1. Forward Current vs.

Forward Voltage at Temperatures.

Figure 2. Reverse Current vs.

Reverse Voltage at Temperatures.

Figure 3. Dynamic Resistance vs.

Forward Current.

1.25

- FORWARD CURRENT (mA)

(Left Scale)

0.75

0.50

∆V

(Right Scale)

0.25

– REVERSE VOLTAGE (V)

0.3

0.2

0.4

0.6

0.8

1.0

1.2

0.3

1.4

- FORWARD VOLTAGE (V)

Figure 4. Total Capacitance vs.

Reverse Voltage.

Figure 5. Typical V

Match, Pairs and

Quads.

∆V

- FORWARD VOLTAGE DIFFERENCE (mV)

– CAPACITANCE (pF)

Applications Information

Introduction —

Product Selection

Agilent’s family of Schottky

products provides unique solu-

tions to many design problems.

The first step in choosing the right

product is to select the diode type.

All of the products in the

HSMS-282x family use the same

diode chip, and the same is true of

the HSMS-281x and HSMS-280x

families. Each family has a

different set of characteristics

which can be compared most

easily by consulting the SPICE

parameters in Table 1.

A review of these data shows that

the HSMS-280x family has the

highest breakdown voltage, but at

the expense of a high value of

series resistance (R

). In applica-

tions which do not require high

voltage the HSMS-282x family,

with a lower value of series

resistance, will offer higher

current carrying capacity and

better performance. The HSMS-

281x family is a hybrid Schottky

(as is the HSMS-280x), offering

lower 1/f or flicker noise than the

HSMS-282x family.

In general, the HSMS-282x family

should be the designer’s first

choice, with the -280x family

reserved for high voltage applica-

tions and the HSMS-281x family

for low flicker noise applications.

0.026

0.07

0.035

0.016

Figure 6. PCB Pad Layout

(dimensions in inches).

Assembly Instructions

SOT-323 PCB Footprint

A recommended PCB pad layout

for the miniature SOT-323 (SC-70)

package is shown in Figure 6

(dimensions are in inches). This

layout provides ample allowance

for package placement by auto-

mated assembly equipment

without adding parasitics that

could impair the performance.

Assembly Instructions

SOT-363 PCB Footprint

A recommended PCB pad layout

for the miniature SOT-363 (SC-70,

6 lead) package is shown in

Figure 7 (dimensions are in

inches). This layout provides

ample allowance for package

placement by automated assembly

equipment without adding

parasitics that could impair the

performance.

0.026

Table 1. Typical SPICE Parameters.

Parameter

)

(XTI)

Units

Ω

HSMS-280x

1.6

0.69

1 E-5

3 E-8

1.08

0.65

0.5

HSMS-281x

1.1

0.69

1 E-5

4.8 E-9

1.08

0.65

0.5

HSMS-282x

0.7

0.69

1 E-4

2.2 E-8

1.08

6.0

0.65

0.5

0.075

0.035

0.016

Figure 7. PCB Pad Layout

(dimensions in inches).

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