AgilentHSME-C110/C120/C150/
C170/C177/C190/C191/C197/C265
AlInGaP Green ChipLED
Data Sheet
Features
• Small size
• Industry standard footprint
• Operating temperature range of
–30˚C to +85˚C
• Compatible with IR soldering
• Available in 8 mm tape on
7" diameter reel
• Reel sealed in zip-locked
moisture barrier bags
Description
This chip-type LED utilizes Alumi-
num Indium Gallium Phosphide
(AlInGaP) material technology. The
AlInGaP material has a very high
luminous efficiency, capable of
producing high light output.
These chipLEDs come in top
mounting, top emitting packages
(HSMx-C150/170/177/190/191/197),
top mounting, side emitting pack-
ages (HSMx-C110/120) or reverse
mounting, top emitting package
(HSMx-C265).
Applications
• Membrane switch indicator
• LCD backlighting
• Pushbutton backlighting
• Front panel indicator
• Symbol backlighting
• Keypad backlighting
All packages are binned by both
color and intensity.
In order to facilitate pick and
place operation, these chipLEDs
are shipped in Tape & Reel, with
4000 units per reel for HSMx-
C120/170/ 177/190/191/197 and
3000 units per reel for HSMx-
C110/C150/265.
These packages are compatible
with reflow soldering process.
Agilent reserves the right to alter prices, specification, features, capabilities, functions, release dates, and remove availability of
the product(s) at anytime.
Device Selection Guide
Package Dimension (mm)
[1,2]
1.6 (L) x 0.8 (W) x 0.6 (H)
1.6 (L) x 0.8 (W) x 0.4 (H)
1.6 (L) x 0.8 (W) x 0.8 (H)
2.0 (L) x 1.25 (W) x 0.8 (H)
2.0 (L) x 1.25 (W) x 0.4 (H)
1.6 (L) x 0.6 (W) x 1.0 (H)
3.2 (L) x 1.0 (W) x 1.5 (H)
3.2 (L) x 1.6 (W) x 1.1 (H)
3.4 (L) x 1.25 (W) x 1.1 (H)
AlInGaP Green
HSME-C191
HSME-C197
HSME-C190
HSME-C170
HSME-C177
HSME-C120
HSME-C110
HSME-C150
HSME-C265
Package Description
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Non-diffused
Untinted, Non-diffused
Untinted, Diffused
Untinted, Non-diffused
Notes:
1. Dimensions in mm.
2. Tolerance
±
0.1 mm unless otherwise noted.
Absolute Maximum Ratings at T
A
= 25°C
Parameter
DC Forward Current
[1,2]
Power Dissipation
Reverse Voltage (I
R
= 100
µA)
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
Soldering Temperature
HSME-C110/120/170/177/
190/191/197/150/265
20
52
5
95
–30 to +85
–40 to +85
Units
mA
mW
V
°C
°C
°C
See reflow soldering profile (Figures 6 & 7)
Notes:
1. Derate linearly as shown in Figure 4.
2. Drive current above 5 mA is recommended for best long term performance.
Electrical Characteristics at T
A
= 25°C
Forward Voltage
V
F
(Volts)
@ I
F
= 20 mA
Typ.
Max.
2.1
2.1
2.1
2.6
2.6
2.6
Reverse Breakdown
V
R
(Volts)
@ I
R
= 100
µA
Min.
5
5
5
Capacitance C
(pF), V
F
= 0,
f = 1 MHz
Typ.
18
15
16
Thermal
Resistance
Rθ
J–PIN
(°C/W)
Typ.
550
450
450
Part Number
HSME-C110/120
HSME-C150/170/177/190/191/197
HSME-C265
5
Microcontroller MCU
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