Thin-Film RF/Microwave
Capacitor Technology
Accu-P
®
5
Accu-P
®
Thin-Film Technology
THE IDEAL CAPACITOR
The non-ideal characteristics of a real capacitor can be
ignored at low frequencies. Physical size imparts inductance
to the capacitor and dielectric and metal electrodes result in
resistive losses, but these often are of negligible effect on the
circuit. At the very high frequencies of radio communication
(>100MHz) and satellite systems (>1GHz), these effects
become important. Recognizing that a real capacitor will
exhibit inductive and resistive impedances in addition to
capacitance, the ideal capacitor for these high frequencies is
an ultra low loss component which can be fully characterized
in all parameters with total repeatability from unit to unit.
Until recently, most high frequency/microwave capacitors
were based on fired-ceramic (porcelain) technology. Layers
of ceramic dielectric material and metal alloy electrode paste
are interleaved and then sintered in a high temperature oven.
This technology exhibits component variability in dielectric
quality (losses, dielectric constant and insulation resistance),
variability in electrode conductivity and variability in physical
size (affecting inductance). An alternate thin-film technology
has been developed which virtually eliminates these vari-
ances. It is this technology which has been fully incorporated
into Accu-P
®
and Accu-P
®
to provide high frequency capaci-
tors exhibiting truly ideal characteristics.
The main features of Accu-P
®
may be summarized as follows:
• High purity of electrodes for very low and repeatable
ESR.
• Highly pure, low-K dielectric for high breakdown field,
high insulation resistance and low losses to frequencies
above 40GHz.
• Very tight dimensional control for uniform inductance,
unit to unit.
• Very tight capacitance tolerances for high frequency
signal applications.
This accuracy sets apart these Thin-Film capacitors from
ceramic capacitors so that the term Accu has been
employed as the designation for this series of devices, an
abbreviation for “accurate.”
1
THIN-FILM TECHNOLOGY
Thin-film technology is commonly used in producing semi-
conductor devices. In the last two decades, this technology
has developed tremendously, both in performance and in
process control. Today’s techniques enable line definitions of
below 1μm, and the controlling of thickness of layers at 100Å
(10
-2
μm). Applying this technology to the manufacture of
capacitors has enabled the development of components
where both electrical and physical properties can be tightly
controlled.
The thin-film production facilities at AVX consist of:
• Class 1000 clean rooms, with working areas under
laminar-flow hoods of class 100, (below 100 particles
per cubic foot larger than 0.5μm).
• High vacuum metal deposition systems for high-purity
electrode construction.
• Photolithography equipment for line definition down to
2.0μm accuracy.
• Plasma-enhanced CVD for various dielectric deposi-
tions (CVD=Chemical Vapor Deposition).
• High accuracy, microprocessor-controlled dicing saws
for chip separation.
• High speed, high accuracy sorting to ensure strict
tolerance adherence.
Orientation Marking
Alumina (Al
2
O
3
)
Seal
(SiNO)
Dielectric (SiO
2
/ SiNO)
Electrode
Electrode
Alumina (Al
2
O
3
)
Terminations
ACCU-P
®
CAPACITOR STRUCTURE
6
Accu-P
®
Thin-Film Chip Capacitors
ACCU-P
®
TECHNOLOGY
The use of very low-loss dielectric materials, silicon dioxide and
silicon oxynitride, in conjunction with highly conductive elec-
trode metals results in low ESR and high Q. These
high-frequency characteristics change at a slower rate with
increasing frequency than for ceramic microwave capacitors.
Because of the thin-film technology, the above-mentioned
frequency characteristics are obtained without significant
compromise of properties required for surface mounting.
The main Accu-P
®
properties are:
• Internationally agreed sizes with excellent dimensional
control.
• Ultra small size chip capacitors (01005) are available.
• Ultra tight capacitance tolerances.
• Low ESR at VHF, UHF and microwave frequencies.
• Enhanced RF power handling capablity.
• High stability with respect to time, temperature, frequency
and voltage variation.
