VTM
V•I Chip – VTM
Voltage Transformation Module
TM
V048K015T090
K indicates BGA configuration. For other
mounting options see Part Numbering below.
• 48 V to 1.5 V V•I Chip Converter
• 90 A (135 A for 1 ms)
• High density – 360 A/in
3
• Small footprint – 84 A/in
2
• Low weight – 0.5 oz (14 g)
• Pick & Place / SMD
Product Description
• 125°C operation
• 1 µs transient response
• >3.5 million hours MTBF
• Typical efficiency 93% at 1.5 V/50 A
• No output filtering required
• BGA or J-Lead packages
Actual size
©
V
f
= 26 - 55 V
V
OUT
= 0.8 - 1.7 V
I
OUT
= 90 A
K =
1/32
R
OUT
= 1.2 mΩ max
Absolute Maximum Ratings
Parameter
+In to -In
+In to -In
PC to -In
TM to -In
VC to -In
+Out to -Out
Isolation voltage
Operating junction temperature
Output current
The V048K015T090 V
•
I Chip Voltage Transformation
Module (VTM) breaks records for speed, density and
efficiency to meet the demands of advanced DSP,
FPGA, ASIC, processor cores and microprocessor
applications at the point of load (POL) while providing
isolation from input to output. It achieves a response
time of less than 1 µs and delivers up to 90 A in a
volume of less than 0.25 in
3
while providing low output
voltages with unprecedented efficiency. It may be
paralleled to deliver hundreds of amps at an output
voltage settable from 0.8 to 1.7 Vdc.
The VTM V048K015T090’s nominal output voltage is
1.5 Vdc from a 48 Vdc input factorized bus, V
f
, and is
controllable from 0.8 to 1.7 Vdc at no load, and from
0.8 to 1.6 Vdc at full load, over a V
f
input range of 26
to 55 Vdc. It can be operated either open- or closed-loop
depending on the output regulation needs of the
application. Operating open-loop, the output voltage
tracks its V
f
input voltage with a transformation ratio,
K = 1/32, and an output resistance, R
OUT
= 1.0 milliohm, to
enable applications requiring a programmable low
output voltage at high current and high efficiency.
Closing the loop back to an input Pre-Regulation
Module (PRM) or DC-DC converter can compensate
for R
OUT
.
Values
-1.0 to 60.0
100
-0.3 to 7.0
-0.3 to 7.0
-0.3 to 19.0
-0.1 to 4.0
2,250
Unit
Vdc
Vdc
Vdc
Vdc
Vdc
Notes
For 100 ms
P
L
E
R
IN
IM
Peak output current
Case temperature during reflow
Storage temperature
Output power
Peak output power
-40 to 125
90
135
208
Y
R
A
Vdc
Vdc
°C
A
See Note
Continuous
A
For 1 ms
°C
°C
W
W
Continuous
For 1 ms
Input to Output
-40 to 150
145
217
Note:
The referenced junction is defined as the semiconductor having the highest temperature.
This temperature is monitored by the temperature monitor (TM) signal and by a shutdown comparator.
Part Numbering
The 1.5 V VTM achieves break-through current density
of 360 A/in
3
in a V
•
I Chip package compatible with
standard pick-and-place and surface mount assembly
processes. The V
•
I Chip BGA package supports in-board
mounting with a low profile of 0.16" (4 mm) over the
board. A J-lead package option supports on-board
surface mounting with a profile of only 0.25" (6 mm)
over the board. The VTM’s fast dynamic response and
low noise eliminate the need for bulk capacitance at the
load, substantially increasing the POL density while
improving reliability and decreasing cost.