• Nickel/solder-coated terminations to provide excellent sol-
derability and leach resistance.
APPLICATIONS
Cellular Communications
CT2/PCN (Cordless
Telephone/Personal Comm.
Networks)
Satellite TV
Cable TV
GPS (Global Positioning Systems)
Vehicle Location Systems
Vehicle Alarm Systems
Paging
Military Communications
Radar Systems
Video Switching
Test & Measurements
Filters
VCO's
Matching Networks
RF Amplifiers
1
APPROVALS
ISO 9001
ACCU-P
®
FEATURES
Accu-P
®
meets the fast-growing demand for low-loss
(high-Q) capacitors for use in surface mount technology espe-
cially for the mobile communications market, such as cellular
radio of 450 and 900 MHz, UHF walkie-talkies, UHF cordless
telephones to 2.3 GHz, low noise blocks at 11-12.5 GHz and
for other VHF, UHF and microwave applications.
Accu-P
®
is currently unique in its ability to offer very
low capacitance values (0.05pF) and very tight capacitance
tolerances (±0.01pF).
• The RF power handling capability of the Accu-P
®
allows
for its usage in both small signal and RF power applica-
tions.
• Thin Film Technology guarantees minimal batch to batch
variability of parameters at high frequency.
• Inspection test and quality control procedures in accor-
dance with ISO 9001, CECC, IECQ and USA MIL
Standards yield products of the highest quality.
• Hand soldering Accu-P
®
: Due to their construction utilizing
relatively high thermal conductivity materials, Accu-P’s
have become the preferred device in R & D labs and pro-
duction environments where hand soldering is used.
7
Accu-P
®
Thin-Film Chip Capacitors for
RF Signal and Power Applications
B
1
ACCU-P
®
(Signal and Power Type Capacitors)
01005*
0201*
0.60±0.05
(0.023±0.002)
0.325±0.050
(0.0128±0.002)
0.225±0.050
(0.009±0.002)
0.10±0.10
(0.004±0.004)
0.15±0.05
(0.006±0.002)
0402*
1.00±0.1
(0.039±0.004)
0.55±0.07
(0.022±0.003)
0.40±0.1
(0.016±0.004)
0.00
+0.1
-0.0
(0.000
+0.004
)
-0.000
0.20±0.1
(0.008±0.004)
0603*
1.60±0.1
(0.063±0.004)
0.81±0.1
(0.032±0.004)
0.63±0.1
(0.025±0.004)
0.35±0.15
(0.014±0.006)
0.35±0.15
(0.014±0.006)
0805*
2.01±0.1
(0.079±0.004)
1.27±0.1
(0.050±0.004)
0.93±0.2
(0.036±0.008)
0.30±0.1
(0.012±0.004)
0.30±0.1
(0.012±0.004)
1210
3.02±0.1
(0.119±0.004)
2.5±0.1
(0.100±0.004)
0.93±0.2
(0.036±0.008)
0.43±0.1
(0.017±0.004)
0.43±0.1
(0.017±0.004)
W
L
W
1
T
B
2
L
T
B
1
B
2
0.405±0.020
(0.016±0.001)
0.215 ± 0.020
(0.0085 ± 0.001)
0.145 ± 0.020
(0.006 ± 0.001)
0.00
+0.1
-0.0
(0.000
+0.004
)
-0.000
0.10 ± 0.03
(0.004 ± 0.001)
*Mount Black Side Up
DIMENSIONS: millimeters (inches)
HOW TO ORDER
0402
Size
C005
0201
0402
0603
0805
1210*
3
Voltage
2 = 200V
1 = 100V
5 = 50V
3 = 25V
Y = 16V
Z = 10V
J
Temperature
Coefficient
(1)
4R7
Capacitance
A
Tolerance
for
C≤2.0pF*
Z = ±0.01pF
P = ±0.02pF
Q = ±0.03pF
A = ±0.05pF
B = ±0.1pF
C = ±0.25pF
B
Specification
Code
B = Accu-P
®
technology
S
Termination
Code
TR
Packaging
Code
Capacitance
J = 0±30ppm/°C expressed in pF.