Vicor Corporation
Tel: 800-735-6200
vicorpower.com
V
Voltage
Transformation
Module
048
Input Voltage
Designator
K
015
Output Voltage
Designator
(=V
OUT
x10)
T
090
Output Current
Designator
(=I
OUT
)
Configuration Options
A = On-board, elevated (Fig.16)
F = On-board (Fig.15)
K = In-board (Fig.14)
Product Grade Temperatures (°C)
Grade
Storage
Operating
T
-40 to150 -40 to125
V•I Chip Voltage Transformation Module
V048K015T090
Rev. 1.0
Page 1 of 16
Specifications
INPUT
(Conditions are at 48 Vin, full load, and 25°C ambient unless otherwise specified)
Parameter
Input voltage range
Input dV/dt
Input overvoltage turn-on
Input overvoltage turn-off
Input current
Input reflected ripple current
No load power dissipation
Internal input capacitance
Internal input inductance
Min
26
57.6
59.0
3.2
135
2.50
4
20
3.5
Typ
48
Max
55
1
Unit
Vdc
V/µs
Vdc
Vdc
Adc
mA p-p
W
µF
nH
Note
Operable down to zero V with external bias voltage
Using test circuit in Fig.17; See Fig.1
OUTPUT
(Conditions are at 48 Vin, full load, and 25°C ambient unless otherwise specified)
Parameter
Rated DC current
Peak repetitive current
DC current limit
Current share accuracy
Efficiency
Half load
Full load
Internal output inductance
Internal output capacitance
Load capacitance
Output overvoltage setpoint
Output ripple voltage
No external bypass
200 µF bypass capacitor
Effective switching frequency
Line regulation
K
Load regulation
R
OUT
Transient response
Voltage overshoot
Response time
Recovery time
92
Min
0
Typ
Max
90
135
Unit
Adc
A
Note
P
L
E
R
92.5
91.0
2.4
0.0309
93.4
91.5
1.6
306
IN
IM
108
5
126
10
Adc
%
100,000
%
%
nH
µF
µF
Vdc
62
2
2.5
1/32
1.0
20
200
1
110
2.6
0.0316
1.2
mΩ
mV
ns
µs
mV
mV
MHz
Max pulse width 1ms, max duty cycle 10%,
baseline power 50%
See Parallel Operation on page 10
Y
R
A
See Fig.3, 1.5 Vout
See Fig.3, 1.5 Vout
Effective value
1.80
See Figs.2 and 5
See Fig.6
Fixed, 1.25 MHz per phase
V
OUT
= K•V
IN
at no load
See Fig.20
90 A load step with 100 µF C
IN;
See Figs.7 and 8
See Figs.7 and 8
See Figs.7 and 8
Vicor Corporation
Tel: 800-735-6200
vicorpower.com
V•I Chip Voltage Transformation Module
V048K015T090
Rev. 1.0
Page 2 of 16
Specifications
WAVEFORMS
Output Ripple vs Load
65
60
55
50
45
40
35
30
25
20
15
10
5
0
0
10
20
30
40
50
60
70
80
90
Output Ripple (mV)
Output Current (A)
Figure 1—
Input reflected ripple current at full load and 48 Vin
Figure 2—
Output voltage ripple vs. output current at 1.5 Vout
with no POL bypass capacitance.
Efficiency vs. Output Current
95
93
91
1.6V
1.5V
1.2V
1.0V
0.8V
Power Dissipation vs. Output Current
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
0
10
20
30
40
50
60
70
80
1.5V
1.2V
1.0V
0.8V
89
87
85
83
81
79
77
75
0
10
20
30
40
50
60
70
80
90
Power Dissipation (W)
Efficiency (%)
90
Output Current (A)
Output Current (A)
Figure 3—
Efficiency vs. output current and output voltage
Figure 4—Power
dissipation as a function of output current and
output voltage
Figure 5—
Output voltage ripple at full load and 1.5 Vout;
without any external bypass capacitor.
Vicor Corporation
Tel: 800-735-6200
vicorpower.com
Figure 6—Output
voltage ripple at full load and 1.5 Vout with
200 µF ceramic external bypass capacitance and 20 nH
distribution inductance.
V048K015T090
Rev. 1.0
Page 3 of 16
V•I Chip Voltage Transformation Module
Specifications, continued
PRELIMINARY
Figure 7—
0-90 A step load change with 100 µF input
capacitance and no output capacitance.
GENERAL
Parameter
MTBF
MIL-HDBK-217F
Isolation specifications
Voltage
Capacitance
Resistance
Agency approvals (pending)
Mechanical parameters
Weight
Dimensions
Length
Width
Height
Min
Typ
3.5
2,250
2,500
10
cTÜVus
CE Mark
0.5 / 14.0
1.26 / 32
0.85 / 21.5
0.23 / 5.9
Max
Figure 8—
90-0 A step load change with 100 µF input
capacitance and no output capacitance.