(-55°C to
(2 significant
+125°C)
digits + number
K = 0±60ppm/°C
of zeros)
(-55°C to
for values <10pF,
+125°C)
letter R denotes
decimal point.
Example:
68pF = 680
8.2pF = 8R2
for C≤3.0pF
Q = ±0.03pF
A = ±0.05pF
B = ±0.1pF
C = ±0.25pF
(1)
TC’s shown are per EIA/IEC Specifications.
for C≤5.6pF
A = ±0.05pF
B = ±0.1pF
C = ±0.25pF
W = Nickel/Solder Coated
TR = Tape & Reel
Accu-P
®
0402
Sn90,
Pb10***
T = Nickel/High Temperature
Solder Coated
Accu-P
®
0805**, 1210**
Sn96, Ag4
Nickel/Solder Coated
Accu-P
®
0603***
Sn63, Pb37
**S
= Nickel/Lead Free
Solder Coated
Accu-P
®
01005, 0201,
0402, 0603
Sn100
**RoHS compliant
*** Not RoHS Compliant
for 5.6pF<C<10pF
Engineering Kits Available
see pages 114-115
*
Tolerances as tight as ±0.01pF are available. Please consult the factory.
B = ±0.1pF
C = ±0.25pF
D = ±0.5pF
for C≥10pF
F = ±1%
G = ±2%
J = ±5%
LEAD-FREE COMPATIBLE
COMPONENT
For RoHS compliant products,
please select correct termination style.
ELECTRICAL SPECIFICATIONS
Operating and Storage Temperature Range
Temperature Coefficients
(1)
Capacitance Measurement
Insulation Resistance (IR)
Proof Voltage
Aging Characteristic
Dielectric Absorption
-55°C to +125°C
0 ± 30ppm/°C dielectric code “J” / 0 ± 60ppm/°C dielectric code “K”
1 MHz, 1 Vrms
≥10
11
Ohms (≥10
10
Ohms for 0201 and 0402 size)
2.5 U
R
for 5 secs.
Zero
0.01%
8
Accu-P
®
Signal and Power Type Capacitors
Accu-P
®
Capacitance Ranges (pF)
TEMP. COEFFICIENT CODE
“J” = 0±30ppm/°C (-55°C to +125°C)
(2)
“K” = 0±60ppm/°C (-55°C to +125°C)
(2)
Size
Size Code
Voltage
Cap in
pF
(1)
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
2.0
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
3.0
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
4.0
4.1
4.2
4.3
4.4
4.5
4.6
4.7
5.1
5.6
6.2
6.8
7.5
8.2
9.1
10.0
11.0
12.0
13.0
14.0
15.0
16.0
17.0
18.0
19.0
20.0
21.0
22.0
24.0
27.0
30.0
33.0
39.0
47.0
56.0
68.0
(1)
(2)
C005
16
100
50
0201
25
16
10
200
100
50
0402
25
16
10
200
0603
100
50
25
100
0805
50
25
1210
100
50
1
Cap
code
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
0R1
0R2
0R3
0R4
0R5
0R6
0R7
0R8
0R9
1R0
1R1
1R2
1R3
1R4
1R5
1R6
1R7
1R8
1R9
2R0
2R1
2R2
2R3
2R4
2R5
2R6
2R7
2R8
2R9
3R0
3R1
3R2
3R3
3R4
3R5
3R6
3R7
3R8
3R9
4R0
4R1
4R2
4R3
4R4
4R5
4R6
4R7
5R1
5R6
6R2
6R8
7R5
8R2
9R1
100
110
120
130
140
150
160
170
180
190
200
210
220
240
270
300
330
390
470
560
680
For capacitance values higher than listed in table, please consult factory.
TC shown is per EIA/IEC Specifications.
These values are produced with “K” temperature coefficient code only.
Intermediate values are available within the indicated range.
9
MCU
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