Unit
Mhrs
Vdc
pF
MΩ
Note
25°C, GB
Input to Output
Input to Output
Input to Output
UL/CSA 60950, EN 60950
Low voltage directive
See mechanical drawing, Figs.10 and 12
oz / g
in / mm
in / mm
in / mm
Auxiliary Pins
(Conditions are at 48 Vin, full load, and 25°C ambient unless otherwise specified)
Parameter
Primary Control (PC)
DC voltage
Module disable voltage
Module enable voltage
Current limit
Disable delay time
Temperature Monitor (TM)
27°C setting
Temperature coefficient
Full range accuracy
Current limit
VTM Control (VC)
External boost voltage
External boost duration
Min
4.8
2.4
2.4
Typ
5.0
2.5
2.5
2.5
4
3.00
10
±5
100
12.0
14.0
10
19.0
Max
5.2
2.6
2.9
10
Unit
Vdc
Vdc
Vdc
mA
µs
Vdc
mV/°C
°C
µA
Vdc
ms
Note
Source only
PC low to Vout low
Operating junction temperature
Operating junction temperature
Source only
Required for VTM start up without PRM
Vin must be >26 V for VTM to remain operating
without boost voltage.
Vicor Corporation
Tel: 800-735-6200
vicorpower.com
V•I Chip Voltage Transformation Module
V048K015T090
Rev. 1.0
Page 4 of 16
Specifications, continued
THERMAL
Symbol
Parameter
Over temperature shutdown
Thermal capacity
Junction-to-case thermal impedance
Junction-to-BGA thermal impedance
Junction-to-ambient
1
Junction-to-ambient
2
Min
125
Typ
130
0.61
1.1
2.1
6.5
5.0
Max
135
Unit
°C
Ws/°C
°C/W
°C/W
°C/W
°C/W
Note
Junction temperature
R
θJC
R
θJB
R
θJA
R
θJA
Notes
1. V048K015T090 surface mounted in-board to a 2" x 2" FR4 board, 4 layers 2 oz Cu, 300 LFM.
2. V048K015T090 with optional 0.25"H Pin Fins surface mounted on FR4 board, 300 LFM.
V•I CHIP STRESS DRIVEN PRODUCT QUALIFICATION PROCESS
Test
High Temperature Operational Life (HTOL)
Temperature cycling
High temperature storage
Moisture resistance
Temperature Humidity Bias Testing (THB)
Pressure cooker testing (Autoclave)
Highly Accelerated Stress Testing (HAST)
Solvent resistance/marking permanency
Mechanical vibration
Mechanical shock
Electro static discharge testing – human body model
Electro static discharge testing – machine model
Standard
JESD22-A-108-B
JESD22-A-104B
JESD22-A-103A
JESD22-A113-B
EIA/JESD22-A-101-B
JESD22-A-102-C
JESD22-A-110B
JESD22-B-107-A
JESD22-B-103-A
JESD22-B-104-A
EIA/JESD22-A114-A
EIA/JESD22-A115-A
Per Vicor Internal
Test Specification*
Per Vicor internal
test specification*
P
L
E
R
IN
IM
Environment
125°C, Vmax, 1,008 hrs
-55°C to 125°C, 1,000 cycles
150°C, 1,000 hrs
Moisture sensitivity Level 5
85°C, 85% RH, Vmax, 1,008 hrs
121°C, 100% RH, 15 PSIG, 96 hrs
130°C, 85% RH, Vmax, 96 hrs
Solvents A, B & C as defined
20g peak, 20-2,000 Hz, test in X, Y & Z directions
1,500g peak 0.5 ms pulse duration, 5 pulses in 6 directions
Meets or exceeds 2,000 Volts
Meets or exceeds 200 Volts
Operation limits verified, destruct margin determined
Constant line, 0-100% load,
-20°C to 125°C
Y
R
A
Highly Accelerated Life Testing (HALT)
Dynamic cycling
*
For details of the test protocols see Vicor’s website.
V•I CHIP BALL GRID ARRAY INTERCONNECT QUALIFICATION
Test
BGA solder fatigue evaluation
Solder ball shear test
Standard
IPC-9701
IPC-SM-785
IPC-9701
Environment
Cycle condition: TC3 (-40 to +125°C)
Test duration: NTC-B (500 failure free cycles)
Failure through bulk solder or copper pad lift-off
Vicor Corporation
Tel: 800-735-6200
vicorpower.com
V•I Chip Voltage Transformation Module
V048K015T090
Rev. 1.0
Page 5 of 16
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